LFXP15E-3F484I

IC FPGA 300 I/O 484FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA

Quantity 924 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O300Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15E-3F484I – XP Field Programmable Gate Array, 15k logic elements, 300 I/O, 484-BBGA

The LFXP15E-3F484I is a non-volatile, infinitely reconfigurable FPGA from the LatticeXP family, designed for industrial-grade embedded and system-level applications. It integrates approximately 15,000 logic elements with substantial on-chip memory and a high I/O count to support complex interface, control and signal-processing tasks.

This device delivers instant-on capability and flexible system-level features while operating over a 1.14–1.26 V core supply and an industrial temperature range of -40 °C to 100 °C. The 484-ball BBGA (23 × 23 mm) package and surface-mount mounting support compact, high-density board designs.

Key Features

  • Core Logic Approximately 15,000 logic elements provide a scalable fabric for mid-density FPGA designs.
  • Embedded Memory 331,776 bits of on-chip RAM (approximately 0.332 Mbits) for embedded and distributed memory needs.
  • I/O Density & Package 300 user I/Os in a 484-BBGA package (supplier package: 484-FPBGA, 23 × 23 mm) supporting high pin-count interfaces in a compact footprint.
  • Supply & Thermal Core supply range 1.14 V to 1.26 V and industrial operating temperature from -40 °C to 100 °C for robust deployment in demanding environments.
  • Non-volatile, Instant-On Architecture LatticeXP family technology provides non-volatile configuration with instant-on behavior and no external configuration memory required.
  • Reconfiguration & Power Management Support for in-field reconfiguration and a sleep mode that enables substantial static current reduction for low-power operation.
  • System-Level Support On-chip PLLs, boundary-scan (IEEE 1149.1) and internal debugging capabilities are part of the LatticeXP feature set to ease integration and validation.

Typical Applications

  • Industrial Control & Automation High I/O count, industrial temperature rating and robust packaging make the device well-suited for motor control, PLCs and factory automation logic.
  • Embedded Communication Systems Flexible I/O and on-chip memory support protocol bridging, packet processing and interface adaptation in communication equipment.
  • Consumer & Professional Video/Signal Processing Reconfigurable logic and embedded RAM enable processing pipelines, buffering and custom I/O for video and signal applications.
  • Test, Measurement & Instrumentation Instant-on capability and system-level features support deterministic startup and in-field updates for measurement electronics.

Unique Advantages

  • Non-volatile Instant-On: Start-up without external configuration memory enables faster boot and simplified power-on sequences.
  • High I/O Count in Compact Package: 300 I/Os in a 484-BBGA (23 × 23 mm) package reduce board-level routing complexity for dense interfaces.
  • Integrated Memory Resources: Over 300 Kbits of on-chip RAM (331,776 bits) supports embedded buffering and data storage without external components.
  • Industrial Reliability: Specified for -40 °C to 100 °C operation and industrial grade, suitable for deployment in harsh environments.
  • Low-Voltage Core Operation: 1.14–1.26 V core supply helps align with modern low-voltage system architectures.
  • System-Level Instrumentation: Built-in PLLs and boundary-scan support simplify timing management and board-level testing.

Why Choose LFXP15E-3F484I?

The LFXP15E-3F484I balances mid-range logic capacity with substantial on-chip memory and a high I/O count, offering a compact, industrial-grade solution for embedded controllers, communications equipment and signal-processing applications. Its non-volatile architecture, instant-on behavior and system-level features reduce BOM and simplify system integration while supporting in-field updates and low-power modes.

This device is targeted at designers who need a reconfigurable, reliable FPGA platform that fits into space-constrained boards and operates across industrial temperature ranges, providing long-term scalability within the LatticeXP family architecture.

Request a quote or submit an inquiry to check availability and begin the procurement process for the LFXP15E-3F484I.

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