LFXP2-17E-5F484I
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 358 282624 17000 484-BBGA |
|---|---|
| Quantity | 538 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 358 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2125 | Number of Logic Elements/Cells | 17000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFXP2-17E-5F484I – XP2 Field Programmable Gate Array (FPGA) IC 358 282624 17000 484-BBGA
The LFXP2-17E-5F484I is an FPGA device from the LatticeXP2 family combining a LUT-based FPGA fabric with non-volatile flash configuration in a flexiFLASH architecture. It delivers reconfigurable logic, on-chip embedded memory and DSP resources in a compact 484-ball fpBGA package for industrial applications requiring high I/O density and robust operation.
Key value points include instant-on flash-based configuration, a high I/O count (358 pins), approximately 17,000 logic elements, and embedded memory for local data storage — all designed to simplify system integration and support secure field updates.
Key Features
- flexiFLASH architecture Instant-on, infinitely reconfigurable single-chip architecture with FlashBAK and Serial TAG memory for on-chip storage and design security.
- Live Update & Security TransFR live-update technology with secure updates using 128-bit AES encryption and support for dual-boot with external SPI.
- Logic Fabric LUT-based FPGA fabric offering approximately 17,000 logic elements for complex control, glue logic and custom processing tasks.
- On-chip Memory Approximately 0.283 Mbits (282,624 bits) of on-chip RAM for buffering, state storage and small data structures.
- sysDSP and Multiply Resources Device-level sysDSP capability including 5 sysDSP blocks and 20 18×18 multipliers for high-performance multiply-accumulate operations.
- Flexible I/O 358 I/Os with the LatticeXP2 family’s sysIO buffer support for standards such as LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS and others (family feature set).
- System Clocking Integrated PLL resources (family-level support) for clock multiply, divide and phase shifting to simplify timing architectures.
- Power and Temperature Operates from a supply range of 1.14 V to 1.26 V and specified for industrial temperatures from -40 °C to 100 °C.
- Package & Mounting 484-ball fpBGA (23 × 23 mm footprint) surface-mount package for compact board integration and high I/O density.
- Environmental Compliance RoHS compliant.
Typical Applications
- Industrial Control Ideal for embedded control systems and automation modules that require industrial temperature operation, extensive I/O and reconfigurable logic.
- Communications and Networking Suited for protocol bridging, packet processing and I/O-intensive interfaces where high I/O count and DSP multipliers accelerate data handling.
- Display and Video Interfaces Supports source-synchronous interfaces and LVDS-based link architectures (family features) useful for display front-ends and video transport.
- Secure Field-Updatable Systems Flash-based instant-on configuration combined with secure TransFR updates and AES encryption for deployable equipment requiring remote updates.
- Embedded System Integration Compact fpBGA package and on-chip memory make the device a good fit for space-constrained embedded designs that need local buffering and logic integration.
Unique Advantages
- Highly integrated solution: Combines ~17,000 logic elements, DSP resources and on-chip memory to reduce external components and simplify BOM.
- Instant-on, non-volatile configuration: Flash-based flexiFLASH architecture enables immediate device availability after power-up without external configuration memory.
- Secure update path: TransFR live-update technology with 128-bit AES encryption and dual-boot support lowers risk for field firmware updates.
- High I/O density in a compact footprint: 358 I/Os in a 484-ball fpBGA package supports complex system interfaces while conserving board area.
- Industrial reliability: Specified for -40 °C to 100 °C operation and RoHS compliance for deployment in industrial environments.
- Dedicated DSP resources: sysDSP blocks and 18×18 multipliers accelerate MAC operations, offloading arithmetic-intensive tasks from system processors.
Why Choose LFXP2-17E-5F484I?
The LFXP2-17E-5F484I positions itself as a versatile mid-density member of the LatticeXP2 family, offering a balance of logic capacity (approximately 17,000 logic elements), substantial I/O (358 pins) and integrated DSP and memory resources in a compact fpBGA package. Its flash-based configuration, secure update capabilities and industrial temperature rating make it suitable for embedded and industrial designs that require reliable, reconfigurable hardware with secure field maintenance.
Designers targeting systems that need immediate boot, flexible interface support and local arithmetic acceleration will find the LFXP2-17E-5F484I a practical option that reduces board-level complexity while providing long-term configurability and maintainability backed by the LatticeXP2 family feature set.
Request a quote or submit an inquiry to receive pricing and availability for the LFXP2-17E-5F484I. Our team can provide lead-time details and support for integrating this FPGA into your design.