LFXP15E-3F484C

IC FPGA 300 I/O 484FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 300 331776 15000 484-BBGA

Quantity 296 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O300Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15E-3F484C – XP Field Programmable Gate Array (FPGA) IC, 15K Logic, 300 I/Os, 484-BBGA

The LFXP15E-3F484C is a LatticeXP-series field programmable gate array (FPGA) packaged in a 484-ball BBGA (23 × 23 mm) surface-mount package. It delivers 15,000 logic elements, 300 user I/Os and on-chip RAM, combining non-volatile instant-on operation with reconfigurable SRAM-based logic for flexible commercial embedded designs.

Designed for commercial applications that require compact, reconfigurable logic and rich I/O capability, this device targets embedded systems, communications and consumer applications that benefit from fast start-up, in-field reconfiguration and a compact BGA footprint.

Key Features

  • Non-volatile, instant-on architecture – Built on the LatticeXP family technology for instant-on operation and reconfiguration without external configuration memory.
  • Reconfiguration and power modes – Supports in-field reconfiguration and a sleep mode that yields significant static current reduction for low-power states.
  • Logic capacity – 15,000 logic elements to implement medium-density logic and control functions.
  • On-chip memory – 331,776 bits of total RAM (approximately 0.332 Mbits) to support embedded storage and buffering needs.
  • I/O and interface flexibility – Up to 300 user I/Os with programmable I/O buffers supporting a wide range of standards (LVCMOS, LVTTL, SSTL, HSTL, PCI, LVDS and others as supported by the LatticeXP family).
  • Clocking – Up to four analog PLLs per device to implement clock multiply/divide and phase shifting.
  • Power and package – Low-voltage core operation with supply range specified at 1.14 V to 1.26 V, commercial operating range 0 °C to 85 °C, and 484-ball FBGA surface-mount package (23 × 23 mm).
  • Standards and compliance – RoHS compliant for lead-free manufacturing requirements.

Typical Applications

  • Commercial embedded systems – Implement custom control, signal processing and glue-logic functions where fast boot and reconfiguration are required.
  • Communications equipment – Protocol bridging, I/O aggregation and timing functions leveraging multiple PLLs and flexible I/O standards.
  • Consumer electronics – User-interface control, media handling and peripheral interfacing that benefit from a compact BGA package and integrated RAM.
  • Test and measurement – Custom data handling, capture and preprocessing using on-chip RAM and distributed logic resources.

Unique Advantages

  • Instant-on, non-volatile operation: Eliminates the need for external configuration memory and enables immediate start-up after power-up.
  • Compact, high-I/O package: 484-ball BGA (23 × 23 mm) provides up to 300 user I/Os in a compact surface-mount footprint for dense board designs.
  • Integrated memory resources: 331,776 bits of on-chip RAM reduce external memory dependency for buffering and embedded data storage.
  • Flexible interface support: Programmable I/O buffers support a broad set of signaling standards, simplifying integration with diverse peripherals and buses.
  • Low-voltage core support: Narrow core supply range (1.14 V to 1.26 V) suited to power-optimized designs.
  • Design ecosystem: LatticeXP family tooling and IP support (as provided for the series) facilitates implementation and migration across densities.

Why Choose LFXP15E-3F484C?

The LFXP15E-3F484C combines 15,000 logic elements, approximately 0.332 Mbits of on-chip RAM and up to 300 I/Os in a compact 484-BBGA package, providing a balanced platform for commercial embedded and communications designs that require rapid startup and field reconfigurability. Its non-volatile architecture and programmable I/O flexibility make it well suited for applications that need a reconfigurable, space-efficient solution without external configuration memory.

Backed by the LatticeXP family design support and pre-designed IP options available for the series, this device offers a practical migration path within the family and accelerates time-to-market for projects that rely on a proven FPGA architecture.

Request a quote or contact sales to discuss availability, pricing and how the LFXP15E-3F484C can fit your next commercial embedded design.

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