LFXP2-30E-5F484I

The LFXP2-30E-5F484I is a Lattice XP2 series FPGA in a 484-ball fpBGA package optimized for industrial applications. It combines a LUT-based FPGA fabric with on-chip non-volatile flash architecture and is targeted at designs that require high I/O density, embedded memory, and DSP capability in a compact surface-mount package.

This device is suited for industrial control, communications and display interface designs that benefit from instant-on configuration, flexible I/O standards, and a wide operating temperature range.

Key Features

• Core Architecture (flexiFLASH) Instant-on, single-chip flash-based configuration providing infinitely reconfigurable operation and on-chip non-volatile storage.
• Live Update and Security Supports secure updates with TransFR technology and 128‑bit AES encryption and dual-boot capability as part of the family’s Live Update features.
• Logic Capacity Approximately 29,000 logic elements to implement moderate-to-complex digital designs.
• Embedded and Distributed Memory Total on-chip RAM of 396,288 bits (approximately 0.4 Mbits) for embedded buffers, FIFOs and local storage.
• sysDSP and Multipliers Family-level sysDSP blocks and multiple 18×18 multiplier resources provide hardware support for multiply-accumulate functions and signal processing workloads.
• Flexible I/O and Interfaces Supports a broad set of I/O standards and pre-engineered source-synchronous interfaces including DDR/DDR2 (up to 200 MHz), LVDS display interfaces and XGMII-capable signaling.
• Programmable Clocking Up to four analog PLLs per device for clock multiplication, division and phase shifting.
• Power and Temperature Operating supply range of 1.14 V to 1.26 V and qualified for an operating temperature range from −40 °C to 100 °C.
• Package and I/O 484-ball fpBGA (23 × 23 mm) 484‑BBGA package with 363 available I/Os in this device configuration; surface-mount package type.
• Industrial Grade Specified as Industrial grade for applications requiring extended temperature operation.
• Standards and System Support Family-level support for IEEE 1149.1 and IEEE 1532 and integrated on-chip oscillator for initialization and general use.

Typical Applications

• Industrial Control: Implement motor control logic, sensor interfacing and deterministic I/O aggregation using the device’s high I/O count and extended temperature rating.
• Memory and Buffering Interfaces: Implement DDR/DDR2 memory interfaces and on-board buffering using the device’s pre-engineered source-synchronous interfaces and embedded RAM.
• Display and Video Interfaces: Drive high-speed LVDS and 7:1 display links and manage display timing with available PLLs and I/O flexibility.
• Signal Processing and DSP Tasks: Use sysDSP blocks and multiplier resources for multiply-accumulate workloads such as filtering and real-time data processing.
• Communications and Networking: Implement protocol bridging, packet processing and synchronous interfaces leveraging flexible I/O standards and XGMII-capable signalling.

Unique Advantages

• Instant-on, Single-Chip Configuration: On-chip flash-based flexiFLASH architecture enables immediate availability after power-up and reduces external configuration components.
• Secure Field Updates: Live Update technologies with 128‑bit AES encryption and dual-boot capability help enable secure firmware updates and rollback strategies.
• High I/O Density in a Compact Footprint: 363 I/Os in a 23 × 23 mm fpBGA help consolidate signals and reduce board-level routing complexity.
• Integrated DSP and Memory Resources: sysDSP blocks, multipliers and roughly 0.4 Mbits of on-chip RAM provide local compute and storage for real-time processing and buffering.
• Flexible Clocking and Interface Support: Up to four PLLs and broad I/O standard support make it easier to adapt to varying timing and signaling requirements.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in harsh or temperature-variable environments.

Why Choose LFXP2-30E-5F484I?

The LFXP2-30E-5F484I offers a balanced combination of logic capacity, on-chip non-volatile configuration, embedded memory and DSP resources in a high-density fpBGA package. It is positioned for industrial and embedded designs that require a compact, reconfigurable device with secure update capabilities and a wide operating temperature range.

This device is well suited for engineers looking to integrate multiple interface types, perform on-chip signal processing, and reduce external configuration and memory components while maintaining robust operation across industrial temperature conditions.

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