LFXP2-17E-6QN208C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 146 282624 17000 208-BFQFP |
|---|---|
| Quantity | 1,115 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 146 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2125 | Number of Logic Elements/Cells | 17000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFXP2-17E-6QN208C – LatticeXP2 FPGA, 17,000 logic elements, 146 I/O, 208-BFQFP
The LFXP2-17E-6QN208C is a flash-based FPGA IC from the LatticeXP2 family, featuring the flexiFLASH architecture for instant-on, single-chip reconfigurability and on-chip flash storage. It targets mid-range programmable logic applications that require a balance of logic density, embedded memory and a flexible I/O complement.
Key device attributes include 17,000 logic elements, approximately 0.283 Mbits of on-chip RAM (282,624 bits), 146 user I/Os in a 208-pin BFQFP package, and operation from a 1.14 V to 1.26 V supply within a commercial temperature range of 0 °C to 85 °C. The part is RoHS compliant.
Key Features
- Core Architecture — flexiFLASH Flash-based single-chip architecture provides instant-on operation and infinite reconfigurability with embedded FlashBAK and serial TAG memory capabilities.
- Logic Density Approximately 17,000 logic elements to implement mid-range FPGA designs and custom logic blocks.
- Embedded Memory Approximately 282,624 bits of on-chip RAM for distributed and block memory requirements.
- sysDSP and Multiply Resources Family-level sysDSP blocks provide hardware multiply and accumulate resources; the XP2-17 class includes multiple DSP blocks and 18×18 multiplier resources for high-performance arithmetic.
- I/O Flexibility 146 user I/Os in a 208-BFQFP package support a wide range of source-synchronous interfaces and signaling standards documented for the LatticeXP2 family.
- Configuration & Security Live Update technology (TransFR), dual-boot support and 128-bit AES encryption enable secure updates and protected bitstreams at the family level.
- Clocking Multiple on-chip PLLs for clock multiply, divide and phase shifting as provided across the LatticeXP2 family.
- Package & Supply Surface-mount package case 208-BFQFP (supplier package noted as 208-PQFP, 28×28 mm), and device operation with a nominal 1.2 V class supply range of 1.14 V to 1.26 V.
- Commercial Grade & Compliance Rated for commercial operation from 0 °C to 85 °C and listed as RoHS compliant.
Typical Applications
- Display and video interfaces — Support for LVDS and pre-engineered source-synchronous interfaces in the LatticeXP2 family makes this device suitable for display timing and bridging functions.
- Memory interface and buffering — Family-level support for DDR/DDR2 source-synchronous interfaces (documented up to 200 MHz) enables memory interface and interface bridging designs.
- Embedded control and system glue — Mid-range logic density, flexible I/O and on-chip memory make the device a fit for embedded control, peripheral aggregation and custom I/O logic in commercial products.
- Secure field updates — Live Update and encryption features at the family level enable systems that require secure, in-field configuration updates and dual-boot deployment models.
Unique Advantages
- Highly integrated mid-range FPGA: 17,000 logic elements and substantial on-chip RAM provide a compact platform for integrating multiple functions onto a single device.
- Instant-on, non-volatile configuration: flexiFLASH architecture provides single-chip flash-based configuration for immediate startup without external configuration memory.
- Secure and updateable: Live Update technology with TransFR and 128-bit AES encryption supports secure, field-updatable designs and dual-boot configurations (family-level features).
- DSP acceleration: sysDSP blocks and dedicated multipliers supply hardware acceleration for arithmetic-intensive algorithms (family-level capabilities available in the XP2-17 class).
- Flexible I/O and clocking: 146 I/Os and multiple on-chip PLLs support diverse signaling requirements and precise clock management for system-level interfacing.
- Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C operation and RoHS compliant for general commercial applications.
Why Choose LFXP2-17E-6QN208C?
The LFXP2-17E-6QN208C delivers a balanced combination of logic capacity, embedded memory and I/O density in a flash-configured FPGA. Its flexiFLASH architecture and family-level Live Update/security features make it suitable for commercial embedded designs that need instant-on behavior and secure configuration updates.
This device is well suited for developers building mid-range programmable solutions—such as display interfaces, memory bridging and embedded control functions—who value a compact, flash-based FPGA platform with flexible I/O and DSP resources. The combination of on-chip memory, multiplier blocks and PLLs supports system integration while maintaining a small BOM footprint.
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