LFXP2-17E-6FT256C

The LFXP2-17E-6FT256C is a Lattice XP2 family Field Programmable Gate Array (FPGA) supplied in a 256-ball LBGA package (17 × 17 mm). It combines a LUT-based FPGA fabric with embedded flash-based configuration and on‑chip memory to support reconfigurable logic for commercial embedded designs.

With 17,000 logic elements, 201 I/O pins, and approximately 0.283 Mbits of on-chip RAM, this device targets commercial applications requiring flexible I/O, embedded memory, and DSP acceleration within a compact surface-mount package. The device operates from a 1.14 V to 1.26 V supply and across a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 17,000 logic elements suitable for mid-range FPGA implementations and design migration within the XP2 family.
• Embedded Memory — Total on-chip RAM of 282,624 bits (approximately 0.283 Mbits) for distributed and embedded storage of data and state.
• DSP and Multiply Resources — Family-level sysDSP resources and 18×18 multipliers are available in the LatticeXP2 family to support multiply-accumulate and high-performance arithmetic (refer to family datasheet for block counts).
• I/O Flexibility — 201 I/O pins in the 256-LBGA package support a wide range of interfacing needs for peripherals and external memory.
• Configuration and Security — Flash-based configuration architecture (flexiFLASH family capabilities) enables instant-on and non-volatile device configuration with family-level support for secure update mechanisms.
• Power — Narrow operating supply range of 1.14 V to 1.26 V simplifies power rail design for the device.
• Package and Mounting — 256-ball LBGA (supplier device package 256-FTBGA, 17×17) in a surface-mount form factor for space-constrained PCBs.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C, matching typical commercial embedded product requirements.

Typical Applications

• Embedded Control and Protocol Bridging — Use the FPGA fabric and flexible I/O to implement custom protocol conversion, glue logic, and control engines in compact commercial devices.
• Display and Interface Processing — The device’s I/O count and family-level source-synchronous I/O support make it suitable for display interface and high-speed I/O buffering tasks.
• DSP Acceleration — On-chip multipliers and sysDSP resources (as provided by the XP2 family) enable signal processing tasks such as filtering and real-time arithmetic acceleration.
• Memory Interface and Glue Logic — Embedded RAM and abundant I/O allow implementation of memory interfaces, FIFOs, and protocol timing logic for commercial computing and communications equipment.

Unique Advantages

• Non-volatile, instant-on capability: Family-level flexiFLASH architecture provides on-chip flash configuration for immediate startup without external configuration memory.
• Mid-range logic density with compact packaging: 17,000 logic elements in a 256-LBGA (17×17 mm) package balances integration and PCB space for commercial products.
• Embedded memory for system buffering: Approximately 0.283 Mbits of on-chip RAM supports local storage and buffering, reducing external memory dependence for many designs.
• High I/O count for system integration: 201 I/O pins enable direct interfacing to peripherals, displays, and external memories, simplifying board-level design.
• Commercial-grade temperature and supply compatibility: 0 °C to 85 °C rating and a 1.14 V–1.26 V supply range align with standard commercial embedded system requirements.

Why Choose LFXP2-17E-6FT256C?

The LFXP2-17E-6FT256C delivers a balanced combination of logic capacity, embedded memory, and flexible I/O in a compact 256-LBGA package for commercial embedded designs. It leverages the XP2 family’s flash-based configuration and DSP-oriented resources to accelerate development of mid-range FPGA applications that require instant-on configuration and secure update capabilities.

This part is well suited to embedded systems designers and OEMs who need a reconfigurable, non-volatile FPGA solution with a clear supply voltage and commercial temperature range, backed by the XP2 family architecture and supporting documentation.

Request a quote or submit a pricing inquiry to evaluate the LFXP2-17E-6FT256C for your next commercial embedded design project.