LFXP2-17E-5FT256C

IC FPGA 201 I/O 256FTBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 201 282624 17000 256-LBGA

Quantity 708 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O201Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2125Number of Logic Elements/Cells17000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFXP2-17E-5FT256C – XP2 FPGA, 17,000 logic elements, 201 I/O, 256-LBGA

The LFXP2-17E-5FT256C is a field programmable gate array (FPGA) from the LatticeXP2 family, combining a LUT-based FPGA fabric with on-chip flash configuration. It delivers a mid-range balance of logic capacity and I/O density with 17,000 logic elements, 201 user I/O pins and approximately 0.28 Mbits of on-chip RAM (282,624 bits).

Designed for commercial-grade embedded systems, this surface-mount device supports flexible I/O standards, integrated DSP resources from the XP2 family, and flash-based configuration features for instant-on and secure updates.

Key Features

  • Core Density — 17,000 logic elements to implement medium-complexity digital designs and glue logic.
  • On-chip Memory — Approximately 0.28 Mbits of embedded RAM (282,624 bits) plus support for distributed memory as defined by the LatticeXP2 family.
  • DSP and Multipliers — XP2 family sysDSP blocks and 18×18 multiplier resources (XP2-17 class) for efficient multiply‑accumulate operations in signal processing paths.
  • I/O and Interface Support — 201 available I/O pins with the XP2 family’s flexible sysIO buffer supporting LVCMOS, LVTTL, LVDS, Bus‑LVDS, MLVDS, LVPECL, RSDS and other standards; pre‑engineered source synchronous interfaces including DDR/DDR2 up to 200 MHz and multi‑lane LVDS options are available at the family level.
  • Configuration & Security — flexiFLASH architecture for instant-on, infinite reconfigurability, FlashBAK and Serial TAG memory; Live Update technology with TransFR and 128‑bit AES encryption for secure update capability (family features).
  • Clocking — Multiple on-chip PLLs available in the XP2 family for clock multiplication, division and phase shifting (family feature).
  • Power & Supply — Low-voltage operation with a supply range of 1.14 V to 1.26 V, targeting 1.2 V system rails.
  • Package & Mounting — 256-ball LBGA package (supplier package: 256‑ftBGA, 17×17 mm); surface-mount device suitable for compact PCB layouts.
  • Environmental & Standards — RoHS compliant; family-level system support includes IEEE 1149.1 and IEEE 1532 compliance.
  • Commercial Grade — Specified operating range of 0 °C to 85 °C for commercial applications.

Typical Applications

  • Display and Video Interfaces — Pre‑engineered LVDS and multi‑lane source synchronous interfaces in the XP2 family support display and imaging data paths.
  • Embedded Control & Glue Logic — 17,000 logic elements and flexible I/O make the part well suited for system control, protocol bridging and custom peripheral integration.
  • Communications & Datapath — DSP blocks and multiplier resources enable packet processing, signal conditioning and interface bridging in networked products.
  • Memory Interfaces — Family-level support for DDR/DDR2 source-synchronous interfaces up to 200 MHz enables memory controller and buffering implementations.

Unique Advantages

  • Flash-based instant-on architecture — flexiFLASH enables immediate device startup and on-chip non-volatile configuration without external configuration flash at system power-up.
  • Secure update capability — Live Update technologies including TransFR and 128‑bit AES encryption (family features) support secure, field-updateable designs.
  • Balanced integration — Mid-range logic capacity, substantial I/O count and embedded memory reduce external components and simplify system bill-of-materials.
  • Flexible I/O standards — Broad I/O signaling options and source-synchronous interfaces allow interfacing with a wide range of peripherals and high-speed links.
  • Compact BGA package — 256-ball ftBGA (17×17 mm) package provides a high I/O count in a space‑efficient footprint for dense PCBs.
  • Commercial readiness — RoHS compliance and a defined commercial operating temperature range make the device suitable for mainstream embedded systems.

Why Choose LFXP2-17E-5FT256C?

The LFXP2-17E-5FT256C positions itself as a versatile mid-range FPGA option within the LatticeXP2 family, delivering a combination of 17,000 logic elements, around 0.28 Mbits of embedded RAM and 201 I/O pins in a compact 256‑ball BGA package. Its flash-based configuration approach and family-level support for DSP blocks, flexible I/O standards and secure Live Update mechanisms make it suitable for designers needing instant-on capability, on-chip security features and a range of interface options.

Supported by the LatticeXP2 family data and design ecosystem, this device is appropriate for embedded system designers, OEMs and contract manufacturers looking for a commercially graded FPGA with balanced logic, memory and I/O resources for mid-complexity applications.

Request a quote or submit an inquiry to obtain pricing, availability and ordering information for LFXP2-17E-5FT256C.

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