LFXP2-17E-5FN484C
| Part Description |
XP2 Field Programmable Gate Array (FPGA) IC 358 282624 17000 484-BBGA |
|---|---|
| Quantity | 348 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 358 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2125 | Number of Logic Elements/Cells | 17000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 282624 |
Overview of LFXP2-17E-5FN484C – XP2 Field Programmable Gate Array (FPGA), 17K logic elements, 484‑BBGA
The LFXP2-17E-5FN484C from Lattice Semiconductor Corporation is a commercial‑grade FPGA that combines a flash‑based configuration architecture with a LUT‑based programmable fabric. This XP2 device delivers 17,000 logic elements, approximately 0.28 Mbits of on‑chip RAM, and up to 358 I/Os in a 484‑ball BGA package, making it suited for embedded compute, high‑density I/O and display or memory‑interface applications.
Built on the LatticeXP2 family architecture, the device supports flexiFLASH instant‑on configuration, live update capabilities and dedicated DSP and memory resources to address designs requiring reconfigurability, on‑chip storage and moderate signal processing resources.
Key Features
- Logic Capacity — 17,000 logic elements for implementing mid‑range FPGA designs and glue logic.
- Embedded Memory — Total on‑chip RAM of 282,624 bits (approximately 0.28 Mbits) for buffers, FIFOs and small embedded storage.
- DSP Resources — sysDSP blocks and multiplier resources from the LatticeXP2 family (XP2‑17 device class) provide hardware multiply‑accumulate capability suitable for signal processing tasks.
- I/O Density — Up to 358 I/Os in the 484‑ball package to support complex peripheral and high‑pin‑count interfaces.
- flexiFLASH Architecture — FlashBAK non‑volatile configuration enables instant‑on behavior and reconfigurable single‑chip operation as described in the LatticeXP2 family documentation.
- Live Update and Security — Family features include Live Update technologies with TransFR and support for secure updates using 128‑bit AES encryption and dual‑boot image capability.
- Power and Temperature — Operates with a supply range specified at 1.14 V to 1.26 V and rated for commercial operation from 0 °C to 85 °C.
- Package and Mounting — 484‑BBGA package (supplier device package 484‑FPBGA, 23 × 23 mm) with surface‑mount mounting type and RoHS compliance.
Typical Applications
- Display and Video Interfaces — High‑pin‑count I/O and family support for multi‑lane LVDS and source‑synchronous interfaces make the device suitable for display bridging and video front‑end functions.
- Memory Interface and Buffering — Pre‑engineered DDR/DDR2 interface support at the family level and ample I/O allow implementation of memory controllers, buffering and data path glue logic.
- Embedded Signal Processing — On‑chip sysDSP block resources and multiplier support enable compact implementations of multiply‑accumulate kernels and moderate DSP workloads.
- High‑Density I/O Control and Prototyping — 358 I/Os and 17,000 logic elements provide a flexible platform for system glue, protocol conversion and prototype validation in embedded systems.
Unique Advantages
- Instant‑on reconfigurability: flexiFLASH architecture provides non‑volatile configuration and instant‑on operation, reducing boot latency in embedded systems.
- Secure update capability: Live Update features with 128‑bit AES encryption and dual‑boot support enhance field update flexibility and design security.
- Balanced compute and I/O: 17,000 logic elements paired with up to 358 I/Os delivers a mid‑range balance between logic density and connectivity for complex I/O‑centric designs.
- Compact, surface‑mount package: 484‑ball fpBGA (23 × 23 mm) packaging provides high pin‑count in a compact footprint for space‑constrained boards.
- Commercial operating range: Rated for operation from 0 °C to 85 °C and RoHS‑compliant for mainstream embedded applications.
- Low‑voltage operation: Specified supply range of 1.14 V to 1.26 V to match low‑voltage system rails used in many modern designs.
Why Choose LFXP2-17E-5FN484C?
The LFXP2-17E-5FN484C positions itself as a mid‑range FPGA option within the LatticeXP2 family, providing a practical combination of 17,000 logic elements, substantial I/O count and on‑chip non‑volatile configuration. It is well suited to designers who need instant‑on reconfigurability, moderate DSP capability and high pin density in a commercial‑grade device.
For teams focused on embedded control, display interfaces, memory bridging or prototyping, this FPGA offers a compact package, secure update paths and family‑level features that simplify integration and future scalability while maintaining compatibility with the LatticeXP2 design ecosystem.
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