LFXP2-17E-7FTN256C

IC FPGA 201 I/O 256FTBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 201 282624 17000 256-LBGA

Quantity 1,159 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / CaseTrayNumber of I/O201Voltage1.14 V
Mounting MethodSurface MountRoHS ComplianceN/AREACH ComplianceN/A
Moisture Sensitivity LevelN/ANumber of LABs/CLBs2125Number of Logic Elements/Cells17000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits282624

Overview of LFXP2-17E-7FTN256C – XP2 FPGA, 17k logic elements, 201 I/O, 256-FTBGA

The LFXP2-17E-7FTN256C is a LatticeXP2 family field programmable gate array (FPGA) offered in a 256-ball ftBGA (17 × 17 mm) package. It combines a LUT-based FPGA fabric with on-chip flash configuration (flexiFLASH architecture) to deliver instant-on, reconfigurable logic for embedded designs.

Targeted for applications that require moderate logic density and a high I/O count, this commercial-grade device provides 17,000 logic elements, approximately 282,624 bits of on-chip RAM, and 201 user I/Os in a compact surface-mount package.

Key Features

  • Core architecture – flexiFLASH On-chip flash-based configuration provides instant-on behavior, infinite reconfigurability, and integrated FlashBAK memory for non-volatile storage and design security.
  • Live Update Technology Series features include TransFR live update capability, dual-boot support and secure updates with 128-bit AES encryption to help protect in-field configuration updates.
  • DSP capabilities sysDSP blocks in the XP2 family support dedicated multipliers; the XP2-17 class provides block-level DSP resources suitable for multiply-accumulate tasks.
  • Embedded and distributed memory Approximately 282,624 bits (≈276 Kbits) of on-chip RAM combined with distributed RAM resources for buffering, small-data storage, and state machines.
  • Clocking Up to four analog PLLs per device in the family provide clock multiplication, division and phase shifting for flexible timing architectures.
  • Flexible I/O buffer options Family-level I/O support includes a wide range of standards (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS), enabling diverse interface requirements.
  • High I/O density 201 available I/Os on the 256-FTBGA package provide ample connectivity for parallel buses, external memory interfaces and multiple peripherals.
  • Package and mounting 256-FTBGA (17 × 17 mm) surface-mount package, supplied in tray packaging for automated assembly.
  • Commercial operating range Specified for 0 °C to 85 °C operation and a nominal supply specified at 1.14 V.

Typical Applications

  • Display and video interfaces Support for 7:1 LVDS interfaces and flexible I/O standards make the device suitable for display bridging, timing control and panel interfaces.
  • Memory and bus interfaces Pre-engineered source-synchronous interfaces and DDR/DDR2 interface support in the family enable use as memory controllers, buffer logic, or protocol bridging.
  • Embedded control and glue logic Moderate logic density and plentiful I/O permit implementation of glue logic, sensor aggregation, and peripheral control in compact systems.
  • Secure in-field update systems Built-in secure update features (128-bit AES encryption and dual-boot support) are suited to products that require controlled configuration updates.

Unique Advantages

  • Integrated flash configuration: flexiFLASH architecture delivers instant-on functionality and on-chip non-volatile storage, removing the need for external configuration memory.
  • Secure update path: TransFR and 128-bit AES encryption enable secure, authenticated configuration updates and dual-boot deployment strategies.
  • Balanced logic and I/O: 17,000 logic elements paired with 201 I/Os in a compact 256-FTBGA package provides a strong balance of compute and connectivity for mid-density designs.
  • On-chip RAM resources: Approximately 282,624 bits of embedded memory support buffering, state retention and small-data storage without resorting to external SRAM.
  • Design ecosystem support: The LatticeXP2 family is supported by Lattice design tools and pre-engineered IP, helping accelerate development and floorplanning for complex designs.

Why Choose LFXP2-17E-7FTN256C?

The LFXP2-17E-7FTN256C is positioned for designers who need a commercially graded, mid-density FPGA with robust on-chip configuration, secure update capability, and a high I/O count in a small footprint. Its combination of approximately 17,000 logic elements, ~282.6 Kbits of on-chip RAM and 201 I/Os in a 256-FTBGA package makes it suitable for display interfaces, memory bridging and general embedded control tasks.

Backed by the LatticeXP2 family architecture and available design IP and tooling, the device offers a practical route to scalable, reconfigurable hardware with integrated flash configuration and security features for long-term product maintainability.

Request a quote or submit a request for pricing and availability to move your design forward with the LFXP2-17E-7FTN256C.

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