LFXP2-17E-6F484C

The LFXP2-17E-6F484C is a flash-based FPGA from the Lattice XP2 family, combining a LUT-based programmable fabric with non-volatile flash in a flexiFLASH architecture. This device offers 17,000 logic elements, approximately 282,624 bits of on-chip RAM, and up to 358 user I/O in a 484-ball fpBGA package (23 × 23 mm), targeted at commercial applications requiring on-chip memory, DSP resources and flexible I/O.

Series-level capabilities include instant-on flash configuration, Live Update technologies and robust I/O interface options, making this device suitable for embedded control, high‑speed interfaces and display or communications-oriented designs that require reconfigurability and on-chip security features.

Key Features

• Core Architecture (flexiFLASH) Flash-based single-chip architecture with instant-on and infinite reconfigurability; supports FlashBAK embedded block memory and serial TAG memory for design security and configuration storage.
• Logic Capacity 17,000 logic elements suitable for mid-density FPGA designs and logic-intensive embedded functions.
• Embedded Memory Approximately 0.28 Mbits of on-chip RAM (282,624 bits) with series guidance for additional distributed RAM (35 Kbits for XP2-17 devices).
• sysDSP and Multipliers sysDSP block resources available in the XP2-17 class, providing multiple DSP blocks and 18×18 multiplier support for multiply-accumulate workloads.
• I/O and Interfaces Up to 358 user I/Os in a 484-ball fpBGA package; flexible sysIO buffer support across LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS standards. Pre-engineered source-synchronous interfaces include DDR/DDR2 (up to 200 MHz) and multi-lane LVDS options.
• Clocking Multiple PLLs (up to four analog PLLs for this device class) for clock multiply/divide and phase shifting.
• Security and Live Update Live Update technologies including TransFR, secure updates with 128‑bit AES encryption and dual-boot support provide secure field update capability.
• Power and Package Supply range 1.14 V to 1.26 V (typical family supply 1.2 V); surface-mount 484-FPBGA (23 × 23 mm) package.
• Commercial Grade and Environmental Commercial temperature grade (0 °C to 85 °C) and RoHS compliant.

Typical Applications

• Display and Video Interfaces High-density I/O and multi‑lane LVDS support make the device suitable for display controllers and video interface bridging.
• Communications and Networking Flexible I/O standards, DDR/DDR2 interface support and DSP resources enable packet processing, protocol bridging and media conversion functions.
• Embedded Control and Instrumentation On-chip RAM, DSP blocks and multiple PLLs support sensor interfacing, motor-control logic and real-time embedded processing in commercial systems.
• System Integration and Prototyping Flash-based configuration with instant-on and Live Update features allows iterative development, field updates and rapid prototyping of mid-density FPGA-based solutions.

Unique Advantages

• Instant-on, non-volatile configuration: The flexiFLASH architecture delivers single-chip, flash-based configuration for immediate start-up without external configuration memory.
• Integrated DSP capability: sysDSP blocks and multiple 18×18 multipliers provide on-chip acceleration for signal processing and compute-heavy tasks, reducing external component count.
• Extensive and flexible I/O: Up to 358 I/Os with broad signaling standard support enables connectivity to a wide range of peripherals and high‑speed interfaces.
• Secure field updates: Live Update with TransFR and 128‑bit AES encryption support enables secure, dual-boot update strategies for in-field reconfiguration.
• Compact, high-density package: 484-ball fpBGA (23 × 23 mm) minimizes board area while providing large I/O counts and advanced packaging for compact system designs.
• Commercial-grade reliability: Specified for 0 °C to 85 °C operation and RoHS compliant, suitable for a wide range of commercial product deployments.

Why Choose LFXP2-17E-6F484C?

The LFXP2-17E-6F484C positions mid-density FPGA performance alongside flash-based configuration and secure Live Update capabilities. With 17,000 logic elements, approximately 282,624 bits of embedded memory and comprehensive I/O support in a compact 484-ball fpBGA, the device is well-suited to commercial designs that require reconfigurability, DSP acceleration and flexible interface options.

Targeted at engineers building display, communications, embedded control and system-integration products, this part leverages series-level features such as PLLs, sysDSP blocks and a broad I/O standard set, along with design-tool and IP support provided for the Lattice XP2 family, to deliver a scalable solution for mid-complexity FPGA designs.

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