LFXP2-17E-6FTN256I

IC FPGA 201 I/O 256FTBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 201 282624 17000 256-LBGA

Quantity 1,364 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / CaseTrayNumber of I/O201Voltage1.14 V
Mounting MethodSurface MountRoHS ComplianceN/AREACH ComplianceN/A
Moisture Sensitivity LevelN/ANumber of LABs/CLBs2125Number of Logic Elements/Cells17000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits282624

Overview of LFXP2-17E-6FTN256I – XP2 Field Programmable Gate Array (FPGA) IC 201 282624 17000 256-LBGA

The LFXP2-17E-6FTN256I is a flash-based LatticeXP2 family FPGA delivering 17,000 logic elements, approximately 282,624 bits of embedded RAM, and up to 201 user I/Os in a 256-ball ftBGA (17×17 mm) package. Engineered for industrial applications, this device combines non-volatile flexiFLASH configuration with on-chip memory and DSP resources for instant-on reconfigurable designs.

Its architecture and feature set suit applications that require flexible I/O, embedded memory, DSP acceleration and secure in-field updates while operating across an industrial temperature range.

Key Features

  • Core Logic — 17,000 logic elements provide the programmable fabric for glue logic, control, and custom processing functions.
  • Embedded Memory — Approximately 282,624 bits (≈276 Kbits) of on-chip RAM for frame buffering, data buffering, and state storage.
  • I/O Density & Flexibility — Up to 201 user I/Os in a 256-FTBGA (17×17 mm) package; sysIO buffer supports multiple I/O standards for mixed-signal interfacing.
  • DSP and Arithmetic Blocks — sysDSP resources with support for 18×18 multipliers (20 18×18 multipliers for the XP2-17 configuration) for high-performance multiply-accumulate operations.
  • Flash-based flexiFLASH Architecture — Instant-on, single-chip flash configuration with FlashBAK and Serial TAG memory for embedded non-volatile storage and design security.
  • Live Update & Security — TransFR live update technology with secure update support and 128-bit AES encryption; dual-boot with external SPI supported at the family level.
  • Power and Operating Range — Core supply specified at 1.14 V; rated for industrial temperature operation from −40 °C to 100 °C.
  • Packaging & Mounting — Surface-mount 256-ball ftBGA (17×17 mm) package supplied in tray format for PCB assembly.

Typical Applications

  • High-speed Memory Interfaces — Pre-engineered DDR/DDR2 interface support for memory bridging and buffering tasks where synchronous data transfer is required.
  • Display and Video Links — Support for multi-lane LVDS and 7:1 LVDS interfaces suitable for display pipelines and source-synchronous video interfaces.
  • DSP-Accelerated Processing — On-chip sysDSP blocks and 18×18 multipliers for signal processing, filtering, and MAC-heavy algorithms.
  • Secure Field Updates — Devices that require secure over-the-air or in-system firmware updates using AES encryption and dual-boot architecture.

Unique Advantages

  • Instant-on Non-volatile Configuration: Flash-based flexiFLASH enables immediate startup without external configuration memory.
  • Integrated DSP Acceleration: Dedicated sysDSP blocks and multiple 18×18 multipliers reduce external component count for arithmetic-heavy functions.
  • High I/O Count in Compact Package: 201 I/Os in a 256-FTBGA (17×17 mm) provides dense connectivity while minimizing PCB area.
  • Secure Update Path: Live Update and TransFR technologies with 128-bit AES support enable controlled, secure in-field reprogramming.
  • Industrial Temperature Rating: Specified for −40 °C to 100 °C operation, supporting deployment in industrial environments.
  • Embedded Memory Resources: Nearly 282,624 bits of on-chip RAM support buffering and state retention without immediate external memory.

Why Choose LFXP2-17E-6FTN256I?

The LFXP2-17E-6FTN256I positions itself as a versatile, flash-configured FPGA option for industrial designs that require a balance of logic capacity, embedded memory, DSP capability and high I/O density in a compact BGA package. Its flexiFLASH architecture and secure Live Update features simplify system-level design for applications that need instant-on behavior and controlled firmware updates.

Designed to integrate with the LatticeXP2 family ecosystem, the device is well-suited for engineers developing display interfaces, memory bridges, DSP-accelerated functions and secure in-field update flows who value scalability, embedded resources and industrial temperature operation.

Request a quote or submit a product inquiry today to evaluate the LFXP2-17E-6FTN256I for your next embedded or industrial FPGA design.

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