LFXP2-17E-7FT256C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 201 282624 17000 256-LBGA |
|---|---|
| Quantity | 1,403 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 201 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2125 | Number of Logic Elements/Cells | 17000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFXP2-17E-7FT256C – XP2 Field Programmable Gate Array (FPGA) IC 201 I/Os, 282,624 bits RAM, 17,000 logic elements, 256-LBGA
The LFXP2-17E-7FT256C is a mid-density LatticeXP2 family FPGA that combines LUT-based logic fabric with non-volatile flash configuration to deliver instant-on, reconfigurable logic for commercial applications. It provides approximately 17,000 logic elements, roughly 282,624 bits of on-chip RAM, and 201 general-purpose I/Os in a compact 256-ball package.
Architected for embedded control, signal processing and interface bridging, the device emphasizes integrated configuration and secure update capabilities alongside DSP resources and flexible I/O to address a range of system-level functions.
Key Features
- flexiFLASH architecture Instant-on, infinitely reconfigurable single-chip flash-based configuration with FlashBAK and Serial TAG memory for on-chip storage and design security.
- Live Update and Secure Configuration TransFR live-update technology with secure updates using 128-bit AES encryption and support for dual-boot via external SPI.
- Logic and DSP Approximately 17,000 logic elements with sysDSP blocks for high-performance multiply-and-accumulate; the family supports multiple 18×18 multipliers and larger multiplier configurations.
- Embedded Memory Total on-chip RAM of approximately 282,624 bits for embedded and distributed memory needs.
- Flexible I/O and Interfaces 201 I/Os with sysIO buffer support for LVCMOS, LVTTL, SSTL, HSTL, PCI and differential standards including LVDS, Bus-LVDS, MLVDS and LVPECL; pre-engineered source-synchronous interfaces are supported for DDR/DDR2 and high-speed LVDS links.
- Clocking Up to four analog PLLs per device for clock multiply, divide and phase shifting.
- Package, Power and Mounting Surface-mount 256-ball package (supplier device package: 256-FTBGA, 17×17 mm). Nominal supply range 1.14 V to 1.26 V. Commercial operating temperature 0 °C to 85 °C.
Typical Applications
- High-speed memory interfaces Use the device’s pre-engineered source-synchronous support to implement DDR/DDR2 memory controllers and bridges up to 200 MHz.
- Display and video transport Leverage 7:1 LVDS and LVDS-based interfaces for display subsystems and high-speed parallel-to-serial conversion.
- Embedded signal processing Implement multiply-accumulate and DSP pipelines using sysDSP blocks and integrated multipliers for tasks such as filtering and protocol acceleration.
- Secure field updates and system management Deploy secure firmware updates and dual-boot configurations using TransFR and 128-bit AES encryption to manage in-field reconfiguration.
Unique Advantages
- Integrated flash-based configuration: flexiFLASH provides instant-on operation and on-chip non-volatile storage, reducing the need for external configuration components.
- Secure update capability: Built-in TransFR live-update and AES-128 encryption enable secure, authenticated firmware updates and robust dual-boot strategies.
- Balanced logic and DSP resources: Approximately 17,000 logic elements combined with dedicated sysDSP multipliers deliver a practical balance of control logic and arithmetic performance.
- Versatile I/O support: 201 I/Os with broad interface standard support simplify integration with modern memory, display and serial protocols.
- Compact package with industry-standard supply: 256-ball ftBGA in a 17×17 mm footprint with a 1.14–1.26 V supply range for integration into compact, 1.2 V-compatible systems.
Why Choose LFXP2-17E-7FT256C?
The LFXP2-17E-7FT256C delivers a mid-range FPGA solution that pairs flash-based instant-on configuration and secure live-update capabilities with a practical complement of logic, memory and DSP resources. Its 201 I/Os and flexible interface support make it well suited for designs that require moderate I/O density, on-chip memory and robust update mechanisms.
Designed for engineers who need a reconfigurable platform with integrated configuration, the device benefits from Lattice’s design ecosystem and pre-engineered IP, enabling faster development cycles and design scalability within the LatticeXP2 family.
Request a quote or submit an inquiry for pricing and availability to evaluate LFXP2-17E-7FT256C for your design needs.

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