LFXP2-17E-5FTN256C

The LFXP2-17E-5FTN256C is a Lattice XP2 family Field Programmable Gate Array (FPGA) in a 256-ball LBGA package, combining a LUT-based FPGA fabric with non-volatile flash architecture. The device targets embedded control, interface bridging and signal-processing applications that require instant-on flash-based configuration and flexible I/O support.

Key values include 17,000 logic elements, roughly 282,624 bits of on-chip RAM, up to 201 I/Os, and a commercial operating range with a 1.14 V to 1.26 V core supply. The part leverages the XP2 family’s flash-based flexiFLASH architecture and on-chip sysDSP and PLL features for integrated processing and clocking functions.

Key Features

• Logic Fabric — 17,000 logic elements provide the core LUT-based programmable fabric for combinational and sequential logic implementation.
• On-chip Memory — Approximately 0.28 Mbits (282,624 bits) of embedded RAM to support buffers, state machines and small data stores within the FPGA design.
• DSP and Multiplier Resources — XP2 family sysDSP resources (family data shows up to five sysDSP blocks for the XP2-17 device) and support for multiple 18×18 multipliers for MAC-intensive tasks.
• Flexible I/O — Up to 201 I/Os (as implemented in the 256-LBGA package) with support for a wide range of interface standards documented for the XP2 family.
• Flash-based Configuration — flexiFLASH architecture provides instant-on and on-chip non-volatile configuration storage and design security capabilities described for the XP2 family.
• Clocking — Multiple on-chip PLLs (family-level support) provide clock multiply/divide and phase-shift capabilities for system timing needs.
• Package and Mounting — 256-LBGA (17×17 mm ftBGA footprint) surface-mount package for compact board integration.
• Power and Temperature — Core supply range 1.14 V to 1.26 V; commercial operating temperature range 0°C to 85°C.
• Compliance — RoHS compliant.

Typical Applications

• Embedded Control and Motor Drive — Implement deterministic control logic and fast MAC operations using the FPGA fabric and sysDSP resources.
• Display and Video Interfaces — Pre‑engineered source-synchronous interfaces and LVDS-capable I/O support display timing, buffering and lane alignment tasks.
• Memory Interface and Buffering — Integrate DDR/DDR2 interface logic and on-chip RAM to buffer data streams and manage system memory transfers.
• Protocol Bridging and I/O Expansion — Use flexible I/O standards to create protocol converters, glue logic and custom peripheral interfaces with up to 201 I/Os.

Unique Advantages

• Flash-based Instant-on: Built-in flexiFLASH architecture enables instant-on configuration and non-volatile design storage without external configuration flash.
• Integrated DSP Capability: sysDSP blocks and dedicated multipliers accelerate multiply-accumulate workloads, reducing external ASIC or DSP requirements.
• High I/O Count in Compact Package: Up to 201 I/Os in a 256-LBGA footprint supports rich external connectivity while minimizing PCB area.
• Flexible Clocking: On-chip PLLs provide versatile clock management for mixed-frequency systems and deterministic timing.
• Commercial Temperature and Low-voltage Core: 1.14–1.26 V core operation and 0°C–85°C rating match typical commercial embedded and consumer system requirements.
• RoHS Compliant: Meets environmental compliance expectations for commercial electronics manufacturing.

Why Choose LFXP2-17E-5FTN256C?

This XP2-17 family device delivers a balanced combination of logic capacity, embedded memory and DSP resources in a flash-configured FPGA that simplifies system boot and security. With 17,000 logic elements, approximately 0.28 Mbits of on-chip RAM and up to 201 I/Os in a 256-LBGA package, the part is well suited for designers implementing embedded control, interface bridging, and mid-density signal processing functions where compact form factor and instant-on configuration matter.

Choose the LFXP2-17E-5FTN256C when you need a commercially rated, flash-configured FPGA that integrates programmable logic, DSP capability and flexible I/O in a single chip backed by the XP2 family architecture and on-chip clocking and memory resources.

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