LFXP15E-4FN388C

IC FPGA 268 I/O 388FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 268 331776 15000 388-BBGA

Quantity 926 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package388-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case388-BBGANumber of I/O268Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15E-4FN388C – LatticeXP FPGA, 15,000 Logic Elements, 388‑ball BGA

The LFXP15E-4FN388C is a non-volatile LatticeXP family Field Programmable Gate Array (FPGA) offering 15,000 logic elements in a 388-ball ball-grid array package. Designed for system-level integration, it delivers instant-on operation, in-field reconfiguration and a high I/O count for complex interface and control applications.

Its architecture combines programmable logic and embedded memory to support designs that require flexible I/O, dedicated memory resources and analog PLL-based clocking while operating within a commercial temperature range.

Key Features

  • Core Logic  15,000 logic elements (LUT-based architecture) providing dense programmable logic for custom functions and glue logic.
  • Embedded Memory  Approximately 0.324 Mbits (331,776 bits) of on-chip RAM supporting both embedded block RAM and distributed memory use.
  • I/O Capacity  268 user I/Os to support multiple interfaces and parallel connectivity in a single device package.
  • Non‑volatile, Instant‑On  ispXP technology enables instant-on operation with no external configuration memory required and supports reconfiguration of SRAM-based logic in milliseconds.
  • Reconfiguration & Debug  Supports in-field logic updates (TransFR reconfiguration) and system-level debugging features referenced in the LatticeXP family data, including boundary-scan and internal logic analyzer capabilities.
  • Clocking  Up to four analog PLLs for clock multiplication, division and phase shifting to support complex timing domains.
  • Memory Interface Support  Dedicated DDR memory support up to DDR333 (166 MHz) as described for the family, enabling high-bandwidth external memory interfaces.
  • Power & Supply  Core supply operating in the range 1.14 V to 1.26 V; device operates with multiple I/O voltage options as described for the family.
  • Package & Mounting  388-ball FBGA (23 × 23 mm) surface-mount package (388-FPBGA) for compact, high-density board integration.
  • Commercial Temperature Grade  Rated for 0 °C to 85 °C operating temperature.
  • Regulatory  RoHS compliant.

Typical Applications

  • Embedded System Integration  Implement custom control logic, protocol bridging and peripheral aggregation using on-chip logic and memory.
  • Memory Interface Controllers  Support DDR memory interfaces with dedicated DDR memory support and multiple PLLs for timing alignment.
  • High‑I/O Interface Bridging  Consolidate multiple I/O standards and parallel interfaces using the device’s 268 I/Os in a compact BGA footprint.
  • In‑field Updatable Logic  Deploy applications that require remote or in-system firmware updates using the family’s TransFR reconfiguration capability.

Unique Advantages

  • Non‑volatile instant-on architecture: Eliminates the need for external configuration memory and enables microsecond startup for quicker system availability.
  • High logic density in a compact package: 15,000 logic elements and 388-ball FBGA packaging allow complex designs in space-constrained PCBs.
  • Substantial on-chip memory: Approximately 0.324 Mbits of embedded RAM reduces external memory requirements for many control and buffering tasks.
  • Extensive I/O resources: 268 user I/Os provide flexibility for multi-interface systems and high pin-count peripheral connectivity.
  • Flexible clocking and memory support: Up to four PLLs plus dedicated DDR support help implement multi-domain timing and high-speed memory interfaces.
  • Commercial-grade reliability: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial applications.

Why Choose LFXP15E-4FN388C?

The LFXP15E-4FN388C is positioned for system designers who need a non-volatile FPGA with substantial logic density, significant on-chip memory and a high I/O count in a compact BGA package. Its instant-on behavior, in-field reconfiguration and integrated clocking make it suitable for embedded control, interface bridging and memory controller functions where board-level integration and startup behavior matter.

Backed by the LatticeXP family architecture and design tools referenced in the device data, this FPGA offers a scalable platform for projects that require adaptable logic, reliable commercial-grade operation and a reduced external component count.

Request a quote or submit an inquiry to receive pricing, availability and support information for LFXP15E-4FN388C.

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