LFXP2-17E-7F484C

IC FPGA 358 I/O 484FBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 358 282624 17000 484-BBGA

Quantity 275 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O358Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2125Number of Logic Elements/Cells17000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFXP2-17E-7F484C – XP2 Field Programmable Gate Array (FPGA) IC, 17K Logic Elements, 358 I/O

The LFXP2-17E-7F484C is a commercial-grade FPGA from the LatticeXP2 family featuring flash-based flexiFLASH architecture for instant-on, single-chip reconfigurability. It combines a LUT-based programmable fabric, embedded memory, dedicated DSP resources and flexible I/O to address a wide range of embedded and system-level applications.

Key attributes include approximately 17,000 logic elements, roughly 282,624 bits of on-chip RAM, up to 358 I/O in a 484-ball fpBGA package (23 × 23 mm), and a nominal supply range of 1.14 V to 1.26 V. The device is RoHS compliant and rated for commercial operating temperatures (0 °C to 85 °C).

Key Features

  • Core FPGA Fabric  Approximately 17,000 logic elements (LUT-based) providing programmable logic capacity for control, glue logic, and custom digital functions.
  • Embedded and Distributed Memory  Approximately 282,624 bits of on-chip RAM for embedded storage and buffering needs.
  • sysDSP Blocks & Multipliers  Dedicated sysDSP resources including multiple DSP blocks and 18 × 18 multipliers (family-level support) for multiply-accumulate and signal-processing tasks.
  • Flexible I/O  Up to 358 general-purpose I/O pins available in the 484-ball fpBGA (23 × 23 mm) package for broad interface connectivity and parallel/serial I/O requirements.
  • Configuration & Security  flexiFLASH architecture with instant-on and on-chip FlashBAK memory; Live Update technologies such as TransFR and 128-bit AES encryption for secure updates and dual-boot support (family-level features).
  • Clocking  Integrated PLL resources (family supports up to four analog PLLs) to support clock multiply/divide and phase-shifting requirements.
  • Power & Packaging  Operates from 1.14 V to 1.26 V supply and is available in a 484-ball fpBGA (23 × 23 mm) package; surface-mount mounting type for standard PCB assembly.
  • Compliance & Operating Range  RoHS compliant and specified for commercial temperature operation from 0 °C to 85 °C.

Typical Applications

  • Communications & Networking  Protocol bridging, packet processing, and interface adaptation using abundant I/O and on-chip memory for buffering and control logic.
  • Video & Display Systems  Source-synchronous interfaces and programmable logic enable timing control, parallel data handling, and display interface management.
  • Test & Measurement  Custom data acquisition front-ends, real-time processing and I/O aggregation leveraging DSP blocks and embedded RAM.
  • Consumer & Embedded Control  Flexible I/O and instant-on flash configuration make the device suitable for user-interface control, peripheral aggregation, and system glue logic in commercial products.

Unique Advantages

  • Instant-on, Flash-Based Architecture: flexiFLASH provides single-chip, non-volatile configuration so systems can power up ready without external configuration memory.
  • Secure Live Updates: Live Update features with TransFR and 128-bit AES encryption enable secure and flexible field updates and dual-boot configurations.
  • Balanced Integration: Combines programmable logic, embedded RAM and DSP resources in a single 484-ball fpBGA package to reduce BOM and board area.
  • High I/O Density: Up to 358 I/O pins support rich peripheral connectivity and multiple parallel interfaces from a compact package.
  • Controlled Supply Range: Tight nominal supply range (1.14 V–1.26 V) aligns with the device’s on-chip requirements for predictable power planning.
  • Commercial Temperature Rating: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial embedded applications.

Why Choose LFXP2-17E-7F484C?

The LFXP2-17E-7F484C delivers a flexible, flash-configured FPGA solution with approximately 17,000 logic elements, substantial on-chip memory, dedicated DSP resources and up to 358 I/O in a 484-ball fpBGA package. Its combination of instant-on configuration, secure update capabilities and integrated clocking makes it a practical option for commercial embedded systems that require reconfigurability and secure field updates.

This device suits design teams looking to consolidate logic, memory and DSP functions into a single programmable device while maintaining predictable supply and temperature specifications. The LatticeXP2 family feature set and ecosystem support help simplify design migration and long-term maintainability.

Request a quote or submit an inquiry to purchase the LFXP2-17E-7F484C and evaluate it for your next FPGA-based design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay
    Featured Products
    Latest News
    keyboard_arrow_up