LFXP2-17E-6FN484C

The LFXP2-17E-6FN484C from Lattice Semiconductor Corporation is a flash-based XP2 FPGA device designed for reconfigurable logic and system-level integration. It combines non-volatile flexiFLASH architecture, live-update support and a configurable FPGA fabric to address applications that require significant I/O, on-chip memory and DSP resources.

This commercial-grade, surface-mount device provides 17,000 logic elements, 358 I/Os and approximately 0.28 Mbits of embedded RAM in a 484-ball FBGA (23 × 23 mm) package, operating from a 1.14 V to 1.26 V supply and across a 0 °C to 85 °C temperature range.

Key Features

• Flash-based flexiFLASH architecture – Instant-on, infinitely reconfigurable single-chip flash architecture with on-chip non-volatile storage and FlashBAK embedded block memory.
• Live Update and security – Live Update technology with TransFR and secure update support including 128‑bit AES encryption and dual-boot capabilities as part of the XP2 family feature set.
• Logic and fabric – 17,000 logic elements suitable for complex glue logic, protocol bridging and mid-density FPGA tasks.
• Embedded memory – Total on-chip RAM of 282,624 bits (approximately 0.28 Mbits) for data buffering, FIFOs and small local storage.
• sysDSP and multipliers – XP2 family sysDSP resources and integer multiplier support for MAC-style operations and DSP acceleration (family-level sysDSP blocks and multiplier options applicable to XP2-17 class devices).
• Flexible I/O – Up to 358 I/Os with sysIO buffer support across multiple signaling standards (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, MLVDS, LVPECL and RSDS) per the LatticeXP2 family specifications.
• Clocking – Family-level analog PLL support for clock multiply/divide and phase shifting (up to four PLLs available on XP2-17 class devices).
• Package and mounting – 484‑BBGA (484‑FPBGA, 23 × 23 mm) supplier device package; surface-mount mounting type and RoHS compliant.
• Commercial operating range – Specified for 0 °C to 85 °C operation and for 1.14 V to 1.26 V core supply.

Typical Applications

• Interface bridging and protocol conversion – High I/O count and flexible I/O standards make the device suited for bridging between disparate interfaces and implementing protocol translators.
• Memory and peripheral interfaces – Pre‑engineered source synchronous interfaces (DDR/DDR2 support at the family level) and ample I/O enable memory controller and peripheral interface implementations.
• Display and video interfaces – Family support for 7:1 LVDS and other high‑speed link modes enables display front‑end and serializer/deserializer tasks.
• Signal processing and acceleration – On-chip DSP resources and multipliers (XP2‑17 class) provide hardware acceleration for MAC operations and compact DSP kernels.

Unique Advantages

• Non-volatile, instant-on operation: flexiFLASH architecture stores configuration on-chip for immediate startup without external configuration flash dependency.
• Reconfigurable with secure updates: Support for live updates, TransFR technology and 128‑bit AES encrypted updates reduces field maintenance risk while enabling remote image management.
• High I/O density in a compact package: 358 available I/Os in a 23 × 23 mm 484‑ball FBGA package enables dense system integration with a small PCB footprint.
• Integrated DSP and memory resources: Embedded RAM and family-level sysDSP/multiplier resources let designers offload compute-intensive tasks to hardware blocks.
• Commercial-grade, deterministic supply and thermal bounds: Specified core voltage range of 1.14–1.26 V and operating temperature of 0 °C to 85 °C for predictable deployment in commercial environments.
• RoHS compliant: Conforms to RoHS requirements for environmental compliance.

Why Choose LFXP2-17E-6FN484C?

The LFXP2-17E-6FN484C positions itself as a mid-density, flash-based FPGA solution within the LatticeXP2 family, balancing logic capacity, I/O count and embedded memory for applications that need instant-on reconfigurability and field update capability. Its combination of approximate 17,000 logic elements, ~0.28 Mbits of on-chip RAM and 358 I/Os in a 484‑ball FBGA package makes it suitable for designs requiring significant interface density and integrated DSP resources.

Choose this device when you need a commercially rated, flash-configured FPGA with secure update support, flexible I/O standards and a compact surface-mount package for embedded systems, interface bridging or mid-range signal-processing tasks.

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