LFXP15E-4FN388I

IC FPGA 268 I/O 388FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 268 331776 15000 388-BBGA

Quantity 102 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package388-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case388-BBGANumber of I/O268Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15E-4FN388I – XP Field Programmable Gate Array (FPGA), 15K LUTs, 388-BBGA

The LFXP15E-4FN388I is a non-volatile LatticeXP-series FPGA offering reconfigurable logic, embedded memory and flexible I/O in a single surface-mount 388-ball fpBGA package (23 × 23 mm). Built on the ispXP non-volatile architecture, this device delivers instant-on operation without external configuration memory and is targeted for industrial applications and embedded system designs that require in-field reconfiguration and system-level integration.

Key attributes include 15,000 logic elements, approximately 0.33 Mbits of embedded RAM, support for 268 I/Os and on-chip resources such as PLLs and configurable I/O standards, enabling complex interface and memory tasks within a compact, industrial-grade package.

Key Features

  • Core Architecture Non-volatile ispXP™ technology with instant-on capability and infinitely reconfigurable logic for designs that need fast startup and secure configuration without external memory.
  • Logic Capacity 15,000 logic elements (≈15K LUT4s) suitable for medium-density FPGA designs.
  • Embedded Memory Approximately 0.33 Mbits of on-chip RAM (331,776 total RAM bits) with a mix of embedded block RAM and distributed memory resources.
  • I/O Flexibility 268 user I/Os with programmable sysIO buffers supporting a wide range of standards (including LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and LVPECL as defined for the LatticeXP family).
  • Clocking and Timing Up to four analog sysCLOCK™ PLLs for multiply/divide and phase-shift functions to support complex clocking requirements.
  • Configuration & In-field Update No external configuration memory required; features include instant-on, in-field TransFR™ reconfiguration for live logic updates, and JTAG/system configuration interfaces.
  • Low-Power Modes Sleep mode capability enabling significant static current reduction for power-sensitive systems.
  • Package & Thermal 388-ball fpBGA (23 × 23 mm) surface-mount package, industrial grade with an operating temperature range of −40 °C to 100 °C.
  • Voltage Supply Core supply operating between 1.14 V and 1.26 V as specified for this device.
  • Standards & Test System-level support includes IEEE 1149.1 boundary-scan and onboard instrumentation features described for the LatticeXP family.
  • Compliance RoHS compliant.

Typical Applications

  • Industrial Control Real-time control, sensor interfacing and distributed I/O applications that benefit from industrial temperature range and non-volatile instant-on behavior.
  • Embedded Systems Compact, reconfigurable embedded designs requiring a mix of logic, embedded RAM and flexible I/O standards without external configuration memory.
  • Communications & Networking Interface logic, protocol bridging and DDR memory interfacing where multiple PLLs and configurable I/O support are required.
  • Instrumentation & Test Onboard logic analysis, boundary-scan and in-field reconfiguration enable adaptable test and measurement designs.

Unique Advantages

  • Instant-on non-volatile architecture: Eliminates the need for external configuration memory and reduces system boot time.
  • In-field reconfiguration (TransFR™): Allows logic updates while the system remains operational, simplifying field upgrades and fixes.
  • Flexible I/O and clocking: Wide-ranging I/O standards and up to four PLLs provide adaptable interface and timing options for mixed-signal systems.
  • Industrial-ready thermal range: −40 °C to 100 °C rating supports deployment in demanding environments.
  • Compact, high-density package: 388-ball fpBGA (23 × 23 mm) combines significant I/O (268 pins) and logic density in a small footprint.
  • Power-saving modes: Sleep mode enables substantial static current reduction for power-sensitive designs.

Why Choose LFXP15E-4FN388I?

The LFXP15E-4FN388I positions itself as a versatile, industrial-grade FPGA option for medium-density designs that require non-volatile instant-on behavior, flexible I/O and on-chip memory. Its combination of approximately 15,000 logic elements, roughly 0.33 Mbits of embedded RAM, 268 I/Os and multi-PLL clocking resources makes it suitable for embedded systems, industrial controls and communications interfaces where compact integration and in-field reconfigurability are important.

Customers seeking long-term design scalability and system-level integration can leverage the LatticeXP family features—such as in-field reconfiguration, sleep mode and extensive I/O support—while relying on industrial temperature operation and RoHS compliance for deployment in production environments.

Request a quote or submit a sales inquiry for part number LFXP15E-4FN388I to discuss availability and pricing, or to receive technical support for integration into your design.

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