LFXP15E-3F484I
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA |
|---|---|
| Quantity | 924 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 300 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1932 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 331776 |
Overview of LFXP15E-3F484I – XP Field Programmable Gate Array, 15k logic elements, 300 I/O, 484-BBGA
The LFXP15E-3F484I is a non-volatile, infinitely reconfigurable FPGA from the LatticeXP family, designed for industrial-grade embedded and system-level applications. It integrates approximately 15,000 logic elements with substantial on-chip memory and a high I/O count to support complex interface, control and signal-processing tasks.
This device delivers instant-on capability and flexible system-level features while operating over a 1.14–1.26 V core supply and an industrial temperature range of -40 °C to 100 °C. The 484-ball BBGA (23 × 23 mm) package and surface-mount mounting support compact, high-density board designs.
Key Features
- Core Logic Approximately 15,000 logic elements provide a scalable fabric for mid-density FPGA designs.
- Embedded Memory 331,776 bits of on-chip RAM (approximately 0.332 Mbits) for embedded and distributed memory needs.
- I/O Density & Package 300 user I/Os in a 484-BBGA package (supplier package: 484-FPBGA, 23 × 23 mm) supporting high pin-count interfaces in a compact footprint.
- Supply & Thermal Core supply range 1.14 V to 1.26 V and industrial operating temperature from -40 °C to 100 °C for robust deployment in demanding environments.
- Non-volatile, Instant-On Architecture LatticeXP family technology provides non-volatile configuration with instant-on behavior and no external configuration memory required.
- Reconfiguration & Power Management Support for in-field reconfiguration and a sleep mode that enables substantial static current reduction for low-power operation.
- System-Level Support On-chip PLLs, boundary-scan (IEEE 1149.1) and internal debugging capabilities are part of the LatticeXP feature set to ease integration and validation.
Typical Applications
- Industrial Control & Automation High I/O count, industrial temperature rating and robust packaging make the device well-suited for motor control, PLCs and factory automation logic.
- Embedded Communication Systems Flexible I/O and on-chip memory support protocol bridging, packet processing and interface adaptation in communication equipment.
- Consumer & Professional Video/Signal Processing Reconfigurable logic and embedded RAM enable processing pipelines, buffering and custom I/O for video and signal applications.
- Test, Measurement & Instrumentation Instant-on capability and system-level features support deterministic startup and in-field updates for measurement electronics.
Unique Advantages
- Non-volatile Instant-On: Start-up without external configuration memory enables faster boot and simplified power-on sequences.
- High I/O Count in Compact Package: 300 I/Os in a 484-BBGA (23 × 23 mm) package reduce board-level routing complexity for dense interfaces.
- Integrated Memory Resources: Over 300 Kbits of on-chip RAM (331,776 bits) supports embedded buffering and data storage without external components.
- Industrial Reliability: Specified for -40 °C to 100 °C operation and industrial grade, suitable for deployment in harsh environments.
- Low-Voltage Core Operation: 1.14–1.26 V core supply helps align with modern low-voltage system architectures.
- System-Level Instrumentation: Built-in PLLs and boundary-scan support simplify timing management and board-level testing.
Why Choose LFXP15E-3F484I?
The LFXP15E-3F484I balances mid-range logic capacity with substantial on-chip memory and a high I/O count, offering a compact, industrial-grade solution for embedded controllers, communications equipment and signal-processing applications. Its non-volatile architecture, instant-on behavior and system-level features reduce BOM and simplify system integration while supporting in-field updates and low-power modes.
This device is targeted at designers who need a reconfigurable, reliable FPGA platform that fits into space-constrained boards and operates across industrial temperature ranges, providing long-term scalability within the LatticeXP family architecture.
Request a quote or submit an inquiry to check availability and begin the procurement process for the LFXP15E-3F484I.

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