LFXP2-17E-5FT256I
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 201 282624 17000 256-LBGA |
|---|---|
| Quantity | 705 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 201 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2125 | Number of Logic Elements/Cells | 17000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFXP2-17E-5FT256I – XP2 Field Programmable Gate Array (FPGA), 17,000 logic elements
The LFXP2-17E-5FT256I is a LatticeXP2-family FPGA in a 256-ball BGA package optimized for industrial embedded applications. It couples a flash-based configuration architecture with on-chip programmable fabric to deliver instant-on, reconfigurable logic suitable for control, connectivity and signal-processing tasks.
This device provides approximately 17,000 logic elements, 282,624 bits of on-chip RAM, up to 201 I/Os and system-level features from the LatticeXP2 family such as secure Live Update and flexible I/O support, enabling compact, robust designs for industrial and communications markets.
Key Features
- Core FPGA fabric — Approximately 17,000 logic elements and family sysDSP resources (XP2-17: 5 sysDSP blocks) for mid-range logic and DSP implementations.
- On-chip memory — 282,624 total RAM bits (approximately 276 Kbits) of embedded memory for data buffering and state storage.
- DSP multipliers — Family-specified 18×18 multipliers (XP2-17: 20) to accelerate multiply-and-accumulate workloads.
- Flexible I/O — Up to 201 I/Os with sysIO buffer support across multiple standards and pre‑engineered source-synchronous interfaces including DDR/DDR2 (up to 200 MHz), LVDS and display-friendly LVDS ratios.
- Configuration and security — flexiFLASH architecture with instant-on and FlashBAK, Live Update (TransFR) and support for 128-bit AES encryption and dual-boot configurations.
- Clocking — Up to four analog PLLs for clock multiply, divide and phase shifting to support complex timing requirements.
- Power and thermal — Operates from 1.14 V to 1.26 V supply and rated for industrial temperatures from −40 °C to 100 °C.
- Package and mounting — Surface-mount 256-ball package; supplier device package specified as 256-FTBGA (17 × 17 mm) for compact board implementations.
- Compliance — RoHS compliant.
Typical Applications
- Industrial control — Deterministic logic and I/O density for machine control, motor drives and automation interfaces across an industrial temperature range.
- Communications and networking — I/O flexibility and PLL resources support interface bridging, packet processing and protocol adaptation.
- Display and video pre‑processing — Pre‑engineered source-synchronous interfaces and LVDS support for display timing and data alignment in embedded displays.
- Signal processing and sensor aggregation — sysDSP blocks and dedicated multipliers accelerate filtering, aggregation and sensor-data fusion tasks.
Unique Advantages
- Instant-on, flash-based configuration: flexiFLASH architecture enables immediate boot and in-field reconfiguration without external configuration steps.
- Secure firmware update: Live Update with TransFR and 128-bit AES encryption supports secure image updates and dual-boot strategies for robust field maintenance.
- Balanced logic and memory: 17,000 logic elements combined with 282,624 bits of embedded RAM deliver mid-range capacity for control and buffering without external SRAM in many designs.
- Wide industrial operating range: −40 °C to 100 °C rating and surface-mount ftBGA package support deployment in harsh environments and compact boards.
- Rich I/O and clocking: Up to 201 I/Os plus multiple PLLs and pre-engineered interfaces simplify integration with DDR, LVDS and other high-speed interfaces.
- Regulatory and supply readiness: RoHS compliance ensures environmental regulatory alignment for global product shipments.
Why Choose LFXP2-17E-5FT256I?
The LFXP2-17E-5FT256I positions itself as a compact, industrial-grade FPGA option for engineers who need flash-based instant-on behavior, secure update capability and a balanced mix of logic, DSP and embedded RAM. Its I/O count and PLL resources make it suitable for mid-range connectivity, display and signal-processing roles while the 256-ball ftBGA package supports space-constrained board designs.
Designed for developers and procurement teams seeking a robust, reconfigurable building block, this device provides long-term flexibility through in-field updates and family-level migration options offered by the LatticeXP2 architecture.
Request a quote or submit an inquiry to receive pricing, availability and ordering information for LFXP2-17E-5FT256I.