LFXP2-17E-7F484C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 358 282624 17000 484-BBGA |
|---|---|
| Quantity | 275 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 358 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2125 | Number of Logic Elements/Cells | 17000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFXP2-17E-7F484C – XP2 Field Programmable Gate Array (FPGA) IC, 17K Logic Elements, 358 I/O
The LFXP2-17E-7F484C is a commercial-grade FPGA from the LatticeXP2 family featuring flash-based flexiFLASH architecture for instant-on, single-chip reconfigurability. It combines a LUT-based programmable fabric, embedded memory, dedicated DSP resources and flexible I/O to address a wide range of embedded and system-level applications.
Key attributes include approximately 17,000 logic elements, roughly 282,624 bits of on-chip RAM, up to 358 I/O in a 484-ball fpBGA package (23 × 23 mm), and a nominal supply range of 1.14 V to 1.26 V. The device is RoHS compliant and rated for commercial operating temperatures (0 °C to 85 °C).
Key Features
- Core FPGA Fabric Approximately 17,000 logic elements (LUT-based) providing programmable logic capacity for control, glue logic, and custom digital functions.
- Embedded and Distributed Memory Approximately 282,624 bits of on-chip RAM for embedded storage and buffering needs.
- sysDSP Blocks & Multipliers Dedicated sysDSP resources including multiple DSP blocks and 18 × 18 multipliers (family-level support) for multiply-accumulate and signal-processing tasks.
- Flexible I/O Up to 358 general-purpose I/O pins available in the 484-ball fpBGA (23 × 23 mm) package for broad interface connectivity and parallel/serial I/O requirements.
- Configuration & Security flexiFLASH architecture with instant-on and on-chip FlashBAK memory; Live Update technologies such as TransFR and 128-bit AES encryption for secure updates and dual-boot support (family-level features).
- Clocking Integrated PLL resources (family supports up to four analog PLLs) to support clock multiply/divide and phase-shifting requirements.
- Power & Packaging Operates from 1.14 V to 1.26 V supply and is available in a 484-ball fpBGA (23 × 23 mm) package; surface-mount mounting type for standard PCB assembly.
- Compliance & Operating Range RoHS compliant and specified for commercial temperature operation from 0 °C to 85 °C.
Typical Applications
- Communications & Networking Protocol bridging, packet processing, and interface adaptation using abundant I/O and on-chip memory for buffering and control logic.
- Video & Display Systems Source-synchronous interfaces and programmable logic enable timing control, parallel data handling, and display interface management.
- Test & Measurement Custom data acquisition front-ends, real-time processing and I/O aggregation leveraging DSP blocks and embedded RAM.
- Consumer & Embedded Control Flexible I/O and instant-on flash configuration make the device suitable for user-interface control, peripheral aggregation, and system glue logic in commercial products.
Unique Advantages
- Instant-on, Flash-Based Architecture: flexiFLASH provides single-chip, non-volatile configuration so systems can power up ready without external configuration memory.
- Secure Live Updates: Live Update features with TransFR and 128-bit AES encryption enable secure and flexible field updates and dual-boot configurations.
- Balanced Integration: Combines programmable logic, embedded RAM and DSP resources in a single 484-ball fpBGA package to reduce BOM and board area.
- High I/O Density: Up to 358 I/O pins support rich peripheral connectivity and multiple parallel interfaces from a compact package.
- Controlled Supply Range: Tight nominal supply range (1.14 V–1.26 V) aligns with the device’s on-chip requirements for predictable power planning.
- Commercial Temperature Rating: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial embedded applications.
Why Choose LFXP2-17E-7F484C?
The LFXP2-17E-7F484C delivers a flexible, flash-configured FPGA solution with approximately 17,000 logic elements, substantial on-chip memory, dedicated DSP resources and up to 358 I/O in a 484-ball fpBGA package. Its combination of instant-on configuration, secure update capabilities and integrated clocking makes it a practical option for commercial embedded systems that require reconfigurability and secure field updates.
This device suits design teams looking to consolidate logic, memory and DSP functions into a single programmable device while maintaining predictable supply and temperature specifications. The LatticeXP2 family feature set and ecosystem support help simplify design migration and long-term maintainability.
Request a quote or submit an inquiry to purchase the LFXP2-17E-7F484C and evaluate it for your next FPGA-based design.