LFXP2-17E-5FTN256I

The LFXP2-17E-5FTN256I is an industrial-grade FPGA built on the LatticeXP2 flexiFLASH architecture. It combines a LUT-based programmable fabric with on-chip non-volatile flash to deliver instant-on operation and persistent configuration in a single surface-mount device.

With 17,000 logic elements, approximately 0.28 Mbits of on-chip RAM and 201 I/O pins in a compact 256-ball ftBGA (17 × 17 mm) package, this device targets industrial and embedded designs that require reconfigurability, on-chip memory and versatile I/O support while operating over a −40 °C to 100 °C range.

Key Features

• flexiFLASH architecture  Instant-on, infinitely reconfigurable single-chip architecture with FlashBAK and Serial TAG memory for persistent configuration and design security.
• Live Update and Secure Configuration  Support for TransFR live update technology, dual-boot with external SPI and secure updates using 128-bit AES encryption.
• Logic and DSP  Approximately 17,000 logic elements and dedicated sysDSP resources (XP2-17 family configuration includes sysDSP blocks and 18×18 multipliers) for efficient multiply-accumulate operations.
• Embedded and Distributed Memory  Total on-chip RAM of 282,624 bits (approximately 0.28 Mbits) for embedded and distributed memory needs.
• Flexible I/O and Interfaces  I/O buffer support for multiple standards listed in the LatticeXP2 family (LVCMOS, LVTTL, LVDS, SSTL, HSTL, LVPECL, PCI, Bus-LVDS and others) and pre-engineered source-synchronous interfaces such as DDR/DDR2 and multi-lane LVDS.
• Clocking and Timing  Multiple sysCLOCK PLLs available in the family for clock multiply, divide and phase shifting; XP2-17 family offers multiple PLL resources.
• Package and Power  256-ball ftBGA (17 × 17 mm) package, surface-mount, operating supply range 1.14 V to 1.26 V for core power.
• Industrial Temperature Grade  Specified operating temperature range from −40 °C to 100 °C and RoHS compliant.

Typical Applications

• Industrial Control  Custom I/O, sensor aggregation and control logic where persistent configuration, industrial temperature range and flexible I/O standards are required.
• High-performance DSP and Signal Processing  sysDSP resources and on-chip multipliers enable efficient multiply-accumulate operations for filtering, transform and other real-time signal-processing tasks.
• Communication and Networking  Pre-engineered source-synchronous interfaces (DDR/DDR2, XGMII, multi-lane LVDS) support system-level data interfaces and protocol bridging.
• Display and Imaging  Multi-lane LVDS support and flexible I/O buffer standards facilitate display interfaces and video transport applications.

Unique Advantages

• Instant-on, non-volatile operation:  flexiFLASH architecture eliminates external volatile configuration and enables immediate device startup.
• Secure field updates:  Live Update (TransFR) with 128-bit AES encryption and dual-boot support help enable secure in-field firmware upgrades.
• Balanced integration:  17,000 logic elements, substantial on-chip RAM and dedicated sysDSP resources reduce external component count for mid-density FPGA applications.
• Wide I/O flexibility:  Support for numerous I/O standards lets a single device interface to many peripheral types without extra level-shifting or translators.
• Industrial robustness:  Surface-mount 256-LBGA packaging and a −40 °C to 100 °C operating range suit demanding embedded environments.

Why Choose LFXP2-17E-5FTN256I?

The LFXP2-17E-5FTN256I delivers a mid-density, flash-based FPGA option that combines persistent configuration, DSP acceleration and flexible I/O in a compact 256-ball ftBGA package. Its mix of approximately 17,000 logic elements, roughly 0.28 Mbits of on-chip RAM and 201 I/Os make it well suited to industrial and embedded designs that need reconfigurability, secure updates and robust operation across a broad temperature range.

Designed around the LatticeXP2 family architecture, this device benefits from features that simplify system-level design — from clocking and memory options to engineered interfaces — enabling scalable implementations and streamlined integration into existing design flows.

Request a quote or submit an inquiry to the sales team to discuss pricing, availability and how LFXP2-17E-5FTN256I can be integrated into your next design.