LFXP15E-4FN256I

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 331776 15000 256-BGA

Quantity 100 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-BGANumber of I/O188Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15E-4FN256I – XP Field Programmable Gate Array (FPGA) IC 188 331776 15000 256-BGA

The LFXP15E-4FN256I is a LatticeXP family FPGA combining non-volatile, reconfigurable logic with embedded memory and flexible I/O in a 256-ball fpBGA package. With 15,000 logic elements, approximately 0.332 Mbits of on-chip RAM and 188 I/Os, this device targets embedded and industrial system designs that require instant-on behavior, in-field reconfiguration and compact packaging.

Designed for industrial temperature operation and RoHS compliance, the part offers on-chip resources and system-level capabilities aimed at reducing external components and accelerating system integration.

Key Features

  • Core Architecture Non-volatile, infinitely reconfigurable LatticeXP family FPGA architecture providing instant-on behavior and reprogrammable SRAM-based logic while eliminating the need for external configuration memory.
  • Logic Density 15,000 logic elements suitable for mid-density designs and architecture migration within the LatticeXP family.
  • Embedded Memory Approximately 0.332 Mbits of total on-chip RAM for distributed and block memory requirements.
  • I/O and Package 188 user I/Os in a 256-ball fpBGA (17 × 17 mm) package, enabling dense I/O routing in compact board designs.
  • Power Core voltage supply specified at 1.14 V to 1.26 V for the device.
  • Temperature and Grade Industrial grade operation across an operating temperature range of −40 °C to 100 °C.
  • Reconfiguration and Security Non-volatile configuration with instant-on capability and support for in-field reconfiguration to update logic while the system is deployed.
  • System Features Family-level support includes multi-PLL clocking, internal configuration and debug features as documented in the LatticeXP family datasheet.
  • Compliance RoHS-compliant manufacturing.

Typical Applications

  • Industrial Control Deterministic logic and embedded memory make the device suitable for motor control, PLC interfaces and factory automation subsystems operating across industrial temperature ranges.
  • Embedded Systems Compact packaging and integrated memory/I/O density support system control, protocol bridging and interface consolidation in space-constrained designs.
  • Communications and Networking Flexible I/O and on-chip resources enable protocol handling, interface adaptation and mid-density packet processing tasks.
  • In-Field Upgradeable Systems Non-volatile configuration and in-field reconfiguration capabilities allow deployed products to receive logic updates without external configuration memory.

Unique Advantages

  • Instant-on, non-volatile FPGA: Eliminates the need for external configuration memory and simplifies system boot behavior.
  • Mid-range integration: 15,000 logic elements and ~0.332 Mbits of embedded RAM reduce external components for many embedded functions.
  • High I/O count in compact package: 188 I/Os in a 256-ball fpBGA (17 × 17 mm) supports dense interface routing in a small footprint.
  • Industrial temperature capability: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
  • In-field reconfiguration and system-level tools: Family features and available design tools/IP simplify updates and accelerate development cycles.
  • RoHS compliant: Manufactured to meet lead-free environmental standards.

Why Choose LFXP15E-4FN256I?

The LFXP15E-4FN256I positions itself as a flexible, mid-density FPGA solution for designers who need non-volatile, instant-on logic with substantial on-chip memory and a high I/O count in a compact fpBGA package. Its industrial temperature rating and reconfigurable architecture make it suitable for embedded and industrial applications that require reliable operation and the ability to update logic in the field.

Backed by LatticeXP family features and vendor-provided development tools and IP, the device offers a practical balance of integration, configurability and system-level support for teams looking to reduce BOM complexity and accelerate time-to-market.

Request a quote or submit your RFQ to get pricing and availability for LFXP15E-4FN256I and discuss how it can fit into your next design.

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