LFXP15E-3FN256I

The LFXP15E-3FN256I is an industrial-grade FPGA from the LatticeXP family, offering non‑volatile, reconfigurable logic in a 256-ball fpBGA (17 × 17 mm) package. It provides 15,000 logic elements, approximately 0.33 Mbits of on‑chip embedded RAM and 188 user I/Os, making it suitable for embedded systems that require high I/O density, in-field reconfiguration and reliable operation across an extended temperature range.

Designed for applications that demand instant-on behavior, flexible I/O interfaces and field updates, this device combines system-level features such as multiple PLLs, configurable I/O standards and on-chip memory to simplify design integration and reduce external BOM.

Key Features

• Logic Capacity — 15,000 logic elements to implement mid-density logic functions and system glue logic.
• Embedded Memory — Approximately 0.33 Mbits of embedded block RAM plus family-level distributed RAM resources for FIFOs, buffering and local storage.
• I/O and Package — 188 user I/Os delivered in a 256-ball fpBGA (17 × 17 mm) surface-mount package for dense board-level connectivity.
• Voltage and Temperature — Core supply range 1.14 V to 1.26 V and industrial operating temperature from −40 °C to 100 °C.
• Non-Volatile, Instant-On — Family-level non-volatile architecture enables instant-on operation without external configuration memory.
• In-Field Reconfiguration — Supports TransFR reconfiguration for in-system logic updates and JTAG/system configuration programming.
• Power Management — Sleep mode for significant static current reduction as a system-level power control option.
• Clocking — Up to four analog PLLs per device for flexible clock multiply/divide and phase shifting (family-level capability).
• Flexible I/O Standards — Programmable I/O buffer support for a wide range of standards, including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI, LVDS, Bus‑LVDS, LVPECL and RSDS (family-level capability).
• System Features — IEEE 1149.1 boundary-scan and internal logic analysis support for board-level test and debug (family-level capability).
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Industrial Control & Automation — Industrial-grade temperature rating (−40 °C to 100 °C) and 188 I/Os enable robust sensor interfacing, motor control logic and real-time I/O aggregation.
• Communications and Networking — High I/O count, on-chip memory and PLLs support interface buffering, protocol bridging and DDR memory interfaces at the system level.
• Instrumentation & Test — Reconfigurable logic and onboard memory support custom data acquisition, preprocessing and test logic with fast in-field updates.
• Embedded System Glue Logic — Instant-on non-volatile behavior and dense I/O make it useful for control-plane logic, protocol adaptation and peripheral aggregation.

Unique Advantages

• Instant-on non-volatile architecture: Eliminates the need for external configuration memory and enables fast power-up behavior.
• Field reprogrammability: TransFR reconfiguration and JTAG/system configuration support allow in-field updates and quick feature revisions without hardware changes.
• High I/O density in a compact package: 188 I/Os in a 256-ball fpBGA provide board space savings while supporting complex I/O requirements.
• Industrial robustness: Specified operation from −40 °C to 100 °C and RoHS compliance address industrial environmental and regulatory needs.
• Integrated timing resources: Multiple PLLs provide flexible clocking and timing management for mixed-rate interfaces and memory subsystems.

Why Choose LFXP15E-3FN256I?

The LFXP15E-3FN256I balances mid-range logic capacity, on‑chip memory and dense I/O in a compact, industrial-grade fpBGA package. Its non‑volatile, instantly reconfigurable family architecture and support for flexible I/O standards simplify system design by reducing external components and enabling rapid, in-field updates. This device is well suited to engineers building embedded control systems, communications interfaces and instrumentation where reliability, configurability and compact board footprint matter.

With family-level system features such as multiple PLLs, boundary-scan and internal logic analysis capabilities, the LFXP15E-3FN256I offers a practical platform for scalable designs that require long-term maintainability and field-upgrade capability.

Request a quote or submit an inquiry to receive pricing, availability and order support for LFXP15E-3FN256I.