LFXP15E-3FN388I

IC FPGA 268 I/O 388FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 268 331776 15000 388-BBGA

Quantity 644 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package388-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case388-BBGANumber of I/O268Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15E-3FN388I – XP Field Programmable Gate Array (FPGA) — 15,000 logic elements, 268 I/Os, 388‑BBGA

The LFXP15E-3FN388I is a non-volatile, field programmable gate array packaged in a 388‑ball fpBGA (23 × 23 mm) intended for industrial applications. It combines approximately 15,000 logic elements, extensive embedded memory, and a high I/O count to support complex system designs that require instant-on behavior, in-field reconfiguration and flexible interface support.

Key Features

  • Core Logic  Approximately 15,000 logic elements provide the programmable fabric required for complex combinational and sequential logic implementations.
  • Embedded Memory  Approximately 0.332 Mbits (331,776 bits) of on-chip RAM for block and distributed memory usage in application logic and buffering.
  • I/O Capacity & Flexibility  268 user I/Os enable dense peripheral and bus connectivity; the series architecture supports a wide range of I/O standards for interface versatility.
  • Non‑volatile, Instant‑on Architecture  The device supports non-volatile, infinitely reconfigurable operation with instant-on startup and no requirement for external configuration memory.
  • Reconfiguration & System Debug  In-field reconfiguration capability and internal instrumentation features enable updates and system-level debug while deployed.
  • Clocking & Timing  Up to four analog PLLs per device support clock multiplication, division and phase shifting for flexible clock management.
  • Power & Temperature  Supply range specified at 1.14 V to 1.26 V and industrial operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
  • Package & Mounting  388‑ball fpBGA package (388‑FPBGA, 23 × 23 mm), surface‑mount compatible and RoHS compliant.

Typical Applications

  • Industrial Control  Programmable logic and abundant I/Os make the device suitable for motor control, PLC modules and factory automation where industrial temperature grading is required.
  • Communications & Networking  High I/O density and flexible clocking support protocol bridging, packet processing and interface aggregation tasks.
  • Embedded System Acceleration  On-chip memory and reconfigurable logic enable hardware acceleration for signal processing, data buffering and protocol offload.
  • Instrumentation & Test Equipment  Instant-on capability and in-field reconfiguration help implement configurable measurement and test functions with minimal boot time.

Unique Advantages

  • Non‑volatile, instant-on operation: Eliminates the need for external configuration memory and enables immediate startup.
  • In-field reconfigurability: Enables updates and feature changes without hardware replacement, improving product longevity and field flexibility.
  • High I/O count in a compact package: 268 I/Os in a 23 × 23 mm fpBGA reduce PCB area while supporting dense connectivity.
  • Industrial temperature rating: Operation from −40 °C to 100 °C supports demanding environmental deployment.
  • Integrated clock management: Multiple PLLs allow precise clock conditioning for multi-domain designs.
  • RoHS compliant and surface‑mount packaged: Aligns with common manufacturing and environmental requirements.

Why Choose LFXP15E-3FN388I?

The LFXP15E-3FN388I positions itself as a versatile, industrial-grade FPGA option combining a substantial logic capacity, on-chip memory and a high count of I/Os in a compact fpBGA package. Its non-volatile, instant-on architecture and in-field reconfiguration features make it suitable for applications that demand fast startup, secure configuration and field updates.

Engineers designing control, communications or embedded acceleration systems will find the LFXP15E-3FN388I delivers a balance of integration, configurability and thermal/power characteristics that support robust, long‑lifecycle products.

Request a quote or submit an inquiry to obtain pricing, availability and support information for the LFXP15E-3FN388I.

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