LFXP15C-5FN484C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA |
|---|---|
| Quantity | 210 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 300 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1932 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 331776 |
Overview of LFXP15C-5FN484C – XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA
The LFXP15C-5FN484C is a non-volatile LatticeXP family FPGA delivering 15,000 logic elements and approximately 0.33 Mbits of on-chip RAM in a 484-ball BGA footprint. It provides up to 300 user I/Os and flexible voltage operation from 1.71 V to 3.465 V, targeting designs that require reconfigurable logic, embedded memory, and a high-density I/O interface.
Built on Lattice's ispXP technology, the device supports instant-on behavior and in-field reconfiguration while offering system-level capabilities such as PLLs, dedicated DDR interface support and programmable I/O buffering.
Key Features
- Core Logic 15,000 logic elements organized across 1,932 logic blocks to implement mid-density FPGA designs.
- Embedded Memory Approximately 0.33 Mbits of total on-chip RAM for block and distributed memory requirements.
- I/O Capacity & Package Up to 300 I/Os in a 484-ball BGA (484-FPBGA, 23×23 mm) surface-mount package to support dense signal routing.
- Non-Volatile, Instant-On Architecture ispXP non-volatile technology enables instant-on operation without external configuration memory and supports secure configuration storage.
- In-Field Reconfiguration TransFR™ reconfiguration enables updating SRAM-based logic while the system is running; SRAM and non-volatile memory are programmable through system configuration and JTAG ports.
- Low-Power Modes Sleep mode capability can reduce static current by up to 1000× for power-sensitive applications.
- Flexible I/O Standards Programmable sysIO buffers support a wide range of interfaces listed in the family data (for example: multiple LVCMOS voltage levels, LVDS, PCI, SSTL, HSTL and LVPECL variants).
- Memory Interface & Clocking Dedicated DDR memory support (up to DDR333/166 MHz) and up to four analog sysCLOCK™ PLLs for clock multiply/divide and phase shifting.
- System-Level Support IEEE 1149.1 boundary-scan, ispTRACY™ internal logic analyzer capability, and an onboard configuration oscillator for system debug and bring-up.
- Electrical & Environmental Supply voltage range of 1.71 V to 3.465 V, commercial operating temperature range of 0 °C to 85 °C, surface-mount package, and RoHS compliant.
Typical Applications
- Memory Interface Controllers — Implement DDR interfaces using the device's dedicated DDR support and PLL resources to manage timing and data paths.
- High‑Density I/O Bridging — Use the 300 I/Os and programmable sysIO buffers to bridge between heterogeneous interfaces and I/O standards.
- Embedded Logic & Control — Deploy the 15,000 logic elements and on-chip RAM for custom control, sequencing, and protocol handling in embedded systems.
Unique Advantages
- Non‑volatile instant-on operation: Eliminates the need for external configuration memory for faster system start-up and simplified BOM.
- Field reconfiguration capability: TransFR™ enables in-system updates to SRAM-based logic without taking the system offline.
- Power-efficient standby: Sleep mode provides dramatic static current reduction for energy-conscious designs.
- Flexible, high‑speed I/O support: Programmable sysIO accommodates multiple signaling standards, reducing the need for external level translators.
- Integrated clocking and DDR support: Up to four analog PLLs and dedicated DDR interface support simplify timing and memory interface design.
- Compact, high‑I/O package: 484-ball BGA delivers high pin count in a 23×23 mm footprint for dense board layouts.
Why Choose LFXP15C-5FN484C?
The LFXP15C-5FN484C pairs a mid-density logic fabric (15,000 logic elements) with substantial embedded memory and a large I/O complement in a compact 484-ball BGA package. Its non-volatile ispXP architecture provides instant-on capability and secure configuration storage, while TransFR reconfiguration and sleep mode add flexibility for in-field updates and low-power operation.
This device is well suited for designers seeking a reconfigurable, integrated solution for memory interfaces, protocol bridging, and embedded control tasks—backed by family-level features such as programmable I/O buffers, multiple PLLs, boundary-scan and onboard configuration resources.
Request a quote or submit an inquiry to receive pricing and availability for LFXP15C-5FN484C, or to discuss how this FPGA can be integrated into your next design.