LFXP2-30E-5FT256C

IC FPGA 201 I/O 256FTBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 201 396288 29000 256-LBGA

Quantity 193 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O201Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3625Number of Logic Elements/Cells29000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits396288

Overview of LFXP2-30E-5FT256C – XP2 Field Programmable Gate Array, 256-LBGA, 201 I/O

The LFXP2-30E-5FT256C is an XP2 family FPGA that combines a LUT-based programmable fabric with non-volatile flexiFLASH architecture. It delivers 29,000 logic elements, a broad I/O count and on-chip memory to support reconfigurable embedded designs in commercial-temperature applications.

Designed for applications that require instant-on reconfiguration, integrated DSP resources and flexible I/O standards, this device targets systems needing performance, secure update capability and compact BGA packaging.

Key Features

  • Core Logic  29,000 logic elements suitable for mid-density FPGA functions and custom digital logic implementation.
  • Embedded Memory  Approximately 0.396 Mbits of on-chip RAM (396,288 total bits) for storage of buffers, state and small embedded data sets.
  • DSP Resources  sysDSP blocks (family XP2-30 configuration) providing multiple dedicated multiply-accumulate units and up to 28 18×18 multipliers for math- and signal-processing tasks.
  • I/O and Interfaces  201 user I/O pins with support for a wide range of source-synchronous and high-speed interface options as defined by the XP2 family.
  • Configuration & Security  flexiFLASH architecture with instant-on and Live Update technologies including TransFR and secure updates with 128-bit AES encryption and dual-boot capability.
  • Clocking  Up to four analog PLLs per device (sysCLOCK) to support clock multiply/divide and phase shifting for system timing needs.
  • Power  Supply voltage range of 1.14 V to 1.26 V aligned with the device family requirements.
  • Package & Mounting  256-ball LBGA / ftBGA package (17 × 17 mm supplier package), surface-mount mounting for compact PCB integration.
  • Operating Range & Compliance  Commercial temperature grade with specified operating range 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • Display and Video Interfaces  Support for high-speed serial and LVDS-style source-synchronous interfaces makes the device suitable for display controllers and video preprocessing tasks.
  • Memory Interfaces  Pre-engineered DDR/DDR2 interface support enables implementation of external memory controllers and buffer logic for embedded systems.
  • Signal Processing  sysDSP blocks and multiple 18×18 multipliers are suited to DSP tasks such as filtering, data aggregation and real-time math operations.
  • Secure Field Updates  On-chip flexiFLASH with Live Update and 128-bit AES encryption supports secure firmware or configuration updates and dual-boot strategies.

Unique Advantages

  • Integrated Non-Volatile Architecture  flexiFLASH provides instant-on capability and on-chip non-volatile storage, removing the need for external configuration memory for many designs.
  • Mid-Density Logic with High I/O Count  29,000 logic elements combined with 201 I/Os supports complex glue logic, interface bridging and moderate- to high-pin-count system integration in a single device.
  • Dedicated DSP Fraction  sysDSP blocks and numerous hardware multipliers accelerate arithmetic-heavy functions while offloading tasks from the main logic fabric.
  • Flexible Clocking and Interfaces  Multiple PLLs and pre-engineered source-synchronous interfaces simplify timing management and high-speed link implementation.
  • Security and Live Update  Built-in support for secure updates (128-bit AES) and dual-boot provides an architecture for safe field upgrades and design protection.
  • Compact, Surface-Mount Packaging  256-ball ftBGA (17×17 mm) enables dense PCB integration for space-constrained designs.

Why Choose LFXP2-30E-5FT256C?

The LFXP2-30E-5FT256C positions itself as a flexible, mid-density FPGA solution for commercial embedded applications that require instant-on reconfigurability, integrated DSP resources and secure update capability. Its combination of 29,000 logic elements, approximately 0.396 Mbits of embedded RAM and 201 I/Os makes it suitable for system-level integration where both logic density and I/O count are important.

For design teams seeking a commercially graded, RoHS-compliant FPGA with on-chip non-volatile storage, multiple PLLs and DSP acceleration, this XP2 variant offers a balance of performance, integration and security features aligned to a variety of embedded and interface-centric applications.

Request a quote or submit a procurement inquiry to receive pricing and lead-time information for the LFXP2-30E-5FT256C.

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