LFXP2-30E-5F672C

The LFXP2-30E-5F672C is a flash-based Field Programmable Gate Array (FPGA) featuring Lattice’s flexiFLASH architecture and a LUT-based FPGA fabric. It combines reconfigurable logic, embedded memory and dedicated DSP resources in a single 672-ball fpBGA package, targeting commercial electronic designs that require configurable I/O density, on-chip memory and DSP acceleration.

Key Features

• Logic Capacity — Approximately 29,000 logic elements for implementing complex digital functions and custom logic pipelines.
• Embedded Memory — Total on-chip RAM of 396,288 bits (approximately 0.396 Mbits) to support frame buffers, FIFOs and state storage.
• sysDSP and Multipliers — Family-level sysDSP resources and dedicated multipliers support high-performance multiply-accumulate operations for signal processing and data-path acceleration.
• I/O Flexibility — Up to 472 user I/Os provided by the 672-ball fpBGA package, enabling wide parallel interfaces and mixed-signal I/O scenarios.
• Non-volatile flexiFLASH Architecture — Instant-on, reconfigurable flash-based configuration with design security and support for Live Update features described for the XP2 family.
• Power Supply — Operates from a nominal supply window of 1.14 V to 1.26 V, consistent with low-voltage FPGA system designs.
• Package & Mounting — 672-FPBGA (27 × 27 mm) surface-mount package for high-pin-count, compact board designs; commercial grade with 0 °C to 85 °C operating range.
• RoHS Compliant — Conforms to RoHS requirements for lead-free assembly and regulatory compliance in commercial applications.

Typical Applications

• Display and Video Interfaces — High I/O count and source-synchronous interface support make this device suitable for display front-ends and video pipeline control.
• Signal Processing — sysDSP blocks and hardware multipliers enable accelerated filtering, transforms and real-time data-path processing.
• Memory and Interface Bridging — On-chip RAM and flexible I/O facilitate DDR/parallel memory interfacing and protocol bridging in embedded systems.
• Custom Logic and Control — Reconfigurable LUT fabric allows implementation of control logic, state machines and glue logic for varied commercial electronics.

Unique Advantages

• Flash-based Instant-On: flexiFLASH architecture provides non-volatile configuration for immediate start-up and field reconfigurability.
• High I/O Density: 472 available I/Os in a 672-ball fpBGA package enables wide external connectivity without large board footprints.
• Integrated DSP Resources: Dedicated sysDSP blocks and multipliers reduce the need for external processors for common signal-processing tasks.
• Compact, Surface-Mount Package: 27 × 27 mm 672-FPBGA package supports dense, production-friendly PCB layouts.
• Commercial‑Grade Thermal Range: Rated for 0 °C to 85 °C operation to match typical commercial embedded product environments.
• Regulatory Conformance: RoHS compliance supports modern assembly and environmental requirements.

Why Choose LFXP2-30E-5F672C?

The LFXP2-30E-5F672C delivers a balanced combination of reconfigurable logic, embedded memory and DSP capability in a high-pin-count fpBGA package. Its flash-based configuration and substantial I/O count make it well suited for commercial embedded designs that demand flexible interfaces, on-chip data buffering and hardware-accelerated signal processing.

Engineers designing mid- to high-density FPGA solutions can leverage the device’s non-volatile configuration, integrated DSP resources and compact package to reduce system BOM and simplify board-level integration while maintaining the flexibility of field reconfiguration.

Request a quote or submit an inquiry for pricing and availability to evaluate the LFXP2-30E-5F672C for your next design.