LFXP2-17E-6FTN256C

IC FPGA 201 I/O 256FTBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 201 282624 17000 256-LBGA

Quantity 503 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O201Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2125Number of Logic Elements/Cells17000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFXP2-17E-6FTN256C – XP2 Field Programmable Gate Array (FPGA), 17K Logic Elements

The LFXP2-17E-6FTN256C is a LatticeXP2 family FPGA in a 256-ball LBGA package designed for compact, reconfigurable system designs. It combines a LUT-based FPGA fabric with non-volatile flash architecture (flexiFLASH) to deliver instant-on, infinitely reconfigurable logic suitable for applications requiring flexible I/O, embedded memory and DSP acceleration.

This device targets designs needing moderate logic density and rich I/O connectivity, with a commercial grade operating range and low-voltage supply compatibility for modern embedded systems.

Key Features

  • Core Logic – Approximately 17,000 logic elements provide a balanced resource set for custom logic, glue logic and mid-sized FPGA functions.
  • flexiFLASH Architecture – Flash-based instant-on reconfigurability with flash-backed embedded memory for non-volatile configuration and design security.
  • Live Update and Security – Family-level Live Update technology including secure update capability and dual-boot with external SPI as described for the LatticeXP2 family.
  • sysDSP Blocks – Dedicated multiply-accumulate blocks (sysDSP) and up to 18×18 multipliers in the family enable high-performance arithmetic acceleration for signal processing tasks.
  • Embedded Memory – Total on-chip RAM of 282,624 bits (approximately 0.28 Mbits) for embedded and distributed memory requirements.
  • Flexible I/O – Up to 201 user I/Os in the 256-LBGA package with family support for numerous I/O standards and source-synchronous interfaces (DDR/DDR2, LVDS variants, PCI, etc.).
  • Clocking – Multiple analog PLLs per device in the family support clock multiply/divide and phase shifting for system clock management.
  • Power and Temperature – Low-voltage operation with a specified supply range of 1.14 V to 1.26 V and commercial operating temperature from 0 °C to 85 °C.
  • Package – Compact 256-ball LBGA (supplier device package: 256-FTBGA, 17×17 mm) for space-constrained board designs and high I/O density.
  • Regulatory – RoHS compliant.

Typical Applications

  • Display and Video Interfaces – Source-synchronous LVDS interfaces and pre-engineered display interfaces in the family support display processing and interface bridging.
  • Memory Interface & Buffering – DDR/DDR2 source-synchronous interface support enables use as a memory controller front-end or interface bridge in embedded systems.
  • Signal Processing & Acceleration – sysDSP blocks and hardware multipliers are suitable for embedded signal processing, filtering and MAC-heavy tasks.
  • High-speed Serial and Networking – Flexible I/O standards and plentiful I/O count allow implementation of custom serial interfaces, bridging and protocol offload functions.

Unique Advantages

  • Instant-on non-volatile configuration: flexiFLASH architecture provides immediate startup behavior without external configuration steps.
  • Secure, field-update capable: Family-level Live Update features and dual-boot support enable secure remote updates and deployment flexibility.
  • Dedicated DSP resources: sysDSP blocks and multiple multipliers accelerate arithmetic-intensive workloads and reduce reliance on external processors.
  • Compact, high-density packaging: 256-LBGA (17×17 mm) offers a small PCB footprint with up to 201 user I/Os for dense designs.
  • Low-voltage operation: Specified supply range around 1.2 V aligns with modern low-voltage system rails.
  • RoHS compliant: Meets common environmental requirements for commercial electronic assemblies.

Why Choose LFXP2-17E-6FTN256C?

The LFXP2-17E-6FTN256C provides a balanced combination of reconfigurable logic, embedded memory and dedicated DSP resources in a compact 256-LBGA package. Its flash-based flexiFLASH architecture delivers instant-on behavior and field reconfigurability while family-level Live Update and security features support maintainable, updatable designs.

This device is well suited to customers building mid-range embedded systems that require flexible I/O, moderate logic density and on-chip DSP acceleration—offering scalability within the LatticeXP2 family and support for a variety of source-synchronous and high-speed interface use cases.

Request a quote or submit a purchase inquiry to get pricing and availability for the LFXP2-17E-6FTN256C.

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