LFXP2-17E-7FT256C

IC FPGA 201 I/O 256FTBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 201 282624 17000 256-LBGA

Quantity 1,403 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O201Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2125Number of Logic Elements/Cells17000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFXP2-17E-7FT256C – XP2 Field Programmable Gate Array (FPGA) IC 201 I/Os, 282,624 bits RAM, 17,000 logic elements, 256-LBGA

The LFXP2-17E-7FT256C is a mid-density LatticeXP2 family FPGA that combines LUT-based logic fabric with non-volatile flash configuration to deliver instant-on, reconfigurable logic for commercial applications. It provides approximately 17,000 logic elements, roughly 282,624 bits of on-chip RAM, and 201 general-purpose I/Os in a compact 256-ball package.

Architected for embedded control, signal processing and interface bridging, the device emphasizes integrated configuration and secure update capabilities alongside DSP resources and flexible I/O to address a range of system-level functions.

Key Features

  • flexiFLASH architecture  Instant-on, infinitely reconfigurable single-chip flash-based configuration with FlashBAK and Serial TAG memory for on-chip storage and design security.
  • Live Update and Secure Configuration  TransFR live-update technology with secure updates using 128-bit AES encryption and support for dual-boot via external SPI.
  • Logic and DSP  Approximately 17,000 logic elements with sysDSP blocks for high-performance multiply-and-accumulate; the family supports multiple 18×18 multipliers and larger multiplier configurations.
  • Embedded Memory  Total on-chip RAM of approximately 282,624 bits for embedded and distributed memory needs.
  • Flexible I/O and Interfaces  201 I/Os with sysIO buffer support for LVCMOS, LVTTL, SSTL, HSTL, PCI and differential standards including LVDS, Bus-LVDS, MLVDS and LVPECL; pre-engineered source-synchronous interfaces are supported for DDR/DDR2 and high-speed LVDS links.
  • Clocking  Up to four analog PLLs per device for clock multiply, divide and phase shifting.
  • Package, Power and Mounting  Surface-mount 256-ball package (supplier device package: 256-FTBGA, 17×17 mm). Nominal supply range 1.14 V to 1.26 V. Commercial operating temperature 0 °C to 85 °C.

Typical Applications

  • High-speed memory interfaces  Use the device’s pre-engineered source-synchronous support to implement DDR/DDR2 memory controllers and bridges up to 200 MHz.
  • Display and video transport  Leverage 7:1 LVDS and LVDS-based interfaces for display subsystems and high-speed parallel-to-serial conversion.
  • Embedded signal processing  Implement multiply-accumulate and DSP pipelines using sysDSP blocks and integrated multipliers for tasks such as filtering and protocol acceleration.
  • Secure field updates and system management  Deploy secure firmware updates and dual-boot configurations using TransFR and 128-bit AES encryption to manage in-field reconfiguration.

Unique Advantages

  • Integrated flash-based configuration: flexiFLASH provides instant-on operation and on-chip non-volatile storage, reducing the need for external configuration components.
  • Secure update capability: Built-in TransFR live-update and AES-128 encryption enable secure, authenticated firmware updates and robust dual-boot strategies.
  • Balanced logic and DSP resources: Approximately 17,000 logic elements combined with dedicated sysDSP multipliers deliver a practical balance of control logic and arithmetic performance.
  • Versatile I/O support: 201 I/Os with broad interface standard support simplify integration with modern memory, display and serial protocols.
  • Compact package with industry-standard supply: 256-ball ftBGA in a 17×17 mm footprint with a 1.14–1.26 V supply range for integration into compact, 1.2 V-compatible systems.

Why Choose LFXP2-17E-7FT256C?

The LFXP2-17E-7FT256C delivers a mid-range FPGA solution that pairs flash-based instant-on configuration and secure live-update capabilities with a practical complement of logic, memory and DSP resources. Its 201 I/Os and flexible interface support make it well suited for designs that require moderate I/O density, on-chip memory and robust update mechanisms.

Designed for engineers who need a reconfigurable platform with integrated configuration, the device benefits from Lattice’s design ecosystem and pre-engineered IP, enabling faster development cycles and design scalability within the LatticeXP2 family.

Request a quote or submit an inquiry for pricing and availability to evaluate LFXP2-17E-7FT256C for your design needs.

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