LFXP2-17E-5QN208C

The LFXP2-17E-5QN208C is a LatticeXP2 flexiFLASH-based FPGA in a 208-pin BFQFP package. It combines non-volatile instant-on configuration with a LUT-based fabric, on-chip memory and dedicated DSP resources to address embedded processing, interface bridging and display/memory interface applications in commercial-grade designs.

With approximately 17,000 logic elements, roughly 282,624 bits of on-chip RAM and 146 I/Os in a 28 × 28 mm PQFP footprint, this device is targeted at systems that require reconfigurable logic, secure field updates and a mix of high-speed and flexible I/O standards.

Key Features

• FlexiFLASH architecture – Instant-on single-chip flash configuration with FlashBAK and design security features for non-volatile, infinitely reconfigurable operation.
• Live Update and Security – TransFR Live Update technology with support for secure updates and 128-bit AES encryption and dual-boot image support.
• Logic and Capacity – Approximately 17,000 logic elements to implement medium-density FPGA designs within a single-package solution.
• On-chip memory – Approximately 282,624 bits of embedded RAM to support buffering, FIFOs and local data storage for logic and DSP functions.
• sysDSP and multipliers – Dedicated sysDSP blocks and 18×18 multiplier resources (per family specification) for high-performance multiply-accumulate operations and signal processing tasks.
• Flexible I/O – sysIO buffer support for LVCMOS, LVTTL, SSTL, HSTL, PCI and a range of differential standards including LVDS, Bus-LVDS, MLVDS and LVPECL to interface with a wide variety of peripherals and transceivers.
• Pre‑engineered interfaces – Source-synchronous interfaces including DDR/DDR2 support up to 200 MHz and multi-lane LVDS options for display or high-speed data links.
• Clocking – Integrated PLL capabilities (analog PLLs per family specification) for clock multiply/divide and phase shifting to manage complex clock domains.
• Package and power – 208‑BFQFP (28 × 28 mm PQFP) surface-mount package with a specified supply range of 1.14 V to 1.26 V and commercial operating temperature from 0 °C to 85 °C.

Typical Applications

• Display and video interfaces – Use the device's multi-lane LVDS and pre‑engineered 7:1 LVDS support for display pipelines and timing-critical video transport.
• Embedded signal processing – Leverage sysDSP blocks and 18×18 multipliers plus on-chip RAM for filtering, DSP acceleration and real-time data processing.
• Memory-interface bridging – Implement DDR/DDR2 controller interfaces and source-synchronous memory logic using the device’s pre‑engineered interface support.
• Secure field updates and system control – Deploy secure firmware/image updates and dual-boot configurations using built-in Live Update and AES encryption capabilities.

Unique Advantages

• Instant-on non-volatile configuration – FlexiFLASH architecture eliminates the need for external configuration PROM and enables immediate boot from power-up.
• Secure, field-updatable systems – Built-in Live Update with AES encryption and TransFR support simplifies secure firmware updates and lifecycle management.
• Integrated DSP resources – sysDSP blocks and dedicated multipliers reduce the need for external DSP ICs, lowering BOM and board complexity for signal-processing designs.
• Broad I/O protocol support – A wide range of single-ended and differential I/O standards allows direct interfacing to diverse peripherals and high-speed links without extra interface devices.
• Compact PQFP footprint – 146 available I/Os in a 208‑pin BFQFP package balance I/O density and manufacturability for space-constrained commercial designs.
• Tool and IP ecosystem – Family-level support for Lattice Diamond design tools and LatticeCORE IP helps accelerate development and bringup.

Why Choose LFXP2-17E-5QN208C?

The LFXP2-17E-5QN208C positions itself as a versatile, commercial-grade FPGA that combines non-volatile instant-on configuration, secure update capabilities and integrated DSP and memory resources. It is well suited to embedded systems that need medium-density logic, robust I/O flexibility and controlled operating-temperature ranges.

Designers and procurement teams seeking a single-chip solution for display interfaces, memory bridging, real-time signal processing or secure firmware management will find this device delivers integration that simplifies BOM and system architecture while relying on established Lattice design tools and IP to accelerate development.

Request a quote or submit an inquiry today to check pricing, availability and lead time for the LFXP2-17E-5QN208C.