LFXP2-17E-6F484I

The LFXP2-17E-6F484I is a LatticeXP2 family FPGA combining LUT-based FPGA fabric with on-chip non-volatile flash (flexiFLASH) to deliver instant-on, reconfigurable logic for industrial applications. It provides approximately 17,000 logic elements, roughly 0.283 Mbits of on-chip RAM, and up to 358 user I/Os in a 484-ball BGA package, making it suitable for designs requiring dense I/O, embedded memory and DSP capabilities.

Designed for applications that demand field updates, secure boot and mixed-signal I/O flexibility, the device integrates live-update and security features alongside sysDSP blocks and multi-standard I/O support to streamline system integration and reduce external components.

Key Features

• Core Architecture  LatticeXP2 flexiFLASH architecture with instant-on and infinitely reconfigurable on-chip flash; single-chip solution with FlashBAK embedded block memory and Serial TAG memory for design security.
• Logic Capacity  Approximately 17,000 logic elements to implement mid-density FPGA designs.
• Embedded Memory  Approximately 282,624 bits (~0.283 Mbits) of total on-chip RAM; family datasheet lists dedicated EBR and distributed RAM resources suitable for embedded buffering and state storage.
• DSP Resources  sysDSP blocks and dedicated multipliers as provided by the XP2-17 family for high-performance multiply-accumulate operations (sysDSP blocks and multiplier counts per datasheet).
• I/O Flexibility  Up to 358 user I/Os with a flexible sysIO buffer supporting LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS signaling standards.
• Configuration & Security  Live Update technology with TransFR for secure updates, Dual-boot with external SPI support and 128-bit AES encryption for secure firmware management.
• Clocking  sysCLOCK PLLs with up to four analog PLLs per device for clock multiply/divide and phase shifting.
• Package & Mounting  484-ball BGA package (484-FPBGA, 23 × 23 mm); surface-mount mounting type for compact board integration.
• Voltage & Temperature  Operating supply voltage range 1.14 V to 1.26 V; industrial operating temperature range −40°C to 100°C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-performance signal processing  Use the sysDSP blocks and dedicated multipliers for multiply-accumulate workloads and real-time data processing tasks.
• Memory interface controllers  Implement DDR/DDR2 and other source-synchronous memory interfaces leveraging pre-engineered I/O and clocking resources.
• Display and imaging interfaces  Support 7:1 LVDS and other high-speed serial interfaces for display applications and video transport.
• Secure field-updatable systems  Employ Live Update, TransFR and 128-bit AES encryption to enable secure, in-field firmware updates and dual-boot configurations.

Unique Advantages

• Instant-on, non-volatile operation:  flexiFLASH architecture provides single-chip instant-on capability and on-chip flash storage, eliminating the need for external configuration PROMs.
• Integrated DSP and memory:  sysDSP blocks, dedicated multipliers and embedded RAM simplify implementation of compute-intensive algorithms without excessive external components.
• Extensive I/O and signaling options:  Up to 358 I/Os and wide protocol support reduce the need for external transceivers and level shifters, streamlining board design.
• Secure, field-updatable firmware:  TransFR Live Update and AES encryption enable secure updates and dual-boot strategies for maintainable deployed systems.
• Industrial temperature and RoHS compliance:  −40°C to 100°C operating range and RoHS compliance support industrial deployment and environmental requirements.
• Compact BGA package:  484-ball BGA (23 × 23 mm) offers high I/O count in a compact footprint for space-constrained designs.

Why Choose LFXP2-17E-6F484I?

The LFXP2-17E-6F484I positions itself as a mid-density, flash-based FPGA that blends instant-on non-volatile operation with DSP resources, significant I/O count and flexible signaling. Its combination of approximately 17,000 logic elements, on-chip memory, sysDSP blocks and secure update features makes it well suited for industrial-grade embedded systems that require reconfigurability, secure field updates and dense I/O integration.

Engineers designing industrial communication, display, memory-interface or real-time signal-processing systems will find a balanced set of resources for integration, scalability and long-term maintainability, backed by the LatticeXP2 family architecture and on-chip flash configuration.

Request a quote or submit an inquiry to get pricing and availability for LFXP2-17E-6F484I and accelerate your design cycle with this configurable, industrial-grade FPGA solution.