LFXP2-30E-5F484C

The LFXP2-30E-5F484C is a Lattice XP2 family FPGA combining a LUT-based FPGA fabric with non-volatile flash-based configuration to provide instant-on, reconfigurable logic in a compact fpBGA package. The device delivers high I/O density, on-chip embedded memory and DSP resources suitable for designs requiring abundant programmable logic, memory and interface options.

Typical use cases include high-performance interface bridging, display and memory interface designs, and embedded control applications where a commercial-grade, surface-mount FPGA with secure reconfiguration and live-update capabilities is required.

Key Features

• Core Logic  Approximately 29,000 logic elements for implementing complex programmable logic and glue functions.
• Embedded Memory  Approximately 0.396 Mbits (396,288 bits) of on-chip RAM to support buffers, FIFOs and intermediate storage.
• I/O Capacity & Package  363 user I/Os in a 484-ball fpBGA (484-FPBGA, 23 × 23 mm) package, delivering high pin-count in a compact surface-mount form factor.
• sysDSP and Multipliers  Series-level sysDSP block architecture (series documentation highlights multi-block DSP resources and 18×18 multiplier support) for multiply-accumulate and signal processing tasks.
• flexiFLASH Configuration  Flash-based architecture provides instant-on, infinitely reconfigurable operation with on-chip non-volatile storage and embedded FlashBAK memory.
• Live Update & Security  Live update technologies including secure update mechanisms and dual-boot capability referenced in the family datasheet.
• Clocking  Support for multiple PLLs (series devices support up to four PLLs) for clock multiplication, division and phase control.
• Power and Temperature  Operates from 1.14 V to 1.26 V supply and rated for commercial temperature operation from 0 °C to 85 °C.
• Compliance  RoHS compliant and supplied in a surface-mount package suitable for automated PCB assembly.

Typical Applications

• Display and Video Interfaces  Leverage multi-channel LVDS and pre-engineered source-synchronous interfaces (family-level support for 7:1 LVDS) to implement display bridging and video transport features.
• Memory Interface and Bridging  Support for DDR/DDR2 interfaces (family-level support up to 200 MHz) enables use as a protocol bridge or memory controller front-end.
• Signal Processing and DSP  sysDSP blocks and on-chip multipliers provide resources for multiply-accumulate operations and other mid-rate signal processing tasks.
• Embedded Control and Glue Logic  High I/O count and 29k logic elements make the device suitable for complex control, peripheral aggregation and custom interface logic in commercial systems.

Unique Advantages

• Instant-on, non-volatile architecture: Flash-based flexiFLASH configuration enables immediate availability of programmed logic without external configuration steps.
• High I/O density in a compact package: 363 I/Os in a 23 × 23 mm 484-ball fpBGA package reduces board area while accommodating large interface counts.
• On-chip memory and DSP resources: Nearly 0.4 Mbits of embedded RAM and DSP/multiplier support simplify designs that require local buffering and arithmetic acceleration.
• Secure reconfiguration and live updates: Family-level capabilities for secure updates and dual-boot configurations help maintain field-updatable systems.
• Low-voltage operation: Narrow supply range (1.14–1.26 V) supports integration into low-voltage system power rails.
• Design ecosystem support: The XP2 family is documented with pre-engineered IP and design tools (family datasheet references available design software and IP), aiding development and migration.

Why Choose LFXP2-30E-5F484C?

The LFXP2-30E-5F484C positions itself as a high-density, flash-configured FPGA for commercial embedded designs that require abundant programmable logic, significant I/O, and on-chip memory/DSP resources in a compact fpBGA package. Its flash-based configuration and family-level live-update capabilities make it well suited to applications where instant-on behavior and field reconfigurability matter.

Engineers targeting memory interfaces, display subsystems, DSP-augmented control logic or complex glue logic will find the device’s mix of logic elements, embedded RAM and I/O count aligned to those needs, with family documentation and design tool support referenced in the XP2 data materials to streamline development and migration.

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