LFXP2-17E-5F484C

IC FPGA 358 I/O 484FBGA
Part Description

XP2 Field Programmable Gate Array (FPGA) IC 358 282624 17000 484-BBGA

Quantity 422 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O358Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2125Number of Logic Elements/Cells17000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits282624

Overview of LFXP2-17E-5F484C – XP2 Field Programmable Gate Array (FPGA), 358 I/O, 17,000 logic elements, 484-BBGA

The LFXP2-17E-5F484C is a commercial-grade FPGA IC from the LatticeXP2 family that combines a LUT-based FPGA fabric with non-volatile flash configuration. Built around the flexiFLASH architecture, it delivers instant-on, reconfigurable logic with on-chip FlashBAK and secure update capabilities for embedded and communications-oriented designs.

With 17,000 logic elements, a high I/O count and integrated DSP and memory resources, this device targets applications that require dense I/O, real-time signal processing and flexible interfacing while operating from a low-voltage 1.14–1.26 V supply.

Key Features

  • Core Logic – 17,000 logic elements providing a flexible LUT-based FPGA fabric for combinational and sequential logic implementation.
  • On-chip Non-volatile Configuration (flexiFLASH) – Instant-on, infinitely reconfigurable single-chip architecture with FlashBAK and serial TAG memory for design security and stored configurations.
  • Embedded DSP Resources – sysDSP blocks (device-class support shown in the family data) with dedicated multipliers for multiply-and-accumulate functions to accelerate signal processing tasks.
  • Embedded and Distributed Memory – Total on-chip RAM of 282,624 bits (approximately 0.28 Mbits) for embedded and distributed storage of data and state.
  • High I/O Count – 358 user I/Os in a 484-ball fpBGA package, enabling wide parallel interfaces and system-level connectivity.
  • Flexible I/O Standards (family capability) – Family-level support for LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and other differential I/O standards for diverse interface requirements.
  • Clocking and PLLs – Family-level analog PLL resources (multiple PLLs per device class) for clock multiplication, division and phase shifting to support system timing needs.
  • Power and Mounting – Low-voltage operation from 1.14 V to 1.26 V and surface-mount 484-BBGA (23 × 23 mm) packaging for compact board integration.
  • Commercial Temperature Range – Rated for 0 °C to 85 °C operation suitable for commercial applications.
  • RoHS Compliant – Conforms to RoHS requirements for environmental compliance.

Typical Applications

  • Communications and Networking – Implement parallel and serial interfaces, protocol bridging and packet-handling logic using the high I/O count and programmable DSP resources.
  • Display and Imaging Systems – Support source-synchronous and multi-lane LVDS interfaces for display pipelines and high-bandwidth image data paths.
  • Embedded Control and User Interfaces – Consolidate peripheral bridging, control logic and custom I/O handling in a single-programmable device with instant-on capability.
  • Memory and Interface Bridging – Implement DDR/DDR2 interface controllers and custom interface logic using the device’s memory and high-speed I/O support (family-level pre-engineered interfaces).

Unique Advantages

  • Instant-on, Non-volatile Configuration: flexiFLASH architecture enables immediate operation after power-up without external configuration memory.
  • Reconfigurable and Secure Updates: Built-in flash and Live Update technologies support secure field updates and dual-boot strategies for robust deployment.
  • High Integration Reduces BOM: On-chip DSP blocks, embedded RAM and multiple PLLs reduce external components required for signal processing and clocking.
  • Wide Interface Flexibility: Large I/O count and family-level support for multiple electrical standards simplify integration across diverse peripherals and buses.
  • Low-Voltage Operation: Designed for 1.14–1.26 V supplies, helping designs achieve lower system power when paired with appropriate power architecture.
  • Commercial-grade Reliability: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream electronic products.

Why Choose LFXP2-17E-5F484C?

The LFXP2-17E-5F484C offers a balanced combination of logic capacity, on-chip memory and DSP resources with a high I/O count in a compact fpBGA package. It is well-suited for commercial embedded systems and communications designs that need instant-on reconfigurability, flexible interfacing and secure update capability in a single-chip solution.

Designers benefit from the LatticeXP2 family ecosystem—on-chip flash configuration, DSP acceleration blocks and flexible I/O standards—providing a scalable platform that simplifies board-level design and long-term product updates.

Request a quote or submit an inquiry to check availability and pricing for the LFXP2-17E-5F484C.

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