LFXP15E-4F484I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA |
|---|---|
| Quantity | 967 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 300 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1932 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 331776 |
Overview of LFXP15E-4F484I – XP Field Programmable Gate Array (FPGA) IC 300 I/Os, 15k Logic Elements, 484-BBGA
The LFXP15E-4F484I is an industrial-grade, non-volatile FPGA from Lattice Semiconductor’s LatticeXP family. It integrates approximately 15,000 logic elements, 331,776 bits of on-chip RAM (approximately 0.33 Mbits), and up to 300 I/Os in a 484-ball FBGA (23 × 23 mm) package for compact system integration.
Designed for applications that require instant-on capability, in-field reconfiguration and flexible I/O, this device delivers a balance of logic density, embedded memory and configurable interfaces while operating over an extended temperature range and low supply voltage.
Key Features
- Core Logic — Approximately 15,000 logic elements (LUT4-based architecture) suitable for medium-density logic implementations and in-field reconfiguration.
- Embedded Memory — 331,776 total RAM bits (approximately 0.33 Mbits) including distributed and block memory resources for on-chip buffering and state storage.
- I/O and Interfaces — Up to 300 programmable I/Os in a 484-BBGA footprint, with a flexible sysIO™ buffer architecture supporting a wide range of interface standards.
- Configuration and Security — Non-volatile, instant-on architecture with no external configuration memory required; supports reconfiguration of SRAM-based logic in milliseconds and secure device configuration.
- Clocking — Up to 4 analog PLLs for clock multiply, divide and phase shifting to support complex timing and memory interfaces.
- Dedicated Memory Interface — Dedicated DDR memory support and the ability to implement interfaces up to DDR333 (166 MHz).
- Low-Power Modes — Sleep mode capability for substantial static current reduction.
- Package & Temperature — 484-ball FBGA (23 × 23 mm) package; industrial operating temperature range from −40 °C to 100 °C.
- Supply — Operates from a core voltage supply range of 1.14 V to 1.26 V.
- Compliance — RoHS compliant.
Typical Applications
- Industrial Control — Realize embedded control, protocol bridging and system glue functions that benefit from non-volatile, instant-on FPGA operation across extended temperature ranges.
- Communications and Networking — Implement protocol engines, interface adaptors and DDR memory controllers using the device’s flexible I/O and dedicated memory interface support.
- Embedded System Integration — Replace external configuration memory with the device’s non-volatile architecture for compact system designs and faster boot times.
Unique Advantages
- Instant-on, non-volatile architecture: Eliminates the need for external configuration memory and enables fast system boot and secure bitstream handling.
- In-field reconfiguration (TransFR): Update logic while the system is operating to simplify field upgrades and reduce service cycles.
- Flexible, high-density I/O in a compact package: 300 programmable I/Os in a 484-BBGA (23 × 23 mm) package reduce board area while supporting broad interface requirements.
- Integrated memory resources: Approximately 0.33 Mbits of embedded RAM and support for DDR memory interfaces provide on-chip buffering and high-bandwidth external memory connectivity.
- Low-power operating modes: Sleep mode provides significant static current reduction for energy-sensitive systems.
- Industrial temperature rating: −40 °C to 100 °C operating range for deployment in demanding environmental conditions.
Why Choose LFXP15E-4F484I?
The LFXP15E-4F484I combines non-volatile instant-on operation, in-field reconfiguration capabilities and a high I/O count in a compact 484-BBGA package, making it well suited for embedded and industrial systems that require secure, fast-booting programmable logic. Its mix of on-chip memory, multiple PLLs and dedicated DDR support enables designers to consolidate functions, reduce external components and simplify board-level design.
This device is positioned for engineers seeking a reconfigurable, industrial-grade FPGA platform that balances logic density, memory resources and flexible interfacing while benefiting from the LatticeXP family features for system-level configurability and design tooling support.
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