LFXP2-30E-5FN484I

The LFXP2-30E-5FN484I is an industrial-grade FPGA IC from the LatticeXP2 family. It pairs a LUT-based programmable fabric with flash-based configuration (flexiFLASH) and on-chip non-volatile features to deliver instant-on, reconfigurable logic for embedded and industrial systems.

With 29,000 logic elements, 363 user I/Os, and approximately 0.396 Mbits (396,288 bits) of on-chip RAM, this device targets I/O-dense, compute-accelerated and field-upgradeable applications where secure updates, compact packaging and wide operating temperature range matter.

Key Features

• Core Architecture  29,000 logic elements in a LUT-based FPGA fabric optimized for reconfigurable logic implementation.
• On-chip Memory  Approximately 0.396 Mbits (396,288 bits) of embedded RAM for buffering, state storage and small working datasets.
• sysDSP and Multipliers  Family-level sysDSP blocks and dedicated multipliers provide hardware-accelerated multiply-accumulate capability for signal processing workloads.
• I/O Density & Flexibility  363 user I/Os with flexible sysIO buffers supporting standards commonly used in system interfaces and source-synchronous designs.
• Configuration & Secure Updates  flexiFLASH architecture with FlashBAK, Serial TAG memory, Live Update technology (TransFR), 128-bit AES encryption and dual-boot support for secure, fieldable design updates.
• Clocking  Analog PLL support for clock multiplication, division and phase shifting to manage multi-clock systems.
• Power  Designed for operation with a VCC supply in the range 1.14 V to 1.26 V (nominal 1.2 V).
• Package & Mounting  484-ball fpBGA package (484-FPBGA, 23 × 23 mm) in a surface-mount form factor; package case listed as 484-BBGA.
• Industrial Grade & Temperature  Rated for industrial operation with an operating temperature range of −40 °C to 100 °C.
• RoHS Compliant  Meets RoHS environmental compliance requirements.

Typical Applications

• Industrial Control & Automation  I/O-dense designs and control systems that require industrial temperature range and flexible logic for custom I/O handling and protocol bridging.
• High-Performance Signal Processing  Hardware-accelerated DSP blocks and multipliers enable real-time signal processing, filtering and accumulation tasks.
• Memory and Interface Bridging  Pre-engineered source-synchronous interfaces and flexible I/O support make the device suitable for DDR/DDR2 interfaces, display links and high-speed board-level bridging.
• Field-Upgradable Embedded Systems  flexiFLASH and Live Update technologies allow secure firmware updates and dual-boot deployment for systems requiring in-field reconfiguration and secure update mechanisms.

Unique Advantages

• Flash-based Instant-On  flexiFLASH architecture enables instant-on behavior and non-volatile configuration storage for faster system start-up.
• High I/O Count in a Compact Package  363 I/Os in a 23 × 23 mm fpBGA provides a dense I/O footprint while minimizing PCB area.
• DSP-Ready Fabric  sysDSP blocks and dedicated multipliers reduce reliance on external ASICs or processors for multiply-accumulate and signal-processing tasks.
• Secure Field Updates  Live Update and 128-bit AES encryption support secure over-the-air or in-field update strategies and dual-boot resilience.
• Industrial Reliability  Industrial grading and −40 °C to 100 °C operating range support deployment in demanding environments.
• Design Flexibility  Surface-mount fpBGA packaging and a broad I/O standard set enable integration into a wide range of embedded system form factors.

Why Choose LFXP2-30E-5FN484I?

The LFXP2-30E-5FN484I positions itself as a balanced solution for designers who need substantial logic capacity, a high I/O count and secure, flash-based configurability in an industrial-grade FPGA. It combines on-chip memory, DSP capability and flexible I/O in a compact surface-mount fpBGA package, enabling robust embedded and control-system designs.

Ideal for engineering teams delivering field-upgradable industrial systems, interface bridging, and DSP-accelerated functionality, this device provides a clear path for scalable designs backed by the LatticeXP2 family architecture and configuration feature set.

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