LFXP15C-5FN484C

IC FPGA 300 I/O 484FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA

Quantity 210 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O300Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15C-5FN484C – XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA

The LFXP15C-5FN484C is a non-volatile LatticeXP family FPGA delivering 15,000 logic elements and approximately 0.33 Mbits of on-chip RAM in a 484-ball BGA footprint. It provides up to 300 user I/Os and flexible voltage operation from 1.71 V to 3.465 V, targeting designs that require reconfigurable logic, embedded memory, and a high-density I/O interface.

Built on Lattice's ispXP technology, the device supports instant-on behavior and in-field reconfiguration while offering system-level capabilities such as PLLs, dedicated DDR interface support and programmable I/O buffering.

Key Features

  • Core Logic 15,000 logic elements organized across 1,932 logic blocks to implement mid-density FPGA designs.
  • Embedded Memory Approximately 0.33 Mbits of total on-chip RAM for block and distributed memory requirements.
  • I/O Capacity & Package Up to 300 I/Os in a 484-ball BGA (484-FPBGA, 23×23 mm) surface-mount package to support dense signal routing.
  • Non-Volatile, Instant-On Architecture ispXP non-volatile technology enables instant-on operation without external configuration memory and supports secure configuration storage.
  • In-Field Reconfiguration TransFR™ reconfiguration enables updating SRAM-based logic while the system is running; SRAM and non-volatile memory are programmable through system configuration and JTAG ports.
  • Low-Power Modes Sleep mode capability can reduce static current by up to 1000× for power-sensitive applications.
  • Flexible I/O Standards Programmable sysIO buffers support a wide range of interfaces listed in the family data (for example: multiple LVCMOS voltage levels, LVDS, PCI, SSTL, HSTL and LVPECL variants).
  • Memory Interface & Clocking Dedicated DDR memory support (up to DDR333/166 MHz) and up to four analog sysCLOCK™ PLLs for clock multiply/divide and phase shifting.
  • System-Level Support IEEE 1149.1 boundary-scan, ispTRACY™ internal logic analyzer capability, and an onboard configuration oscillator for system debug and bring-up.
  • Electrical & Environmental Supply voltage range of 1.71 V to 3.465 V, commercial operating temperature range of 0 °C to 85 °C, surface-mount package, and RoHS compliant.

Typical Applications

  • Memory Interface Controllers — Implement DDR interfaces using the device's dedicated DDR support and PLL resources to manage timing and data paths.
  • High‑Density I/O Bridging — Use the 300 I/Os and programmable sysIO buffers to bridge between heterogeneous interfaces and I/O standards.
  • Embedded Logic & Control — Deploy the 15,000 logic elements and on-chip RAM for custom control, sequencing, and protocol handling in embedded systems.

Unique Advantages

  • Non‑volatile instant-on operation: Eliminates the need for external configuration memory for faster system start-up and simplified BOM.
  • Field reconfiguration capability: TransFR™ enables in-system updates to SRAM-based logic without taking the system offline.
  • Power-efficient standby: Sleep mode provides dramatic static current reduction for energy-conscious designs.
  • Flexible, high‑speed I/O support: Programmable sysIO accommodates multiple signaling standards, reducing the need for external level translators.
  • Integrated clocking and DDR support: Up to four analog PLLs and dedicated DDR interface support simplify timing and memory interface design.
  • Compact, high‑I/O package: 484-ball BGA delivers high pin count in a 23×23 mm footprint for dense board layouts.

Why Choose LFXP15C-5FN484C?

The LFXP15C-5FN484C pairs a mid-density logic fabric (15,000 logic elements) with substantial embedded memory and a large I/O complement in a compact 484-ball BGA package. Its non-volatile ispXP architecture provides instant-on capability and secure configuration storage, while TransFR reconfiguration and sleep mode add flexibility for in-field updates and low-power operation.

This device is well suited for designers seeking a reconfigurable, integrated solution for memory interfaces, protocol bridging, and embedded control tasks—backed by family-level features such as programmable I/O buffers, multiple PLLs, boundary-scan and onboard configuration resources.

Request a quote or submit an inquiry to receive pricing and availability for LFXP15C-5FN484C, or to discuss how this FPGA can be integrated into your next design.

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