LFXP2-17E-6FT256I
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 201 282624 17000 256-LBGA |
|---|---|
| Quantity | 642 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 201 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2125 | Number of Logic Elements/Cells | 17000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFXP2-17E-6FT256I – XP2 Field Programmable Gate Array (FPGA) IC 201 282624 17000 256-LBGA
The LFXP2-17E-6FT256I is a flash-based FPGA device from the LatticeXP2 family designed for industrial embedded applications. It combines a LUT-based FPGA fabric with on-chip flash configuration and live-update features to support reconfigurable logic, system integration, and secure updates.
This device provides 17,000 logic elements, approximately 282,624 bits of total on-chip RAM, up to 201 I/O, and a compact 256-ball ftBGA (17×17) package, operating over an industrial temperature range with a 1.14 V to 1.26 V supply.
Key Features
- Core Logic 17,000 logic elements implemented in a LUT-based FPGA fabric for programmable logic integration and custom hardware functions.
- Flexible Configuration (flexiFLASH) Flash-based single-chip architecture providing instant-on operation, on-chip FlashBAK memory and serial TAG memory for design storage and secure configuration.
- Live Update & Security Live Update technology with TransFR, support for dual-boot configurations, and secure updates using 128-bit AES encryption.
- Embedded DSP sysDSP blocks and dedicated multipliers (family-level support includes multiple 18×18 multipliers) for high-performance multiply-accumulate implementations.
- Memory Approximately 282,624 bits of total embedded memory with additional distributed RAM resources available in the XP2 family.
- I/O Flexibility Up to 201 I/O pins with sysIO buffer support for multiple standards including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS.
- Source-synchronous Interfaces Pre-engineered interfaces in the family include DDR/DDR2 up to 200 MHz and multi-lane LVDS support useful for memory and display connectivity.
- Clocking Up to four analog PLLs per device for clock multiplication, division and phase shifting (family capability).
- Package & Thermal 256-ball ftBGA (17×17) surface-mount package; industrial grade with operating temperature from -40 °C to 100 °C and RoHS compliance.
- Power Operates with a supply range of 1.14 V to 1.26 V.
Typical Applications
- Industrial control systems — Implement custom I/O routing, protocol bridging and control logic for factory automation and embedded controllers within the device's industrial temperature range.
- Signal processing and acceleration — Use sysDSP blocks and on-chip multipliers for real-time multiply-accumulate workloads and DSP offload tasks.
- Memory and interface bridging — Build DDR/DDR2 interfaces and source-synchronous interconnects for system memory and high-speed peripheral bridging (family supports DDR/DDR2 up to 200 MHz).
- Display and video interfaces — Support multi-lane LVDS and related pre-engineered display interfaces for panel and imaging applications.
Unique Advantages
- Flash-based instant-on architecture — On-chip flash configuration enables immediate startup and in-field reconfiguration without external volatile configuration memory.
- Secure update capability — Live Update with TransFR plus 128-bit AES encryption supports secure firmware updates and dual-boot image options.
- Integrated DSP resources — Dedicated sysDSP blocks and multiple multipliers reduce external component count for arithmetic-heavy designs.
- Broad I/O standard support — Flexible I/O buffer options accommodate a wide range of signaling standards to simplify system-level integration.
- Industrial-ready packaging and temperature range — 256-ball ftBGA and -40 °C to 100 °C operating range suitable for industrial environments.
- Design ecosystem support — LatticeXP2 family compatibility with vendor design tools and IP (as documented for the family) helps accelerate development and migration.
Why Choose LFXP2-17E-6FT256I?
The LFXP2-17E-6FT256I targets designers who need a reconfigurable, flash-based FPGA with mid-range logic density, flexible I/O, and built-in DSP resources for industrial embedded applications. Its combination of approximately 17,000 logic elements, ~282,624 bits of on-chip RAM, and up to 201 I/O in a compact ftBGA package provides a balanced platform for control, interfacing and signal-processing tasks.
Backed by the LatticeXP2 family architecture and associated design tools and IP, this device offers a path for scalable designs that require secure configuration, live updates and a wide set of interface options while meeting industrial operating conditions.
Request a quote or submit an inquiry to receive pricing, availability and additional technical assistance for the LFXP2-17E-6FT256I.

Date Founded: 1983
Headquarters: Hillsboro, Oregon, USA
Employees: 1,000+
Revenue: $627.7 Million
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016