LFXP2-30E-5FTN256I

The LFXP2-30E-5FTN256I is an XP2 Field Programmable Gate Array (FPGA) IC offering 29,000 logic elements, approximately 0.396 Mbits of embedded memory, and 201 user I/Os in a 256-LBGA package. It is supplied for surface-mount assembly with a supplier device package of 256-FTBGA (17×17) and is specified for industrial-grade operation.

With a core supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C, this device targets designs that require reconfigurable logic capacity, substantial I/O count, and an industrial temperature specification.

Key Features

• Core Logic  29,000 logic elements for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 0.396 Mbits (396,288 bits) of on-chip RAM for buffering and small data storage.
• I/O Capacity  201 user I/Os to support multiple interfaces and peripheral connections.
• Package and Mounting  256-LBGA (supplier package: 256-FTBGA, 17×17) in a surface-mount form factor for compact PCB integration.
• Power  Core voltage supply specified between 1.14 V and 1.26 V to align with targeted power domain designs.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for use in thermally demanding environments.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control and Automation  Implement custom control and I/O aggregation where industrial temperature range and a high I/O count are required.
• Interface Bridging and Glue Logic  Use the device’s 29,000 logic elements and 201 I/Os to build custom protocol translators and interface glue logic.
• Prototyping and System Integration  Employ the reprogrammable logic and compact 256-LBGA surface-mount package for prototyping and compact system designs.

Unique Advantages

• High logic capacity: 29,000 logic elements provide substantial resources for implementing complex state machines, control logic, and custom datapaths.
• Ample I/O availability: 201 user I/Os reduce the need for external multiplexers or expanders when interfacing with sensors, peripherals, and buses.
• Integrated on-chip RAM: Approximately 0.396 Mbits of embedded memory for local buffering and small lookup tables without external memory.
• Industrial-grade thermal range: Specified operation from −40 °C to 100 °C supports deployment in harsher environments.
• Compact surface-mount package: 256-LBGA (256-FTBGA, 17×17) enables dense PCB layouts while maintaining robust connectivity.
• RoHS compliant: Meets lead-free and hazardous-substance requirements for modern manufacturing processes.

Why Choose LFXP2-30E-5FTN256I?

The LFXP2-30E-5FTN256I combines sizable reconfigurable logic resources with a high I/O count and on-chip memory in a compact 256-LBGA surface-mount package. Its specified core voltage range and industrial temperature rating make it suitable for designs that require reliable operation across a wide thermal range while maintaining targeted power-domain constraints.

This device is well suited to engineers and procurement teams seeking a configurable, industrial-grade FPGA building block for designs that demand moderate logic density, extensive I/O, and compact PCB integration. Its combination of features supports scalable system designs and streamlined BOMs by reducing the need for external glue logic and discrete memory in many applications.

If you would like pricing, lead-time, or a formal quote for LFXP2-30E-5FTN256I, please submit a request or contact sales to receive a quote tailored to your volume and delivery requirements.