LFXP15C-5FN388C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 268 331776 15000 388-BBGA |
|---|---|
| Quantity | 1,055 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 388-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 388-BBGA | Number of I/O | 268 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1932 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 331776 |
Overview of LFXP15C-5FN388C – XP Field Programmable Gate Array (FPGA) IC 268 331776 15000 388-BBGA
The LFXP15C-5FN388C is a commercial-grade FPGA from the LatticeXP family designed for mid-density logic integration and multi‑I/O system designs. It combines approximately 15,000 logic elements with on-chip embedded memory and flexible I/O support to address data communications, embedded control and memory‑interface tasks.
This device provides instant-on non‑volatile configuration and system-level features such as reconfiguration and low‑power sleep modes. Its 388‑ball BGA package with 268 I/Os and a wide supply voltage range make it suitable for compact, board‑level implementations requiring significant I/O and moderate built‑in memory.
Key Features
- Logic Capacity Approximately 15,000 logic elements for implementing combinational and sequential logic functions.
- Embedded Memory Approximately 0.33 Mbits of on-chip RAM (331,776 total bits) supporting block and distributed memory architectures.
- Extensive I/O Up to 268 user I/Os in a 388‑ball BGA package to support dense board-level connectivity.
- Non‑volatile, Instant‑On Configuration Built-in non‑volatile configuration eliminates the need for external configuration memory and enables rapid power‑up.
- In-field Reconfiguration and Sleep Mode Supports TransFR reconfiguration for in‑field logic updates and a sleep mode that significantly reduces static current.
- Flexible I/O Standards Programmable I/O buffers support multiple standards including LVCMOS (1.2–3.3 V), LVTTL, SSTL, HSTL and high‑speed differential interfaces such as LVDS and LVPECL (as supported by the LatticeXP family).
- Dedicated DDR Support and PLLs Device family capability includes dedicated DDR memory interface support (up to DDR333) and up to four analog PLLs for clock management.
- Power and Mechanical Surface‑mount 388‑BBGA package (388‑FPBGA, 23 × 23 mm), RoHS compliant; supply voltage range 1.71 V to 3.465 V; commercial temperature rating 0 °C to 85 °C.
Typical Applications
- Data communications and networking: Use the high I/O count and flexible I/O standards to implement interface bridging, protocol adaptors and packet buffering.
- Embedded control and system glue logic: Consolidate control functions, state machines and peripheral interfaces within a single FPGA to reduce BOM and board complexity.
- Memory interface and buffering: Leverage on‑chip memory and dedicated DDR support to implement memory controllers, FIFOs and data buffering for mid‑range systems.
- High‑speed parallel and differential interfaces: Implement LVDS, LVPECL and other differential signaling interfaces for video, sensor arrays or high‑speed data paths.
Unique Advantages
- Instant‑on, non‑volatile architecture: Eliminates external configuration memory and enables rapid system start-up while protecting design bitstreams.
- In‑field reconfiguration capability: TransFR reconfiguration allows logic updates while the system is operating, enabling feature upgrades without hardware replacement.
- Broad I/O flexibility: A wide set of supported I/O standards and a large number of I/Os (268) simplify interfacing to diverse peripherals and memory devices.
- Integrated memory and clocking resources: Approximately 0.33 Mbits of embedded RAM plus up to four PLLs support complex timing and buffering needs without added components.
- Compact, manufacturable package: 388‑ball BGA in a 23 × 23 mm footprint provides high I/O density in a board‑level friendly, surface‑mount form factor.
- RoHS compliant commercial device: Meets environmental compliance requirements for mainstream commercial and enterprise products.
Why Choose LFXP15C-5FN388C?
The LFXP15C-5FN388C positions itself as a versatile mid‑density FPGA option that balances logic capacity, on‑chip memory and a high I/O count in a compact BGA package. Its non‑volatile instant‑on architecture and in‑field reconfiguration capabilities provide design flexibility for applications that require rapid start-up and the ability to update logic in the field.
This device is well suited to engineers building commercial systems that need consolidated logic, robust I/O connectivity and embedded memory without external configuration components. Its combination of supply voltage flexibility, PLLs and memory resources supports a wide range of board‑level designs where maintainability and compact integration are priorities.
If you would like pricing, lead‑time information or to submit a quote request for the LFXP15C-5FN388C, please request a formal quote or submit an RFQ through your preferred procurement channel.

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