LFXP15E-4FN388I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 268 331776 15000 388-BBGA |
|---|---|
| Quantity | 102 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 388-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 388-BBGA | Number of I/O | 268 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1932 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 331776 |
Overview of LFXP15E-4FN388I – XP Field Programmable Gate Array (FPGA), 15K LUTs, 388-BBGA
The LFXP15E-4FN388I is a non-volatile LatticeXP-series FPGA offering reconfigurable logic, embedded memory and flexible I/O in a single surface-mount 388-ball fpBGA package (23 × 23 mm). Built on the ispXP non-volatile architecture, this device delivers instant-on operation without external configuration memory and is targeted for industrial applications and embedded system designs that require in-field reconfiguration and system-level integration.
Key attributes include 15,000 logic elements, approximately 0.33 Mbits of embedded RAM, support for 268 I/Os and on-chip resources such as PLLs and configurable I/O standards, enabling complex interface and memory tasks within a compact, industrial-grade package.
Key Features
- Core Architecture Non-volatile ispXP™ technology with instant-on capability and infinitely reconfigurable logic for designs that need fast startup and secure configuration without external memory.
- Logic Capacity 15,000 logic elements (≈15K LUT4s) suitable for medium-density FPGA designs.
- Embedded Memory Approximately 0.33 Mbits of on-chip RAM (331,776 total RAM bits) with a mix of embedded block RAM and distributed memory resources.
- I/O Flexibility 268 user I/Os with programmable sysIO buffers supporting a wide range of standards (including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and LVPECL as defined for the LatticeXP family).
- Clocking and Timing Up to four analog sysCLOCK™ PLLs for multiply/divide and phase-shift functions to support complex clocking requirements.
- Configuration & In-field Update No external configuration memory required; features include instant-on, in-field TransFR™ reconfiguration for live logic updates, and JTAG/system configuration interfaces.
- Low-Power Modes Sleep mode capability enabling significant static current reduction for power-sensitive systems.
- Package & Thermal 388-ball fpBGA (23 × 23 mm) surface-mount package, industrial grade with an operating temperature range of −40 °C to 100 °C.
- Voltage Supply Core supply operating between 1.14 V and 1.26 V as specified for this device.
- Standards & Test System-level support includes IEEE 1149.1 boundary-scan and onboard instrumentation features described for the LatticeXP family.
- Compliance RoHS compliant.
Typical Applications
- Industrial Control Real-time control, sensor interfacing and distributed I/O applications that benefit from industrial temperature range and non-volatile instant-on behavior.
- Embedded Systems Compact, reconfigurable embedded designs requiring a mix of logic, embedded RAM and flexible I/O standards without external configuration memory.
- Communications & Networking Interface logic, protocol bridging and DDR memory interfacing where multiple PLLs and configurable I/O support are required.
- Instrumentation & Test Onboard logic analysis, boundary-scan and in-field reconfiguration enable adaptable test and measurement designs.
Unique Advantages
- Instant-on non-volatile architecture: Eliminates the need for external configuration memory and reduces system boot time.
- In-field reconfiguration (TransFR™): Allows logic updates while the system remains operational, simplifying field upgrades and fixes.
- Flexible I/O and clocking: Wide-ranging I/O standards and up to four PLLs provide adaptable interface and timing options for mixed-signal systems.
- Industrial-ready thermal range: −40 °C to 100 °C rating supports deployment in demanding environments.
- Compact, high-density package: 388-ball fpBGA (23 × 23 mm) combines significant I/O (268 pins) and logic density in a small footprint.
- Power-saving modes: Sleep mode enables substantial static current reduction for power-sensitive designs.
Why Choose LFXP15E-4FN388I?
The LFXP15E-4FN388I positions itself as a versatile, industrial-grade FPGA option for medium-density designs that require non-volatile instant-on behavior, flexible I/O and on-chip memory. Its combination of approximately 15,000 logic elements, roughly 0.33 Mbits of embedded RAM, 268 I/Os and multi-PLL clocking resources makes it suitable for embedded systems, industrial controls and communications interfaces where compact integration and in-field reconfigurability are important.
Customers seeking long-term design scalability and system-level integration can leverage the LatticeXP family features—such as in-field reconfiguration, sleep mode and extensive I/O support—while relying on industrial temperature operation and RoHS compliance for deployment in production environments.
Request a quote or submit a sales inquiry for part number LFXP15E-4FN388I to discuss availability and pricing, or to receive technical support for integration into your design.

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