LFXP15E-3F484C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA |
|---|---|
| Quantity | 296 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 300 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1932 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 331776 |
Overview of LFXP15E-3F484C – XP Field Programmable Gate Array (FPGA) IC, 15K Logic, 300 I/Os, 484-BBGA
The LFXP15E-3F484C is a LatticeXP-series field programmable gate array (FPGA) packaged in a 484-ball BBGA (23 × 23 mm) surface-mount package. It delivers 15,000 logic elements, 300 user I/Os and on-chip RAM, combining non-volatile instant-on operation with reconfigurable SRAM-based logic for flexible commercial embedded designs.
Designed for commercial applications that require compact, reconfigurable logic and rich I/O capability, this device targets embedded systems, communications and consumer applications that benefit from fast start-up, in-field reconfiguration and a compact BGA footprint.
Key Features
- Non-volatile, instant-on architecture – Built on the LatticeXP family technology for instant-on operation and reconfiguration without external configuration memory.
- Reconfiguration and power modes – Supports in-field reconfiguration and a sleep mode that yields significant static current reduction for low-power states.
- Logic capacity – 15,000 logic elements to implement medium-density logic and control functions.
- On-chip memory – 331,776 bits of total RAM (approximately 0.332 Mbits) to support embedded storage and buffering needs.
- I/O and interface flexibility – Up to 300 user I/Os with programmable I/O buffers supporting a wide range of standards (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and others as supported by the LatticeXP family).
- Clocking – Up to four analog PLLs per device to implement clock multiply/divide and phase shifting.
- Power and package – Low-voltage core operation with supply range specified at 1.14 V to 1.26 V, commercial operating range 0 °C to 85 °C, and 484-ball FBGA surface-mount package (23 × 23 mm).
- Standards and compliance – RoHS compliant for lead-free manufacturing requirements.
Typical Applications
- Commercial embedded systems – Implement custom control, signal processing and glue-logic functions where fast boot and reconfiguration are required.
- Communications equipment – Protocol bridging, I/O aggregation and timing functions leveraging multiple PLLs and flexible I/O standards.
- Consumer electronics – User-interface control, media handling and peripheral interfacing that benefit from a compact BGA package and integrated RAM.
- Test and measurement – Custom data handling, capture and preprocessing using on-chip RAM and distributed logic resources.
Unique Advantages
- Instant-on, non-volatile operation: Eliminates the need for external configuration memory and enables immediate start-up after power-up.
- Compact, high-I/O package: 484-ball BGA (23 × 23 mm) provides up to 300 user I/Os in a compact surface-mount footprint for dense board designs.
- Integrated memory resources: 331,776 bits of on-chip RAM reduce external memory dependency for buffering and embedded data storage.
- Flexible interface support: Programmable I/O buffers support a broad set of signaling standards, simplifying integration with diverse peripherals and buses.
- Low-voltage core support: Narrow core supply range (1.14 V to 1.26 V) suited to power-optimized designs.
- Design ecosystem: LatticeXP family tooling and IP support (as provided for the series) facilitates implementation and migration across densities.
Why Choose LFXP15E-3F484C?
The LFXP15E-3F484C combines 15,000 logic elements, approximately 0.332 Mbits of on-chip RAM and up to 300 I/Os in a compact 484-BBGA package, providing a balanced platform for commercial embedded and communications designs that require rapid startup and field reconfigurability. Its non-volatile architecture and programmable I/O flexibility make it well suited for applications that need a reconfigurable, space-efficient solution without external configuration memory.
Backed by the LatticeXP family design support and pre-designed IP options available for the series, this device offers a practical migration path within the family and accelerates time-to-market for projects that rely on a proven FPGA architecture.
Request a quote or contact sales to discuss availability, pricing and how the LFXP15E-3F484C can fit your next commercial embedded design.