LFXP15E-3FN388C

The LFXP15E-3FN388C is a non-volatile LatticeXP field programmable gate array (FPGA) offering 15,000 logic elements, approximately 0.33 Mbits of on-chip RAM, and 268 user I/Os in a 388-ball fpBGA (23 × 23 mm) package. Built on the LatticeXP family architecture, the device combines instant-on non-volatile configuration, embedded block and distributed memory, and flexible I/O support to address designs that require reconfigurable logic with robust system-level features.

This commercial-grade, surface-mount device operates from 1.14 V to 1.26 V and across a 0 °C to 85 °C range, and is RoHS compliant—providing a compact, reconfigurable building block for embedded systems that need on-chip memory, extensive I/O, and in-field update capability.

Key Features

• Core Logic 15,000 logic elements (LUT-based fabric) delivering reconfigurable logic capacity for combinational and sequential functions.
• Embedded Memory Approximately 0.33 Mbits (331,776 bits) of on-chip RAM available as embedded and distributed memory to support data buffering, FIFOs and state storage.
• I/O and Package 268 user I/Os in a 388-ball fpBGA (23 × 23 mm) supplier package; surface-mount mounting for high-density board designs.
• Non-Volatile, Instant-On Configuration ispXP non-volatile architecture provides instant-on operation without external configuration memory and supports secure configuration storage.
• In-Field Reconfiguration (TransFR) Supports TransFR reconfiguration for updating SRAM-based logic while the system continues to operate.
• Low-Power Sleep Mode Sleep capability enables up to 1000× static current reduction for lower standby power.
• Clocking and Memory Interface Up to four analog PLLs for clock multiply/divide/phase shifting and dedicated DDR memory interface support up to DDR333 (166 MHz).
• Flexible I/O Standards Programmable sysIO buffer supports a wide range of standards (examples in family data include LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS, LVPECL), enabling diverse board-level interfaces.
• System-Level Support On-chip support such as IEEE 1149.1 boundary-scan, JTAG configuration and internal logic analysis capabilities help streamline bring-up and debug.
• Supply and Thermal Optimized to operate from a core supply range of 1.14 V to 1.26 V and rated for commercial operation from 0 °C to 85 °C.

Typical Applications

• Instant-on Reconfigurable Logic Systems that require immediate availability of FPGA functionality without external configuration memory.
• In-field Updatable Systems Designs that benefit from TransFR reconfiguration to deploy logic updates while the system remains operational.
• High-density I/O Control Applications needing many I/O signals and flexible interface standards for board-level bridging and peripheral control.
• Embedded Memory-Intensive Functions Uses that leverage the on-chip RAM for buffering, local storage, or distributed memory structures.

Unique Advantages

• Highly integrated solution: Combines 15,000 logic elements, approximately 0.33 Mbits of embedded RAM and 268 I/Os in a single 388-ball fpBGA package to reduce external component count and PCB area.
• Instant-on non-volatile configuration: Eliminates the need for external configuration memory and enables immediate device availability at power-up.
• Field update capability: TransFR reconfiguration allows in-field logic updates without taking the entire system offline, simplifying maintenance and upgrades.
• Low-power standby: Sleep mode supports dramatic static current reduction to aid power-sensitive designs.
• Flexible I/O and clocking: Programmable I/O buffers and up to four PLLs simplify interfacing to diverse signaling standards and complex clocking requirements.
• Commercial-grade reliability: RoHS-compliant device with defined operating voltage and temperature ranges for predictable deployment in commercial applications.

Why Choose LFXP15E-3FN388C?

The LFXP15E-3FN388C positions itself as a compact, non-volatile FPGA option for designs that require immediate-on capability, on-chip memory, and extensive I/O in a space-efficient fpBGA package. Its combination of reconfigurable logic, embedded RAM, flexible I/O standards and in-field reconfiguration features supports a wide range of system-level needs while simplifying board-level integration.

Designed for commercial applications that operate between 0 °C and 85 °C with a core supply range of 1.14 V to 1.26 V, the device provides a balance of integration, configurability and power management suitable for engineers who need a field-programmable solution with on-chip memory and robust system features.

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