LFXP2-30E-5FN484C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 363 396288 29000 484-BBGA |
|---|---|
| Quantity | 959 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 363 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3625 | Number of Logic Elements/Cells | 29000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 396288 |
Overview of LFXP2-30E-5FN484C – XP2 Field Programmable Gate Array (FPGA) IC 363 I/O, ~0.387 Mbits RAM, 29,000 Logic Elements, 484-BBGA
The LFXP2-30E-5FN484C is a flash-based LatticeXP2 FPGA offering a balance of mid-range logic density, on-chip memory, DSP resources, and a high I/O count in a compact 484-ball fpBGA package. Its flexiFLASH architecture provides instant-on, reconfigurable operation with embedded non-volatile storage and design security features.
Targeted for embedded systems and commercial electronic designs that require moderate logic capacity, multiple high-speed interfaces and on-chip DSP acceleration, this device delivers integrated configuration, memory and DSP resources while operating within a low-voltage supply range.
Key Features
- Core Logic — 29,000 logic elements provide a mid-density FPGA fabric suitable for a wide range of control, glue-logic and data-path functions.
- Embedded Memory — Approximately 0.387 Mbits of on-chip RAM (396,288 total bits) for embedded SRAM needs and distributed RAM usage.
- sysDSP Blocks & Multipliers — Device family sysDSP resources include multiple blocks and support for 18×18 multipliers to accelerate multiply-accumulate operations.
- I/O Flexibility — 363 I/O pins supported in the 484-ball fpBGA package; sysIO buffer family supports a variety of standards for source-synchronous and high-speed interfaces.
- Flash-based Configuration (flexiFLASH) — Instant-on, single-chip flash configuration with on-chip FlashBAK and Serial TAG memory for stored images and design security.
- Live Update & Security — Live Update technology with TransFR and 128-bit AES encryption support for secure updates and dual-boot capability.
- Clocking — Multiple analog PLLs (sysCLOCK) enable clock multiplication, division and phase shifting to support diverse timing requirements.
- Power — Operates from a 1.14 V to 1.26 V supply range, consistent with a 1.2 V core supply requirement.
- Package & Mounting — 484-ball fpBGA (23 × 23 mm) surface-mount package suitable for compact board designs.
- Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature; RoHS compliant.
Typical Applications
- Display and Video Interfaces — Pre-engineered 7:1 LVDS and other source-synchronous interface support makes the device suitable for display timing and interface bridging.
- Memory Interface Controllers — Support for DDR/DDR2 source-synchronous interfaces (up to 200 MHz) enables implementation of memory controllers and buffering logic.
- Signal Processing and Sensor Aggregation — On-chip sysDSP blocks and multiple multipliers accelerate multiply-accumulate workloads for sensor fusion and mid-range signal processing.
- Embedded System Glue Logic — High I/O count and flexible I/O standards allow consolidation of peripheral interfaces, bus bridging and control logic in compact systems.
Unique Advantages
- Integrated Non-Volatile Configuration: flexiFLASH architecture delivers instant-on operation and embedded flash storage, simplifying boot and configuration flows.
- Secure Live Updates: Built-in Live Update features with 128-bit AES support enable secure firmware updates and dual-boot image strategies.
- Balanced Compute and Memory: 29,000 logic elements combined with approximately 0.387 Mbits of embedded RAM provide a well-rounded resource mix for mid-density designs.
- High I/O Density in Compact Package: 363 I/Os in a 23 × 23 mm 484-ball fpBGA package reduce board area while supporting multiple external interfaces.
- DSP Acceleration: Multiple sysDSP blocks and dedicated multipliers speed up arithmetic-intensive functions without external accelerators.
- Design Ecosystem Support: Lattice’s design flow and pre-engineered IP enable efficient implementation and faster time to prototype.
Why Choose LFXP2-30E-5FN484C?
The LFXP2-30E-5FN484C positions itself as a versatile, flash-configured FPGA for commercial embedded applications that require instant-on configuration, secure update capabilities and a mix of logic, memory and DSP resources. Its combination of 29,000 logic elements, substantial on-chip RAM, multiple DSP blocks and 363 I/Os in a compact fpBGA package makes it suitable for mid-range processing, interface bridging and control applications.
Designers benefit from the integrated configuration architecture, built-in security options and Lattice design ecosystem, enabling scalable deployments and straightforward migration within the LatticeXP2 family for evolving product requirements.
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