LFXP2-30E-5FT256I

The LFXP2-30E-5FT256I is a LatticeXP2 family FPGA optimized for reconfigurable logic and embedded processing. It combines non-volatile flash-based configuration architecture with FPGA fabric to deliver instant-on, infinitely reconfigurable designs for industrial applications.

Designed for systems that need a balance of logic capacity, embedded memory, DSP resources and flexible I/O, this device targets applications that require reliable operation over a wide temperature and supply range while minimizing system BOM and configuration complexity.

Key Features

• Logic Capacity — 29,000 logic elements (cells) to implement medium-density logic and control functions.
• Embedded Memory — Total on-chip RAM of 396,288 bits (approximately 0.396 Mbits) for distributed and embedded storage.
• sysDSP and Multipliers — LatticeXP2 family sysDSP resources and multiple 18×18 multipliers (device family data indicates up to 28 for XP2-30) to accelerate multiply-accumulate and DSP workloads.
• Flexible I/O — Up to 201 user I/Os in the 256-ball ftBGA footprint; supports a variety of signaling standards as provided by the family architecture.
• Clocking — On-chip PLLs (family specification includes up to four PLLs for XP2-30) for clock multiply/divide and phase shifting.
• Configuration and Security — Flash-based flexiFLASH architecture delivers instant-on and reconfigurability with family features for secure updates and dual-boot support.
• Package and Mounting — Supplied in a 256-LBGA / 256-FTBGA (17×17 mm) package; surface mount for compact board implementation.
• Power and Temperature — Operating supply range 1.14 V to 1.26 V and industrial temperature rating from −40°C to 100°C.
• Regulatory — RoHS compliant.

Typical Applications

• Display and Imaging — Use the device’s source-synchronous I/O and LVDS support for display interfaces and image data transport.
• Embedded Signal Processing — Leverage sysDSP blocks and 18×18 multipliers for filtering, FFTs, and real-time numeric processing tasks.
• High-speed Memory Interfaces — Implement DDR/DDR2 interfaces and source-synchronous links for board-level memory subsystems and high-throughput data paths.
• Industrial Control — Industrial-grade temperature range and robust I/O count make this FPGA suitable for motor control, sensor aggregation, and machine control logic.

Unique Advantages

• Instant-on, Reconfigurable Architecture — Flash-based flexiFLASH configuration enables instant-on behavior and the ability to reconfigure the device in-system.
• Balanced Resource Mix — Combines ~29,000 logic elements with embedded memory and DSP blocks to consolidate control, interface, and processing functions on a single device.
• Flexible I/O and Clocking — Up to 201 I/Os and multiple PLLs provide the flexibility to implement diverse board-level interfaces and precise clocking schemes.
• Industrial Temperature Range — Rated for −40°C to 100°C operation to meet many industrial deployment requirements.
• Compact, Surface-Mount Package — 256-ball FTBGA/LBGA package offers a small footprint for space-constrained designs while providing a high I/O count.
• RoHS Compliance — Meets lead-free manufacturing requirements for modern production workflows.

Why Choose LFXP2-30E-5FT256I?

The LFXP2-30E-5FT256I delivers a practical balance of programmable logic, embedded memory, DSP capability and flexible I/O in a compact 256-ball package. Its flash-based configuration architecture and industrial temperature rating make it well suited to industrial systems that require instant-on behavior, in-field reconfiguration and consistent operation across temperature extremes.

This device is ideal for engineers designing mid-density FPGA solutions that consolidate control, signal processing and interface functions, with the long-term value of reconfigurability and family-level ecosystem support for migration and IP reuse.

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