LFXP2-17E-6QN208I

IC FPGA 146 I/O 208QFP
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 146 282624 17000 208-BFQFP

Quantity 1,789 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case208-BFQFPNumber of I/O146Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2125Number of Logic Elements/Cells17000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFXP2-17E-6QN208I – XP2 Field Programmable Gate Array (FPGA), 146 I/O, ~0.283 Mbit embedded memory, 17,000 logic elements, 208-BFQFP

The LFXP2-17E-6QN208I is a Lattice XP2 family FPGA in a 208-pin PQFP (28 × 28 mm) package. It pairs a flash-based config architecture with a LUT-based programmable fabric to deliver instant-on, reconfigurable logic suitable for industrial applications that require robust temperature and voltage ranges.

With 17,000 logic elements, approximately 0.283 Mbits of on-chip RAM, and 146 I/O, this device targets embedded control, communications and display-oriented designs that benefit from integrated DSP resources, flexible I/O and secure update capabilities provided by the XP2 family.

Key Features

  • flexiFLASH™ configuration  Instant-on, single-chip flash-based architecture with on-chip nonvolatile storage, supporting reconfiguration and embedded FlashBAK memory for reliable field operation.
  • Live Update & Security  Family-level Live Update technology (TransFR™) and secure updates with 128-bit AES encryption; supports dual-boot configuration options.
  • Logic Capacity  17,000 logic elements (LUT-based fabric) to implement mid-density application logic and control functions.
  • Embedded Memory  Approximately 0.283 Mbits of total on-chip RAM to support buffering, packet handling and local data storage.
  • sysDSP™ and Multiply Resources  XP2 family DSP capabilities and 18×18 multipliers (XP2-17 device-level multipliers per family data) for efficient multiply-accumulate operations in signal processing tasks.
  • Flexible I/O  146 available I/O pins in the 208-PQFP package; family supports a wide range of I/O standards including LVCMOS, LVTTL, SSTL, HSTL, PCI and differential interfaces such as LVDS and LVPECL (per family documentation).
  • Clocking  Analog PLL support (sysCLOCK™) for clock multiply, divide and phase shifting to simplify timing distribution and high-speed interface timing.
  • Power and Temperature  Operates from 1.14 V to 1.26 V and rated for industrial temperatures from −40 °C to 100 °C.
  • Package & Mounting  208-BFQFP (208-PQFP, 28 × 28) surface-mount package suitable for compact board layouts and standard PCB assembly.
  • Standards & Tools  Part of the LatticeXP2 family with design support from Lattice Diamond tools and available LatticeCORE IP blocks (family-level tool and IP support noted in documentation).

Typical Applications

  • Industrial Control and Automation  Use the 17,000 logic elements, industrial temperature rating and flexible I/O to implement motor control, PLC logic and sensor interfacing in factory and process environments.
  • Communications and Networking  Leverage DSP resources, on-chip multipliers and PLLs for packet processing, protocol bridging and interface adaptation in medium-density networking equipment.
  • Display and Video Interfaces  Family support for source-synchronous interfaces and LVDS (including 7:1 LVDS for displays) makes this device suitable for display controllers and video front-end processing.
  • Embedded Instrumentation  On-chip flash configuration (instant-on) and embedded RAM enable compact, reliable embedded measurement and control modules with secure update capability.

Unique Advantages

  • Instant-on, reconfigurable flash architecture: Built-in flexiFLASH enables single-chip, nonvolatile configuration for fast startup and field reprogramming.
  • Secure field updates: Live Update technology and 128-bit AES encryption support secure, managed firmware updates and dual-boot configurations for resilient deployments.
  • DSP-optimized resources: Integrated sysDSP blocks and 18×18 multipliers (XP2-17 device level) reduce reliance on external accelerators for signal processing tasks.
  • Industrial-grade operating range: 1.14–1.26 V supply range with −40 °C to 100 °C operation meets common industrial environmental requirements.
  • Flexible I/O in a compact PQFP package: 146 I/O in a 208-PQFP footprint provides a balance of connectivity and board-level density for many embedded applications.

Why Choose LFXP2-17E-6QN208I?

The LFXP2-17E-6QN208I combines a mid-range logic capacity (17,000 logic elements) with secure, flash-based configuration and integrated DSP resources to address industrial and embedded designs that require instant-on behavior, in-field reconfigurability and a broad set of I/O options. Its operating voltage and industrial temperature rating make it suitable for robust deployments where environmental and power constraints matter.

Choosing this XP2-17 device gives designers access to the LatticeXP2 family’s configuration and update features, on-chip memory and CLK/DSP capabilities, enabling scalable designs and continued support through family-level tools and IP.

Request a quote or submit an inquiry for LFXP2-17E-6QN208I to discuss availability, pricing and lead times for your design requirements.

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