LFXP15E-3FN256C

The LFXP15E-3FN256C is a LatticeXP family FPGA from Lattice Semiconductor Corporation featuring a non-volatile, reconfigurable architecture designed for embedded logic, memory-centric designs and high-density I/O applications. With 15,000 logic elements, approximately 0.33 Mbits of on-chip RAM and 188 I/Os in a 256-ball fpBGA (17 × 17 mm) package, it targets commercial designs requiring instant-on behavior, flexible I/O and field reconfiguration.

Key Features

• Core/Architecture  Non-volatile ispXP™-based architecture with instant-on capability and no external configuration memory required; supports reconfiguration of SRAM-based logic in milliseconds.
• Logic Capacity  15,000 logic elements suitable for moderate to complex glue logic, protocol handling and integration of custom datapaths.
• On-chip Memory  Approximately 0.33 Mbits of embedded RAM providing both distributed and block memory resources for buffering, FIFO and small data storage needs.
• I/O Flexibility  188 I/Os in the 256-ball fpBGA package; programmable sysIO buffer architecture supports a wide range of interface standards as detailed in the LatticeXP family datasheet.
• Clocking  Up to four analog sysCLOCK PLLs per device for clock multiply/divide and phase shifting.
• Dedicated Memory Interface  Dedicated DDR memory support up to DDR333 for designs requiring external SDRAM interfacing.
• Low-power Modes  Sleep mode enables significant static current reduction (documented up to 1000× in the family datasheet), aiding low-power system designs.
• Power and Package  Core voltage supply specified at 1.14 V to 1.26 V; surface-mount 256-FPBGA (17 × 17 mm) supplier package; commercial operating temperature range 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• Embedded Control & Signal Processing  Implements custom control logic, signal conditioning and protocol processing with fast instant-on behavior and on-chip memory for buffering.
• Memory Interface & Bridge  Acts as an interface engine for DDR memory up to DDR333, enabling memory controller and bridge implementations.
• Communications & I/O Aggregation  High I/O count and programmable I/O support make it suitable for protocol aggregation, signal routing and interface conversion tasks.
• Field-updatable Systems  Supports in-field logic updates (TransFR™ reconfiguration) to enable live firmware upgrades and iterative feature deployment.

Unique Advantages

• Instant-on non-volatile operation: Eliminates the need for external configuration memory and reduces system boot time.
• High integration density: 15,000 logic elements and ~0.33 Mbits of embedded memory reduce external components and board complexity.
• Flexible interface support: Programmable I/O buffers and a large I/O count support diverse signaling standards and mixed-voltage systems.
• Field reconfigurability: TransFR reconfiguration and SRAM reprogramming enable in-system updates and rapid feature iteration.
• Power management options: Sleep mode and defined core voltage range support low-power commercial applications.
• Commercial temperature suitability: Rated for 0 °C to 85 °C for mainstream electronics and consumer applications.

Why Choose LFXP15E-3FN256C?

The LFXP15E-3FN256C combines non-volatile instant-on capability with a balanced mix of logic, embedded memory and I/O density to address a wide range of commercial embedded and interface-focused designs. Its on-chip memory, up to four PLLs and dedicated DDR support make it well suited for applications that require flexible I/O, in-field updates and reliable, deterministic startup behavior.

Designed for teams looking to simplify BOM and accelerate system integration, this device leverages LatticeXP family features—non-volatile configuration, sleep mode and programmable I/O—to deliver scalable performance and deployment flexibility for commercial products.

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