LFXP2-17E-6FT256I

IC FPGA 201 I/O 256FTBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 201 282624 17000 256-LBGA

Quantity 642 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O201Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2125Number of Logic Elements/Cells17000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFXP2-17E-6FT256I – XP2 Field Programmable Gate Array (FPGA) IC 201 282624 17000 256-LBGA

The LFXP2-17E-6FT256I is a flash-based FPGA device from the LatticeXP2 family designed for industrial embedded applications. It combines a LUT-based FPGA fabric with on-chip flash configuration and live-update features to support reconfigurable logic, system integration, and secure updates.

This device provides 17,000 logic elements, approximately 282,624 bits of total on-chip RAM, up to 201 I/O, and a compact 256-ball ftBGA (17×17) package, operating over an industrial temperature range with a 1.14 V to 1.26 V supply.

Key Features

  • Core Logic 17,000 logic elements implemented in a LUT-based FPGA fabric for programmable logic integration and custom hardware functions.
  • Flexible Configuration (flexiFLASH) Flash-based single-chip architecture providing instant-on operation, on-chip FlashBAK memory and serial TAG memory for design storage and secure configuration.
  • Live Update & Security Live Update technology with TransFR, support for dual-boot configurations, and secure updates using 128-bit AES encryption.
  • Embedded DSP sysDSP blocks and dedicated multipliers (family-level support includes multiple 18×18 multipliers) for high-performance multiply-accumulate implementations.
  • Memory Approximately 282,624 bits of total embedded memory with additional distributed RAM resources available in the XP2 family.
  • I/O Flexibility Up to 201 I/O pins with sysIO buffer support for multiple standards including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS.
  • Source-synchronous Interfaces Pre-engineered interfaces in the family include DDR/DDR2 up to 200 MHz and multi-lane LVDS support useful for memory and display connectivity.
  • Clocking Up to four analog PLLs per device for clock multiplication, division and phase shifting (family capability).
  • Package & Thermal 256-ball ftBGA (17×17) surface-mount package; industrial grade with operating temperature from -40 °C to 100 °C and RoHS compliance.
  • Power Operates with a supply range of 1.14 V to 1.26 V.

Typical Applications

  • Industrial control systems — Implement custom I/O routing, protocol bridging and control logic for factory automation and embedded controllers within the device's industrial temperature range.
  • Signal processing and acceleration — Use sysDSP blocks and on-chip multipliers for real-time multiply-accumulate workloads and DSP offload tasks.
  • Memory and interface bridging — Build DDR/DDR2 interfaces and source-synchronous interconnects for system memory and high-speed peripheral bridging (family supports DDR/DDR2 up to 200 MHz).
  • Display and video interfaces — Support multi-lane LVDS and related pre-engineered display interfaces for panel and imaging applications.

Unique Advantages

  • Flash-based instant-on architecture — On-chip flash configuration enables immediate startup and in-field reconfiguration without external volatile configuration memory.
  • Secure update capability — Live Update with TransFR plus 128-bit AES encryption supports secure firmware updates and dual-boot image options.
  • Integrated DSP resources — Dedicated sysDSP blocks and multiple multipliers reduce external component count for arithmetic-heavy designs.
  • Broad I/O standard support — Flexible I/O buffer options accommodate a wide range of signaling standards to simplify system-level integration.
  • Industrial-ready packaging and temperature range — 256-ball ftBGA and -40 °C to 100 °C operating range suitable for industrial environments.
  • Design ecosystem support — LatticeXP2 family compatibility with vendor design tools and IP (as documented for the family) helps accelerate development and migration.

Why Choose LFXP2-17E-6FT256I?

The LFXP2-17E-6FT256I targets designers who need a reconfigurable, flash-based FPGA with mid-range logic density, flexible I/O, and built-in DSP resources for industrial embedded applications. Its combination of approximately 17,000 logic elements, ~282,624 bits of on-chip RAM, and up to 201 I/O in a compact ftBGA package provides a balanced platform for control, interfacing and signal-processing tasks.

Backed by the LatticeXP2 family architecture and associated design tools and IP, this device offers a path for scalable designs that require secure configuration, live updates and a wide set of interface options while meeting industrial operating conditions.

Request a quote or submit an inquiry to receive pricing, availability and additional technical assistance for the LFXP2-17E-6FT256I.

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