LFXP15C-5FN388C

IC FPGA 268 I/O 388FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 268 331776 15000 388-BBGA

Quantity 1,055 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package388-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case388-BBGANumber of I/O268Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15C-5FN388C – XP Field Programmable Gate Array (FPGA) IC 268 331776 15000 388-BBGA

The LFXP15C-5FN388C is a commercial-grade FPGA from the LatticeXP family designed for mid-density logic integration and multi‑I/O system designs. It combines approximately 15,000 logic elements with on-chip embedded memory and flexible I/O support to address data communications, embedded control and memory‑interface tasks.

This device provides instant-on non‑volatile configuration and system-level features such as reconfiguration and low‑power sleep modes. Its 388‑ball BGA package with 268 I/Os and a wide supply voltage range make it suitable for compact, board‑level implementations requiring significant I/O and moderate built‑in memory.

Key Features

  • Logic Capacity  Approximately 15,000 logic elements for implementing combinational and sequential logic functions.
  • Embedded Memory  Approximately 0.33 Mbits of on-chip RAM (331,776 total bits) supporting block and distributed memory architectures.
  • Extensive I/O  Up to 268 user I/Os in a 388‑ball BGA package to support dense board-level connectivity.
  • Non‑volatile, Instant‑On Configuration  Built-in non‑volatile configuration eliminates the need for external configuration memory and enables rapid power‑up.
  • In-field Reconfiguration and Sleep Mode  Supports TransFR reconfiguration for in‑field logic updates and a sleep mode that significantly reduces static current.
  • Flexible I/O Standards  Programmable I/O buffers support multiple standards including LVCMOS (1.2–3.3 V), LVTTL, SSTL, HSTL and high‑speed differential interfaces such as LVDS and LVPECL (as supported by the LatticeXP family).
  • Dedicated DDR Support and PLLs  Device family capability includes dedicated DDR memory interface support (up to DDR333) and up to four analog PLLs for clock management.
  • Power and Mechanical  Surface‑mount 388‑BBGA package (388‑FPBGA, 23 × 23 mm), RoHS compliant; supply voltage range 1.71 V to 3.465 V; commercial temperature rating 0 °C to 85 °C.

Typical Applications

  • Data communications and networking: Use the high I/O count and flexible I/O standards to implement interface bridging, protocol adaptors and packet buffering.
  • Embedded control and system glue logic: Consolidate control functions, state machines and peripheral interfaces within a single FPGA to reduce BOM and board complexity.
  • Memory interface and buffering: Leverage on‑chip memory and dedicated DDR support to implement memory controllers, FIFOs and data buffering for mid‑range systems.
  • High‑speed parallel and differential interfaces: Implement LVDS, LVPECL and other differential signaling interfaces for video, sensor arrays or high‑speed data paths.

Unique Advantages

  • Instant‑on, non‑volatile architecture: Eliminates external configuration memory and enables rapid system start-up while protecting design bitstreams.
  • In‑field reconfiguration capability: TransFR reconfiguration allows logic updates while the system is operating, enabling feature upgrades without hardware replacement.
  • Broad I/O flexibility: A wide set of supported I/O standards and a large number of I/Os (268) simplify interfacing to diverse peripherals and memory devices.
  • Integrated memory and clocking resources: Approximately 0.33 Mbits of embedded RAM plus up to four PLLs support complex timing and buffering needs without added components.
  • Compact, manufacturable package: 388‑ball BGA in a 23 × 23 mm footprint provides high I/O density in a board‑level friendly, surface‑mount form factor.
  • RoHS compliant commercial device: Meets environmental compliance requirements for mainstream commercial and enterprise products.

Why Choose LFXP15C-5FN388C?

The LFXP15C-5FN388C positions itself as a versatile mid‑density FPGA option that balances logic capacity, on‑chip memory and a high I/O count in a compact BGA package. Its non‑volatile instant‑on architecture and in‑field reconfiguration capabilities provide design flexibility for applications that require rapid start-up and the ability to update logic in the field.

This device is well suited to engineers building commercial systems that need consolidated logic, robust I/O connectivity and embedded memory without external configuration components. Its combination of supply voltage flexibility, PLLs and memory resources supports a wide range of board‑level designs where maintainability and compact integration are priorities.

If you would like pricing, lead‑time information or to submit a quote request for the LFXP15C-5FN388C, please request a formal quote or submit an RFQ through your preferred procurement channel.

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