LFXP2-17E-7FTN256C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 201 282624 17000 256-LBGA |
|---|---|
| Quantity | 1,159 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | Tray | Number of I/O | 201 | Voltage | 1.14 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | N/A | REACH Compliance | N/A | ||
| Moisture Sensitivity Level | N/A | Number of LABs/CLBs | 2125 | Number of Logic Elements/Cells | 17000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFXP2-17E-7FTN256C – XP2 FPGA, 17k logic elements, 201 I/O, 256-FTBGA
The LFXP2-17E-7FTN256C is a LatticeXP2 family field programmable gate array (FPGA) offered in a 256-ball ftBGA (17 × 17 mm) package. It combines a LUT-based FPGA fabric with on-chip flash configuration (flexiFLASH architecture) to deliver instant-on, reconfigurable logic for embedded designs.
Targeted for applications that require moderate logic density and a high I/O count, this commercial-grade device provides 17,000 logic elements, approximately 282,624 bits of on-chip RAM, and 201 user I/Os in a compact surface-mount package.
Key Features
- Core architecture – flexiFLASH On-chip flash-based configuration provides instant-on behavior, infinite reconfigurability, and integrated FlashBAK memory for non-volatile storage and design security.
- Live Update Technology Series features include TransFR live update capability, dual-boot support and secure updates with 128-bit AES encryption to help protect in-field configuration updates.
- DSP capabilities sysDSP blocks in the XP2 family support dedicated multipliers; the XP2-17 class provides block-level DSP resources suitable for multiply-accumulate tasks.
- Embedded and distributed memory Approximately 282,624 bits (≈276 Kbits) of on-chip RAM combined with distributed RAM resources for buffering, small-data storage, and state machines.
- Clocking Up to four analog PLLs per device in the family provide clock multiplication, division and phase shifting for flexible timing architectures.
- Flexible I/O buffer options Family-level I/O support includes a wide range of standards (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS), enabling diverse interface requirements.
- High I/O density 201 available I/Os on the 256-FTBGA package provide ample connectivity for parallel buses, external memory interfaces and multiple peripherals.
- Package and mounting 256-FTBGA (17 × 17 mm) surface-mount package, supplied in tray packaging for automated assembly.
- Commercial operating range Specified for 0 °C to 85 °C operation and a nominal supply specified at 1.14 V.
Typical Applications
- Display and video interfaces Support for 7:1 LVDS interfaces and flexible I/O standards make the device suitable for display bridging, timing control and panel interfaces.
- Memory and bus interfaces Pre-engineered source-synchronous interfaces and DDR/DDR2 interface support in the family enable use as memory controllers, buffer logic, or protocol bridging.
- Embedded control and glue logic Moderate logic density and plentiful I/O permit implementation of glue logic, sensor aggregation, and peripheral control in compact systems.
- Secure in-field update systems Built-in secure update features (128-bit AES encryption and dual-boot support) are suited to products that require controlled configuration updates.
Unique Advantages
- Integrated flash configuration: flexiFLASH architecture delivers instant-on functionality and on-chip non-volatile storage, removing the need for external configuration memory.
- Secure update path: TransFR and 128-bit AES encryption enable secure, authenticated configuration updates and dual-boot deployment strategies.
- Balanced logic and I/O: 17,000 logic elements paired with 201 I/Os in a compact 256-FTBGA package provides a strong balance of compute and connectivity for mid-density designs.
- On-chip RAM resources: Approximately 282,624 bits of embedded memory support buffering, state retention and small-data storage without resorting to external SRAM.
- Design ecosystem support: The LatticeXP2 family is supported by Lattice design tools and pre-engineered IP, helping accelerate development and floorplanning for complex designs.
Why Choose LFXP2-17E-7FTN256C?
The LFXP2-17E-7FTN256C is positioned for designers who need a commercially graded, mid-density FPGA with robust on-chip configuration, secure update capability, and a high I/O count in a small footprint. Its combination of approximately 17,000 logic elements, ~282.6 Kbits of on-chip RAM and 201 I/Os in a 256-FTBGA package makes it suitable for display interfaces, memory bridging and general embedded control tasks.
Backed by the LatticeXP2 family architecture and available design IP and tooling, the device offers a practical route to scalable, reconfigurable hardware with integrated flash configuration and security features for long-term product maintainability.
Request a quote or submit a request for pricing and availability to move your design forward with the LFXP2-17E-7FTN256C.