LFXP2-17E-5QN208I

The LFXP2-17E-5QN208I is a Lattice XP2™ family FPGA featuring a flexiFLASH™ architecture that combines LUT-based programmable fabric with on-chip non-volatile flash. This device targets industrial applications that require instant-on reconfigurability, embedded memory, and a rich DSP and I/O feature set.

With 17,000 logic elements, approximately 0.28 Mbits of on-chip RAM, and 146 I/Os in a 208-BFQFP package, the part delivers a balance of integration, configurable DSP capability and flexible interfacing for mid-density embedded systems.

Key Features

• Core Logic 17,000 logic elements provide a mid-density programmable fabric suitable for control, data-path and glue-logic implementations.
• Embedded Memory Total on-chip RAM: 282,624 bits (approximately 0.28 Mbits) for distributed and embedded storage of buffers and state.
• sysDSP and Multipliers Family-level sysDSP resources include dedicated DSP blocks; XP2-17 devices provide sysDSP blocks and 18×18 multipliers for high-performance multiply-accumulate operations.
• Flexible I/O 146 I/Os in the 208-BFQFP package with family support for a broad set of standards (LVCMOS, LVDS, SSTL, HSTL, PCI class interfaces and more), enabling diverse interface options.
• Configuration and Security flexiFLASH architecture with instant-on, FlashBAK™ embedded memory, Serial TAG memory and Live Update technologies including TransFR and 128‑bit AES encryption for secure updates and dual-boot capability.
• Clocking Up to four analog PLLs per device (sysCLOCK™) offering clock multiply/divide and phase shift capabilities for system timing requirements.
• Memory Interface Support Pre-engineered source-synchronous interfaces including DDR/DDR2 support to 200 MHz and multi-LVDS options for high-speed link and display applications.
• Power and Temperature Low-voltage operation with supply range 1.14 V to 1.26 V. Industrial-grade operation across −40 °C to 100 °C.
• Package & Mounting 208-BFQFP (supplier 208-PQFP, 28 × 28 mm) surface-mount package with RoHS compliance.

Typical Applications

• Industrial Control Deterministic logic, timing and DSP resources suit motor control, PLC front-ends, and machine interface functions across industrial temperature ranges.
• Communications and Networking Flexible I/O standards and pre-engineered source-synchronous interfaces support protocol bridging, PHY interfacing and mid-range packet-processing functions.
• Display and Imaging LVDS and source-synchronous interface support enable display timing, video pre-processing and signal routing in embedded display subsystems.
• Embedded Signal Processing On-chip DSP blocks and multiple multipliers enable filtering, aggregation and real-time data-handling tasks in instrumentation and sensor aggregation.

Unique Advantages

• Instant-on non-volatile configuration: flexiFLASH architecture delivers immediate availability at power-up with on-chip flash storage for field reconfiguration.
• Balanced integration: 17,000 logic elements combined with embedded memory and DSP resources reduce external components and simplify board-level design.
• Secure live updates: Live Update (TransFR) and 128‑bit AES encryption enable secure, field-upgradable firmware and dual-boot strategies.
• Flexible interfacing: Broad I/O standard support and pre-engineered interfaces speed integration with DDR, LVDS and other high-speed links.
• Industrial robustness: Industrial temperature rating (−40 °C to 100 °C) and surface-mount packaging meet common embedded system requirements.
• Low-voltage operation: 1.14–1.26 V supply enables compatibility with 1.2 V system rails and optimized power architecture.

Why Choose LFXP2-17E-5QN208I?

The LFXP2-17E-5QN208I positions itself as a mid-density, industrial-grade FPGA with non-volatile configuration and a feature set geared toward embedded systems that require instant-on operation, secure updates, and dedicated DSP resources. Its combination of 17,000 logic elements, on-chip RAM and robust I/O in a 208-BFQFP package makes it suitable for designers seeking a single-chip solution to consolidate glue logic, interface functions and real-time processing.

Supported by the Lattice XP2 family architecture and associated design tools, the device offers a scalable path for designs that may benefit from migration across the XP2 family while retaining familiar configuration and interface options.

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