LFXP2-17E-7FN484C

The LFXP2-17E-7FN484C is a Lattice XP2 series FPGA that combines a LUT-based FPGA fabric with integrated non-volatile flash architecture. It delivers approximately 17,000 logic elements, about 282,624 bits of on-chip RAM, and up to 358 user I/Os in a 484-ball fpBGA (23 × 23 mm) package for compact, board-level integration.

Designed for commercial embedded applications, the device emphasizes instant-on configuration, live update capabilities and on-chip DSP resources to support medium-density control, interface and signal-processing tasks where integration, reconfigurability and secure updates are required.

Key Features

• flexiFLASH Architecture  Instant-on, single-chip flash-based configuration with FlashBAK embedded block memory and Serial TAG memory for design security and on-chip non-volatile storage.
• Live Update & Security  TransFR live update technology with support for dual-boot and secure updates using 128-bit AES encryption.
• Logic Capacity  Approximately 17,000 logic elements suitable for mid-range FPGA designs and moderate complexity logic implementation.
• Embedded Memory  Approximately 0.283 Mbits (282,624 bits) of on-chip RAM for implemented controllers, buffers and state storage.
• sysDSP Blocks & Multipliers  Devices in the XP2-17 class include sysDSP blocks and dedicated multipliers for efficient multiply-accumulate operations; suitable for signal processing tasks.
• Clocking  Up to four analog PLLs per device to support clock multiply/divide and phase shifting for timing and interface requirements.
• Flexible I/O  Up to 358 I/Os in the 484-ball fpBGA package; sysIO buffers and pre-engineered source synchronous interfaces (including DDR/DDR2 support to 200 MHz and multi-level serial interfaces) are supported by the family.
• Power & Mounting  Low-voltage operation with a supply range of 1.14 V to 1.26 V and surface-mount fpBGA package (484-FPBGA, 23 × 23 mm) for high-density PCBs.
• Commercial Grade & Compliance  Commercial temperature range of 0 °C to 85 °C and RoHS-compliant construction.

Typical Applications

• Communications & Networking  Board-level protocol bridging, SERDES front-end logic and interface control using the device's flexible I/O and pre-engineered source-synchronous interfaces.
• Display & Imaging  Display interface support and LVDS-capable I/O for panels and video transport applications where source-synchronous links and on-chip DSP accelerate pixel or data handling.
• Embedded Control  General-purpose control and state-machine implementations for commercial embedded products that benefit from instant-on and reconfigurable flash-based configuration.
• Test & Measurement  Signal processing and custom measurement logic using sysDSP blocks and on-chip RAM for buffering and accumulation.

Unique Advantages

• Instant-on, Reconfigurable Flash  The flexiFLASH approach provides single-chip non-volatile configuration and FlashBAK memory for immediate startup and field reconfiguration without external configuration ROM.
• Secure Live Updates  TransFR live update technology with 128-bit AES encryption and dual-boot support enables secure firmware updates while maintaining system availability.
• Balanced Integration  Combination of ~17,000 logic elements, embedded RAM and multiple DSP multipliers offers a compact mid-range solution that reduces external component count.
• High I/O Density  358 available I/Os in a 484-ball fpBGA footprint allow extensive peripheral and high-speed interface connectivity on a single device.
• Compact, Low-Voltage Design  1.14–1.26 V supply range and surface-mount fpBGA package support dense, low-power board designs compatible with modern commercial products.

Why Choose LFXP2-17E-7FN484C?

The LFXP2-17E-7FN484C positions itself as a mid-density, flash-configured FPGA optimized for commercial embedded systems that require instant-on behavior, secure update paths and a balanced mix of logic, memory and DSP resources. Its 358 I/Os and compact 484-ball fpBGA package make it a practical choice where board space and interface density matter.

Supported by family-level features such as multiple PLLs, pre-engineered source-synchronous interfaces and available design tools and IP from the vendor, the device is suited to designers seeking a reconfigurable, field-updatable platform with on-chip non-volatile configuration and moderate signal-processing capability.

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