LFXP2-30E-5FT256C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 201 396288 29000 256-LBGA |
|---|---|
| Quantity | 193 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 201 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3625 | Number of Logic Elements/Cells | 29000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 396288 |
Overview of LFXP2-30E-5FT256C – XP2 Field Programmable Gate Array, 256-LBGA, 201 I/O
The LFXP2-30E-5FT256C is an XP2 family FPGA that combines a LUT-based programmable fabric with non-volatile flexiFLASH architecture. It delivers 29,000 logic elements, a broad I/O count and on-chip memory to support reconfigurable embedded designs in commercial-temperature applications.
Designed for applications that require instant-on reconfiguration, integrated DSP resources and flexible I/O standards, this device targets systems needing performance, secure update capability and compact BGA packaging.
Key Features
- Core Logic 29,000 logic elements suitable for mid-density FPGA functions and custom digital logic implementation.
- Embedded Memory Approximately 0.396 Mbits of on-chip RAM (396,288 total bits) for storage of buffers, state and small embedded data sets.
- DSP Resources sysDSP blocks (family XP2-30 configuration) providing multiple dedicated multiply-accumulate units and up to 28 18×18 multipliers for math- and signal-processing tasks.
- I/O and Interfaces 201 user I/O pins with support for a wide range of source-synchronous and high-speed interface options as defined by the XP2 family.
- Configuration & Security flexiFLASH architecture with instant-on and Live Update technologies including TransFR and secure updates with 128-bit AES encryption and dual-boot capability.
- Clocking Up to four analog PLLs per device (sysCLOCK) to support clock multiply/divide and phase shifting for system timing needs.
- Power Supply voltage range of 1.14 V to 1.26 V aligned with the device family requirements.
- Package & Mounting 256-ball LBGA / ftBGA package (17 × 17 mm supplier package), surface-mount mounting for compact PCB integration.
- Operating Range & Compliance Commercial temperature grade with specified operating range 0 °C to 85 °C and RoHS compliance.
Typical Applications
- Display and Video Interfaces Support for high-speed serial and LVDS-style source-synchronous interfaces makes the device suitable for display controllers and video preprocessing tasks.
- Memory Interfaces Pre-engineered DDR/DDR2 interface support enables implementation of external memory controllers and buffer logic for embedded systems.
- Signal Processing sysDSP blocks and multiple 18×18 multipliers are suited to DSP tasks such as filtering, data aggregation and real-time math operations.
- Secure Field Updates On-chip flexiFLASH with Live Update and 128-bit AES encryption supports secure firmware or configuration updates and dual-boot strategies.
Unique Advantages
- Integrated Non-Volatile Architecture flexiFLASH provides instant-on capability and on-chip non-volatile storage, removing the need for external configuration memory for many designs.
- Mid-Density Logic with High I/O Count 29,000 logic elements combined with 201 I/Os supports complex glue logic, interface bridging and moderate- to high-pin-count system integration in a single device.
- Dedicated DSP Fraction sysDSP blocks and numerous hardware multipliers accelerate arithmetic-heavy functions while offloading tasks from the main logic fabric.
- Flexible Clocking and Interfaces Multiple PLLs and pre-engineered source-synchronous interfaces simplify timing management and high-speed link implementation.
- Security and Live Update Built-in support for secure updates (128-bit AES) and dual-boot provides an architecture for safe field upgrades and design protection.
- Compact, Surface-Mount Packaging 256-ball ftBGA (17×17 mm) enables dense PCB integration for space-constrained designs.
Why Choose LFXP2-30E-5FT256C?
The LFXP2-30E-5FT256C positions itself as a flexible, mid-density FPGA solution for commercial embedded applications that require instant-on reconfigurability, integrated DSP resources and secure update capability. Its combination of 29,000 logic elements, approximately 0.396 Mbits of embedded RAM and 201 I/Os makes it suitable for system-level integration where both logic density and I/O count are important.
For design teams seeking a commercially graded, RoHS-compliant FPGA with on-chip non-volatile storage, multiple PLLs and DSP acceleration, this XP2 variant offers a balance of performance, integration and security features aligned to a variety of embedded and interface-centric applications.
Request a quote or submit a procurement inquiry to receive pricing and lead-time information for the LFXP2-30E-5FT256C.

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