LFXP2-30E-5F672I

The LFXP2-30E-5F672I is an industrial-grade LatticeXP2 FPGA featuring a flexiFLASH architecture that combines a LUT-based FPGA fabric with on-chip non-volatile flash. It delivers reconfigurable, instant-on operation with integrated security and live-update support for embedded and industrial applications.

With 29,000 logic elements, 472 I/O pins in a 672-ball fpBGA package, and on-chip memory totaling 396,288 bits, this device is designed for high-density I/O, signal processing and system-level integration where secure in-field updates and compact packaging matter.

Key Features

• Core Capacity — 29,000 logic elements provide substantial combinatorial and sequential resources for mid-range FPGA designs.
• Embedded Memory — Total on-chip RAM: 396,288 bits (approximately 0.396 Mbits) for distributed and embedded storage in logic designs.
• High-Density I/O — 472 available I/O pins in a 672-ball fpBGA (27 × 27 mm) package, enabling complex board-level connectivity and multi-channel interfaces.
• sysDSP Blocks & Multipliers — Family architecture includes high‑performance sysDSP blocks and 18×18 multipliers for efficient multiply‑accumulate operations (XP2-30 family characteristics).
• flexiFLASH Configuration — Instant-on, single-chip flash-based configuration with FlashBAK and serial TAG memory for on-chip storage and secure boot options.
• Live Update & Security — TransFR Live Update technology and 128‑bit AES encryption for secure firmware updates and dual-boot options (family features).
• Flexible I/O Standards — Supports a broad set of I/O standards and source-synchronous interfaces including DDR/DDR2 memory interfaces (up to 200 MHz) and multi‑lane LVDS for display applications (family features).
• Clocking — Multiple PLLs available for clock multiply/divide and phase shifting (family features).
• Power and Temperature — Operates from a 1.14–1.26 V supply and is specified for industrial operation from −40 °C to 100 °C.
• Packaging & Mounting — Surface mount 672-ball fpBGA (672‑FPBGA, 27 × 27 mm) for high I/O density in compact form factors.
• RoHS Compliant — Meets RoHS requirements for hazardous substance restrictions.

Typical Applications

• High-density I/O systems — Use the 472 I/Os and 672‑ball fpBGA package for complex protocol bridging, multi-channel data aggregation and board-level interface hubs.
• Memory interface and buffering — Implement DDR/DDR2 interfaces (supported up to 200 MHz) for memory bridging, buffering and custom PHY implementations.
• Video and display subsystems — Leverage multi‑lane LVDS and 7:1 LVDS interface support (family features) for display timing, serialization and data formatting.
• Industrial embedded control — Industrial-grade temperature range and flash-based instant-on configuration make the device suitable for reconfigurable industrial control and monitoring systems.

Unique Advantages

• High integration density: 29,000 logic elements plus 472 I/Os reduce external logic and simplify board-level design.
• Instant-on, reconfigurable flash: flexiFLASH architecture provides single-chip non‑volatile configuration and fast startup without external configuration memory.
• Secure field updates: Live Update (TransFR) with 128‑bit AES encryption supports secure in-field firmware upgrades and dual-boot strategies.
• DSP-friendly resources: sysDSP blocks and multiple 18×18 multipliers accelerate multiply-accumulate workloads for signal processing tasks (family features).
• Industrial robustness: Specified for −40 °C to 100 °C and designed for surface-mount assembly in a compact fpBGA package for demanding environments.
• Ecosystem support: Family-level support includes design software and pre-engineered IP to streamline development and migration across densities.

Why Choose LFXP2-30E-5F672I?

The LFXP2-30E-5F672I positions itself as a mid‑range, industrial-grade FPGA that balances logic capacity, on-chip memory and very high I/O density in a compact 672‑ball fpBGA package. Its flexiFLASH configuration, live-update capabilities and built-in security features make it attractive for applications that require field reconfigurability and controlled firmware management.

This device is well suited to designers who need a scalable FPGA solution with DSP acceleration, flexible I/O standards and an established family ecosystem for IP and development tools. For projects requiring industrial temperature operation and high I/O counts in a single-chip solution, the LFXP2-30E-5F672I offers a combination of integration and system-level features that simplify BOM and deployment.

Request a quote or submit a design inquiry to get pricing, availability and application support for the LFXP2-30E-5F672I.