LFXP2-17E-6FN484I

IC FPGA 358 I/O 484FBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 358 282624 17000 484-BBGA

Quantity 717 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O358Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2125Number of Logic Elements/Cells17000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFXP2-17E-6FN484I – XP2 Field Programmable Gate Array (FPGA) IC, 17,000 logic elements, 484-BBGA

The LFXP2-17E-6FN484I is an industrial-grade LatticeXP2 FPGA optimized for designs that require moderate logic density, extensive I/O, and embedded non-volatile configuration. Built on the LatticeXP2 flexiFLASH architecture, this device targets applications such as embedded control, high-speed interfaces, and DSP-accelerated functions that benefit from instant-on and reconfigurable operation.

Key on-chip resources include approximately 17,000 logic elements, about 0.28 Mbits of embedded RAM, and up to 358 I/O in a 484-ball fpBGA package, with a nominal supply range of 1.14 V to 1.26 V and an operating temperature range of −40 °C to 100 °C.

Key Features

  • Core Logic  Approximately 17,000 logic elements provide a balanced logic fabric for mid-density FPGA designs.
  • Embedded Memory  Approximately 282,624 total RAM bits (≈0.28 Mbits) of on-chip memory for buffering, state storage, and small data tables.
  • sysDSP and Multipliers  LatticeXP2 family sysDSP blocks and dedicated multipliers support multiply–accumulate workloads (family data indicate multiple sysDSP blocks and 18×18 multiplier capability for XP2-17).
  • Flexible I/O  Up to 358 I/O pins with support for a wide range of I/O standards as defined for the LatticeXP2 family, enabling interfaces such as DDR/DDR2 and multi-channel serial links.
  • Non-volatile, Instant-on Architecture  flexiFLASH architecture provides instant-on and on-chip flash-based configuration with design security features.
  • Live Update and Security  Family-level Live Update technology (TransFR) and secure update support with 128‑bit AES encryption and dual-boot image capability.
  • Clocking  Multiple analog PLLs supported at the family level for clock multiply/divide and phase shifting to simplify multi-clock designs.
  • Package and Mounting  484-ball fpBGA (23 × 23 mm) package, surface-mount, suitable for high I/O-density board designs.
  • Industrial Grade and Environmental  Industrial operating temperature range (−40 °C to 100 °C) and RoHS compliance for regulated supply chains.
  • Power  Device operates with a core supply in the range of 1.14 V to 1.26 V as specified for this part.

Typical Applications

  • Industrial Control  Use as a mid-density FPGA for control logic, real-time I/O aggregation, and deterministic interface handling in industrial systems, leveraging the industrial temperature rating.
  • High-speed Memory Interfaces  Implement DDR/DDR2 interfaces and memory controllers using the family’s pre‑engineered source-synchronous interface support.
  • Display and Video Interfaces  Support display links and multi-lane LVDS signaling with the LatticeXP2 family’s dedicated serial interface capabilities.
  • Signal Processing / DSP  Offload multiply–accumulate and fixed-point DSP tasks to on-chip sysDSP resources and dedicated multipliers.

Unique Advantages

  • Instant-on non-volatile configuration: Built-in flexiFLASH provides immediate start-up without external volatile configuration memory.
  • Secure live updates: TransFR live update technology and 128‑bit AES support enable secure field updates and dual-boot configurations.
  • High I/O density in a compact package: 358 available I/O in a 484-ball fpBGA (23×23 mm) for designs that require many external interfaces.
  • Balanced logic and memory: Approximately 17,000 logic elements together with ~0.28 Mbits of embedded RAM suit mixed control and buffering tasks.
  • Industrial robustness: Rated for −40 °C to 100 °C operation and RoHS compliant for industrial deployments.
  • Family-level design support: LatticeXP2 family features such as sysDSP, PLLs, and pre-engineered interfaces simplify system integration.

Why Choose LFXP2-17E-6FN484I?

The LFXP2-17E-6FN484I delivers a balanced combination of mid-range logic capacity, embedded RAM, and high I/O density in a single industrial-grade fpBGA package. Its flexiFLASH architecture and family-level Live Update security features make it well suited for embedded systems that require instant-on behavior and secure reconfiguration.

Designers seeking moderate DSP capability, robust interface support, and the ability to scale within the LatticeXP2 family will find this device applicable for a range of industrial and embedded applications. Family-level tools and pre-engineered IP support ease development and enable reliable product rollouts.

Request a quote or submit a request to receive pricing and availability information for the LFXP2-17E-6FN484I. Our team can help provide further technical details and support for your design evaluation.

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