LFXP2-17E-5FN484I

The LFXP2-17E-5FN484I is a Lattice Semiconductor XP2 family FPGA that combines LUT-based programmable logic with on-chip non-volatile flash (flexiFLASH) architecture. It targets designs that require a balance of logic density, DSP capability and high I/O count in an industrial-grade, surface-mount fpBGA package.

Key value comes from on-chip flash instant-on capability, embedded DSP resources and a flexible I/O architecture—enabling secure field updates, source-synchronous interfaces and compact system integration for industrial and embedded applications.

Key Features

• FPGA Core – Approximately 17,000 logic elements providing mid-range logic density for complex glue-logic, control and protocol tasks.
• Embedded Memory – Total on-chip RAM of 282,624 bits (approximately 0.283 Mbits) for distributed and embedded storage.
• High I/O Count – 358 user I/Os supported in the 484-ball fpBGA package for wide external connectivity and multi-channel interfaces.
• flexiFLASH Architecture – Flash-based instant-on operation with FlashBAK and serial TAG memory; enables single-chip, non-volatile configuration and reconfigurability.
• Live Update & Security – TransFR live update capability with secure updates and 128-bit AES encryption plus dual-boot support for field firmware management.
• sysDSP & Multipliers – sysDSP blocks and multiply-accumulate resources (XP2-17 family includes sysDSP blocks and up to 20 18×18 multipliers) for signal processing acceleration.
• Clocking – sysCLOCK analog PLLs (up to four per device) for flexible clock multiply/divide and phase shifting.
• Flexible I/O Standards – Supports a broad set of interface standards including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, MLVDS, LVPECL and RSDS; pre-engineered source-synchronous interfaces such as DDR/DDR2 (up to 200 MHz) and 7:1 LVDS for display applications are supported at the family level.
• Package & Mounting – 484-BBGA (484-FPBGA, 23 × 23 mm) surface-mount package for compact board integration.
• Power & Temperature – Core supply range 1.14 V to 1.26 V and industrial operating temperature from −40 °C to 100 °C.
• Compliance – RoHS compliant.

Typical Applications

• Industrial Control and Automation – Industrial-grade temperature range and compact fpBGA packaging suit motor control, PLC I/O expansion and factory automation interfaces.
• High-speed Memory Interfaces – Pre-engineered DDR/DDR2 interfaces and abundant I/O make the device suitable for memory bridging, buffering and protocol conversion tasks.
• Display and Video Front-Ends – Support for 7:1 LVDS interfaces and flexible I/O standards enables display timing, serialization and panel interface implementations.
• Embedded DSP and Signal Processing – sysDSP blocks and multiple 18×18 multipliers accelerate filtering, transforms and numeric processing in embedded signal chains.

Unique Advantages

• Instant-on, Non-volatile FPGA – On-chip flexiFLASH provides instant configuration without external volatile boot memory, simplifying system boot and reducing external components.
• Secure Field Updates – Live Update technology with 128-bit AES encryption and dual-boot support enables secure, manageable firmware updates in deployed systems.
• Balanced Logic and DSP – Approximately 17,000 logic elements paired with sysDSP blocks and hardware multipliers supports mixed control and compute workloads on a single device.
• High Connectivity – 358 I/Os in a 484-ball fpBGA package enable broad peripheral and bus interfacing without large board real estate.
• Industrial-ready Operation – Specified operation from −40 °C to 100 °C and surface-mount fpBGA packaging address rugged embedded and industrial environments.
• Compact System Integration – Flash-based single-chip configuration and on-chip memory reduce BOM and simplify power/board design.

Why Choose LFXP2-17E-5FN484I?

The LFXP2-17E-5FN484I positions itself as a mid-density, flash-based FPGA solution that combines non-volatile instant-on configuration, DSP acceleration and a high I/O count in a compact 484-ball fpBGA package. Its combination of approximately 17,000 logic elements, on-chip embedded RAM and sysDSP resources makes it well suited to embedded and industrial designs that require both control logic and signal processing on a single device.

With secure Live Update capabilities, flexible I/O standard support and operation across an industrial temperature range, this device provides a dependable platform for long-lived designs that need field reprogrammability, interface versatility and manageable BOM complexity.

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