LFXP2-30E-5FN484C

IC FPGA 363 I/O 484FBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 363 396288 29000 484-BBGA

Quantity 959 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O363Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3625Number of Logic Elements/Cells29000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits396288

Overview of LFXP2-30E-5FN484C – XP2 Field Programmable Gate Array (FPGA) IC 363 I/O, ~0.387 Mbits RAM, 29,000 Logic Elements, 484-BBGA

The LFXP2-30E-5FN484C is a flash-based LatticeXP2 FPGA offering a balance of mid-range logic density, on-chip memory, DSP resources, and a high I/O count in a compact 484-ball fpBGA package. Its flexiFLASH architecture provides instant-on, reconfigurable operation with embedded non-volatile storage and design security features.

Targeted for embedded systems and commercial electronic designs that require moderate logic capacity, multiple high-speed interfaces and on-chip DSP acceleration, this device delivers integrated configuration, memory and DSP resources while operating within a low-voltage supply range.

Key Features

  • Core Logic — 29,000 logic elements provide a mid-density FPGA fabric suitable for a wide range of control, glue-logic and data-path functions.
  • Embedded Memory — Approximately 0.387 Mbits of on-chip RAM (396,288 total bits) for embedded SRAM needs and distributed RAM usage.
  • sysDSP Blocks & Multipliers — Device family sysDSP resources include multiple blocks and support for 18×18 multipliers to accelerate multiply-accumulate operations.
  • I/O Flexibility — 363 I/O pins supported in the 484-ball fpBGA package; sysIO buffer family supports a variety of standards for source-synchronous and high-speed interfaces.
  • Flash-based Configuration (flexiFLASH) — Instant-on, single-chip flash configuration with on-chip FlashBAK and Serial TAG memory for stored images and design security.
  • Live Update & Security — Live Update technology with TransFR and 128-bit AES encryption support for secure updates and dual-boot capability.
  • Clocking — Multiple analog PLLs (sysCLOCK) enable clock multiplication, division and phase shifting to support diverse timing requirements.
  • Power — Operates from a 1.14 V to 1.26 V supply range, consistent with a 1.2 V core supply requirement.
  • Package & Mounting — 484-ball fpBGA (23 × 23 mm) surface-mount package suitable for compact board designs.
  • Commercial Temperature Grade — Rated for 0 °C to 85 °C operating temperature; RoHS compliant.

Typical Applications

  • Display and Video Interfaces — Pre-engineered 7:1 LVDS and other source-synchronous interface support makes the device suitable for display timing and interface bridging.
  • Memory Interface Controllers — Support for DDR/DDR2 source-synchronous interfaces (up to 200 MHz) enables implementation of memory controllers and buffering logic.
  • Signal Processing and Sensor Aggregation — On-chip sysDSP blocks and multiple multipliers accelerate multiply-accumulate workloads for sensor fusion and mid-range signal processing.
  • Embedded System Glue Logic — High I/O count and flexible I/O standards allow consolidation of peripheral interfaces, bus bridging and control logic in compact systems.

Unique Advantages

  • Integrated Non-Volatile Configuration: flexiFLASH architecture delivers instant-on operation and embedded flash storage, simplifying boot and configuration flows.
  • Secure Live Updates: Built-in Live Update features with 128-bit AES support enable secure firmware updates and dual-boot image strategies.
  • Balanced Compute and Memory: 29,000 logic elements combined with approximately 0.387 Mbits of embedded RAM provide a well-rounded resource mix for mid-density designs.
  • High I/O Density in Compact Package: 363 I/Os in a 23 × 23 mm 484-ball fpBGA package reduce board area while supporting multiple external interfaces.
  • DSP Acceleration: Multiple sysDSP blocks and dedicated multipliers speed up arithmetic-intensive functions without external accelerators.
  • Design Ecosystem Support: Lattice’s design flow and pre-engineered IP enable efficient implementation and faster time to prototype.

Why Choose LFXP2-30E-5FN484C?

The LFXP2-30E-5FN484C positions itself as a versatile, flash-configured FPGA for commercial embedded applications that require instant-on configuration, secure update capabilities and a mix of logic, memory and DSP resources. Its combination of 29,000 logic elements, substantial on-chip RAM, multiple DSP blocks and 363 I/Os in a compact fpBGA package makes it suitable for mid-range processing, interface bridging and control applications.

Designers benefit from the integrated configuration architecture, built-in security options and Lattice design ecosystem, enabling scalable deployments and straightforward migration within the LatticeXP2 family for evolving product requirements.

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