LFXP15E-3FN388I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 268 331776 15000 388-BBGA |
|---|---|
| Quantity | 644 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 388-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 388-BBGA | Number of I/O | 268 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1932 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 331776 |
Overview of LFXP15E-3FN388I – XP Field Programmable Gate Array (FPGA) — 15,000 logic elements, 268 I/Os, 388‑BBGA
The LFXP15E-3FN388I is a non-volatile, field programmable gate array packaged in a 388‑ball fpBGA (23 × 23 mm) intended for industrial applications. It combines approximately 15,000 logic elements, extensive embedded memory, and a high I/O count to support complex system designs that require instant-on behavior, in-field reconfiguration and flexible interface support.
Key Features
- Core Logic Approximately 15,000 logic elements provide the programmable fabric required for complex combinational and sequential logic implementations.
- Embedded Memory Approximately 0.332 Mbits (331,776 bits) of on-chip RAM for block and distributed memory usage in application logic and buffering.
- I/O Capacity & Flexibility 268 user I/Os enable dense peripheral and bus connectivity; the series architecture supports a wide range of I/O standards for interface versatility.
- Non‑volatile, Instant‑on Architecture The device supports non-volatile, infinitely reconfigurable operation with instant-on startup and no requirement for external configuration memory.
- Reconfiguration & System Debug In-field reconfiguration capability and internal instrumentation features enable updates and system-level debug while deployed.
- Clocking & Timing Up to four analog PLLs per device support clock multiplication, division and phase shifting for flexible clock management.
- Power & Temperature Supply range specified at 1.14 V to 1.26 V and industrial operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
- Package & Mounting 388‑ball fpBGA package (388‑FPBGA, 23 × 23 mm), surface‑mount compatible and RoHS compliant.
Typical Applications
- Industrial Control Programmable logic and abundant I/Os make the device suitable for motor control, PLC modules and factory automation where industrial temperature grading is required.
- Communications & Networking High I/O density and flexible clocking support protocol bridging, packet processing and interface aggregation tasks.
- Embedded System Acceleration On-chip memory and reconfigurable logic enable hardware acceleration for signal processing, data buffering and protocol offload.
- Instrumentation & Test Equipment Instant-on capability and in-field reconfiguration help implement configurable measurement and test functions with minimal boot time.
Unique Advantages
- Non‑volatile, instant-on operation: Eliminates the need for external configuration memory and enables immediate startup.
- In-field reconfigurability: Enables updates and feature changes without hardware replacement, improving product longevity and field flexibility.
- High I/O count in a compact package: 268 I/Os in a 23 × 23 mm fpBGA reduce PCB area while supporting dense connectivity.
- Industrial temperature rating: Operation from −40 °C to 100 °C supports demanding environmental deployment.
- Integrated clock management: Multiple PLLs allow precise clock conditioning for multi-domain designs.
- RoHS compliant and surface‑mount packaged: Aligns with common manufacturing and environmental requirements.
Why Choose LFXP15E-3FN388I?
The LFXP15E-3FN388I positions itself as a versatile, industrial-grade FPGA option combining a substantial logic capacity, on-chip memory and a high count of I/Os in a compact fpBGA package. Its non-volatile, instant-on architecture and in-field reconfiguration features make it suitable for applications that demand fast startup, secure configuration and field updates.
Engineers designing control, communications or embedded acceleration systems will find the LFXP15E-3FN388I delivers a balance of integration, configurability and thermal/power characteristics that support robust, long‑lifecycle products.
Request a quote or submit an inquiry to obtain pricing, availability and support information for the LFXP15E-3FN388I.

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