LFXP2-30E-5FN672C

The LFXP2-30E-5FN672C is an XP2-series FPGA offering a flexiFLASH architecture that combines LUT-based logic fabric with on-chip non-volatile configuration. Designed for commercial applications, this device delivers approximately 29,000 logic elements, extensive on-chip RAM, and a high-density 672-ball fpBGA package to support complex glue‑logic, high‑I/O and embedded processing tasks.

Key value comes from integrated configuration and security features, DSP resources for multiply-accumulate workloads, and a large I/O count for multi-channel interfaces and memory connectivity.

Key Features

• Core Logic  Approximately 29,000 logic elements to implement mid-range FPGA designs and complex glue logic.
• On-chip Memory  Total RAM of 396,288 bits (approximately 387 Kbits of embedded RAM) for embedded storage and buffering.
• sysDSP Blocks & Multipliers  Includes sysDSP resources with seven sysDSP blocks and 28 18×18 multipliers for high-performance multiply-accumulate operations.
• I/O Density & Standards  Up to 472 I/O pins in the 672-ball fpBGA (27×27 mm) package, with flexible sysIO buffer support for LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, MLVDS, LVPECL and RSDS signaling.
• Pre-engineered Interfaces  Family-level support for DDR/DDR2 interfaces (up to 200 MHz), 7:1 LVDS display links and XGMII, enabling rapid implementation of common high-speed interfaces.
• Configuration & Security  flexiFLASH architecture provides instant-on and infinite reconfiguration, FlashBAK embedded memory, Serial TAG and Live Update capabilities including TransFR, 128‑bit AES encryption and dual-boot with external SPI.
• Clocking  Up to four analog PLLs per device for clock multiplication, division and phase shifting.
• Power & Package  Operates from a supply range of 1.14 V to 1.26 V; supplied in a 672-BBGA / 672-FPBGA (27×27 mm) surface-mount package.
• Operating Range & Compliance  Commercial grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

• High-density I/O Bridging  Use the 472 I/Os and flexible signaling to implement multi‑channel interface bridges, protocol conversion and board-level glue logic.
• Memory Interface Controllers  Pre‑engineered DDR/DDR2 interface support and abundant I/O make this device suitable for memory controllers and high-speed data buffering.
• Display and Video Links  7:1 LVDS interface capability supports display and video transport applications requiring serialized, source-synchronous links.
• Accelerated Signal Processing  sysDSP blocks with multiple 18×18 multipliers enable multiply‑accumulate tasks for filtering, sensor pre‑processing and fixed-point compute acceleration.
• Secure Field Updates  Live Update (TransFR) and 128‑bit AES encryption support secure firmware updates and dual‑boot configurations.

Unique Advantages

• Integrated non-volatile configuration: flexiFLASH architecture provides instant-on and on-chip FlashBAK storage to simplify system boot and configuration management.
• High I/O in a compact package: 472 I/Os in a 27×27 mm 672-ball fpBGA enable dense connectivity without a larger footprint.
• Embedded DSP and memory: sysDSP blocks with 18×18 multipliers plus nearly 387 Kbits of on-chip RAM reduce external component needs for many signal-processing tasks.
• Secure, field-capable updates: Live Update with TransFR and 128‑bit AES encryption supports protected firmware delivery and dual-boot strategies.
• Low-voltage operation: Narrow supply range (1.14 V to 1.26 V) aligns with modern low-voltage power domains.
• Toolchain support: Series-level design flow and IP ecosystem in the family data encourage faster design implementation and migration within the XP2 family.

Why Choose LFXP2-30E-5FN672C?

The LFXP2-30E-5FN672C is positioned for commercial embedded designs that require a balance of logic capacity, on-chip memory and high I/O density in a compact fpBGA package. Its combination of flexiFLASH configuration, live-update security features and dedicated DSP resources makes it well suited for applications that need secure field updates, interface-rich designs and moderate signal-processing acceleration.

Engineers targeting mid-range FPGA functionality with integrated non-volatile configuration and a robust set of I/O and timing resources will find this device appropriate for scalable designs that benefit from the XP2 family feature set.

Request a quote or submit an inquiry to receive pricing, availability and technical assistance for the LFXP2-30E-5FN672C.