LFXP2-30E-5FN484I
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 363 396288 29000 484-BBGA |
|---|---|
| Quantity | 572 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 363 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 3625 | Number of Logic Elements/Cells | 29000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 396288 |
Overview of LFXP2-30E-5FN484I – XP2 Field Programmable Gate Array (FPGA)
The LFXP2-30E-5FN484I is an industrial-grade FPGA IC from the LatticeXP2 family. It pairs a LUT-based programmable fabric with flash-based configuration (flexiFLASH) and on-chip non-volatile features to deliver instant-on, reconfigurable logic for embedded and industrial systems.
With 29,000 logic elements, 363 user I/Os, and approximately 0.396 Mbits (396,288 bits) of on-chip RAM, this device targets I/O-dense, compute-accelerated and field-upgradeable applications where secure updates, compact packaging and wide operating temperature range matter.
Key Features
- Core Architecture 29,000 logic elements in a LUT-based FPGA fabric optimized for reconfigurable logic implementation.
- On-chip Memory Approximately 0.396 Mbits (396,288 bits) of embedded RAM for buffering, state storage and small working datasets.
- sysDSP and Multipliers Family-level sysDSP blocks and dedicated multipliers provide hardware-accelerated multiply-accumulate capability for signal processing workloads.
- I/O Density & Flexibility 363 user I/Os with flexible sysIO buffers supporting standards commonly used in system interfaces and source-synchronous designs.
- Configuration & Secure Updates flexiFLASH architecture with FlashBAK, Serial TAG memory, Live Update technology (TransFR), 128-bit AES encryption and dual-boot support for secure, fieldable design updates.
- Clocking Analog PLL support for clock multiplication, division and phase shifting to manage multi-clock systems.
- Power Designed for operation with a VCC supply in the range 1.14 V to 1.26 V (nominal 1.2 V).
- Package & Mounting 484-ball fpBGA package (484-FPBGA, 23 × 23 mm) in a surface-mount form factor; package case listed as 484-BBGA.
- Industrial Grade & Temperature Rated for industrial operation with an operating temperature range of −40 °C to 100 °C.
- RoHS Compliant Meets RoHS environmental compliance requirements.
Typical Applications
- Industrial Control & Automation I/O-dense designs and control systems that require industrial temperature range and flexible logic for custom I/O handling and protocol bridging.
- High-Performance Signal Processing Hardware-accelerated DSP blocks and multipliers enable real-time signal processing, filtering and accumulation tasks.
- Memory and Interface Bridging Pre-engineered source-synchronous interfaces and flexible I/O support make the device suitable for DDR/DDR2 interfaces, display links and high-speed board-level bridging.
- Field-Upgradable Embedded Systems flexiFLASH and Live Update technologies allow secure firmware updates and dual-boot deployment for systems requiring in-field reconfiguration and secure update mechanisms.
Unique Advantages
- Flash-based Instant-On flexiFLASH architecture enables instant-on behavior and non-volatile configuration storage for faster system start-up.
- High I/O Count in a Compact Package 363 I/Os in a 23 × 23 mm fpBGA provides a dense I/O footprint while minimizing PCB area.
- DSP-Ready Fabric sysDSP blocks and dedicated multipliers reduce reliance on external ASICs or processors for multiply-accumulate and signal-processing tasks.
- Secure Field Updates Live Update and 128-bit AES encryption support secure over-the-air or in-field update strategies and dual-boot resilience.
- Industrial Reliability Industrial grading and −40 °C to 100 °C operating range support deployment in demanding environments.
- Design Flexibility Surface-mount fpBGA packaging and a broad I/O standard set enable integration into a wide range of embedded system form factors.
Why Choose LFXP2-30E-5FN484I?
The LFXP2-30E-5FN484I positions itself as a balanced solution for designers who need substantial logic capacity, a high I/O count and secure, flash-based configurability in an industrial-grade FPGA. It combines on-chip memory, DSP capability and flexible I/O in a compact surface-mount fpBGA package, enabling robust embedded and control-system designs.
Ideal for engineering teams delivering field-upgradable industrial systems, interface bridging, and DSP-accelerated functionality, this device provides a clear path for scalable designs backed by the LatticeXP2 family architecture and configuration feature set.
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