LFXP15E-5F484C

IC FPGA 300 I/O 484FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA

Quantity 1,883 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O300Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15E-5F484C – LatticeXP FPGA, 15,000 logic elements, 300 I/Os, 484‑BBGA

The LFXP15E-5F484C is a non-volatile LatticeXP family FPGA configured in a 484‑ball BGA (23 × 23 mm) package. It provides 15,000 logic elements, a high I/O count (300 pins), and on‑chip memory to support complex, reconfigurable system designs.

Built for commercial applications, this device combines instant‑on non‑volatile configuration, flexible I/O signaling, and in‑field reconfiguration capabilities to address designs that need fast startup, secure configuration, and on‑board memory for data buffering and control logic.

Key Features

  • Core Logic  15,000 logic elements for implementing mid‑density combinational and sequential logic functions.
  • On‑Chip Memory  Total on‑chip RAM: 331,776 bits (approximately 324 Kbits) to support embedded data buffering and state storage.
  • I/O Density & Package  Up to 300 I/Os in a 484‑ball FBGA (23 × 23 mm) surface‑mount package for high‑pin‑count interfaces and dense board layouts.
  • Non‑volatile, Instant‑On Configuration  Internal non‑volatile configuration eliminates the need for external configuration memory and enables millisecond power‑up for immediate operation.
  • In‑Field Reconfiguration (TransFR™)  Supports TransFR reconfiguration for updating SRAM‑based logic while a system is operating, enabling field updates without full shutdown.
  • Low‑Power Modes  Sleep mode provides significant static current reduction (up to 1000× as documented) for lower standby power.
  • Flexible I/O Buffering  Programmable I/O buffers support a wide range of signaling standards (including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL and bus‑LVDS), enabling versatile interface options.
  • Dedicated Memory Interfaces  Implements DDR memory interfaces up to DDR333 (166 MHz), suitable for systems requiring external DDR support.
  • Clocking  Up to four analog PLLs for clock multiply, divide and phase shifting to manage multiple clock domains.
  • System Support  IEEE 1149.1 boundary scan and internal logic analyzer (ispTRACY™) support for design debug, plus JTAG configuration options.
  • Power and Environmental  Voltage supply range 1.14 V to 1.26 V; commercial operating temperature range 0 °C to 85 °C; RoHS compliant.

Typical Applications

  • Instant‑start control systems  Systems that benefit from non‑volatile, instant‑on operation where fast availability at power‑up is required.
  • Field‑upgradeable products  Designs that require in‑field logic updates and partial reconfiguration without taking the system offline using TransFR™ capabilities.
  • High‑I/O interface hubs  Applications needing dense I/O and support for a variety of interface standards, including DDR memory interfaces up to DDR333.

Unique Advantages

  • Highly integrated, reconfigurable platform: 15,000 logic elements with substantial on‑chip RAM reduce external components and simplify system architecture.
  • Instant‑on, secure configuration: Non‑volatile configuration eliminates external configuration memory and reduces boot time while protecting bitstream confidentiality.
  • Field update capability: TransFR reconfiguration enables live system updates and rapid iterations without full system downtime.
  • Flexible interfacing: Programmable I/O buffers and support for numerous signaling standards accommodate diverse peripheral and memory interfaces.
  • Low standby power option: Sleep mode offers major static current reduction for power‑sensitive applications.
  • High I/O density in compact package: 300 I/Os in a 484‑ball FBGA (23 × 23 mm) make it suitable for space‑efficient boards requiring extensive connectivity.

Why Choose LFXP15E-5F484C?

The LFXP15E-5F484C positions itself as a versatile, mid‑density FPGA option for commercial designs that need rapid startup, flexible I/O, on‑chip memory, and field reconfiguration. Its combination of non‑volatile configuration, TransFR in‑field update capability, and multi‑PLL clocking makes it a practical choice for systems that require both configurability and secure, fast power‑up.

This device is well suited to development teams and product designers looking for a commercially graded FPGA with a high pin count and integrated features that reduce external components and support in‑system debugging and updates.

Request a quote or submit a product inquiry to obtain pricing and availability for LFXP15E-5F484C. Our team will provide the information you need to evaluate this FPGA for your next design.

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