LFXP15C-5FN256C
| Part Description |
XP Field Programmable Gate Array (FPGA) IC 188 331776 15000 256-BGA |
|---|---|
| Quantity | 297 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Lattice Semiconductor Corporation |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 188 | Voltage | 1.71 V - 3.465 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 1932 | Number of Logic Elements/Cells | 15000 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 331776 |
Overview of LFXP15C-5FN256C – XP Field Programmable Gate Array (FPGA) IC 188 331776 15000 256-BGA
The LFXP15C-5FN256C is a commercial-grade, non-volatile FPGA from the LatticeXP family, offering 15,000 logic elements and approximately 0.33 Mbits of embedded RAM. Designed for applications that require configurable logic, flexible I/O and on-chip memory, this device integrates instant-on non-volatile configuration and in-field reconfiguration capabilities.
This 256-ball fpBGA (17 × 17 mm) packaged device provides up to 188 general-purpose I/Os and a wide supply range (1.71 V to 3.465 V), making it suitable for a variety of commercial embedded and system-level designs.
Key Features
- Logic Capacity — 15,000 logic elements for implementing mid-density digital designs and control functions.
- Embedded Memory — 331,776 bits of on-chip RAM (approximately 0.33 Mbits) to support register files, FIFOs and data buffers.
- I/O and Packaging — 188 I/Os in a 256-ball fpBGA (256-FPBGA, 17 × 17 mm) surface-mount package for dense board-level integration.
- Non‑volatile, Instant-On Architecture — Family-level features include non-volatile configuration with instant-on behavior and no external configuration memory required.
- In-Field Reconfiguration — Support for TransFR™ reconfiguration enables in-field logic updates while the system is operating (family capability).
- Low-Power Modes — Family-level sleep mode can reduce static current consumption significantly (family capability documented in datasheet).
- Flexible sysIO™ Buffer Support — Family I/O buffering supports multiple standards including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, LVDS, SSTL, HSTL, PCI, LVPECL and RSDS (per family datasheet).
- Clocking — Up to four analog PLLs per device for clock multiplication, division and phase shifting (family capability).
- Voltage and Temperature — Operates from 1.71 V to 3.465 V and rated for commercial operating temperature range of 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Communications and Networking — Protocol bridging, packet processing control and interface adaptation using the device’s flexible I/O and on-chip memory.
- Consumer and Embedded Systems — User interface control, peripheral aggregation and glue-logic where instant-on configuration and compact packaging matter.
- Instrumentation and Test Equipment — Custom signal routing, timing control and data buffering leveraging on-chip RAM and PLL-based clocking.
- Industrial Control (Commercial Systems) — Control logic and I/O concentration in commercial-grade automation and control equipment operating within 0 °C to 85 °C.
Unique Advantages
- Non-volatile, instant-on operation: Eliminates the need for external configuration memory and enables immediate availability after power-up.
- Mid-density integration: 15,000 logic elements and ~0.33 Mbits of embedded RAM reduce external component count for many mid-range designs.
- Flexible I/O signaling: Programmable sysIO™ buffering supports a wide set of interface standards, simplifying multi-interface designs.
- In-field update capability: TransFR™ reconfiguration (family feature) allows logic updates without removing the device from the system.
- Scalable board integration: 256-FPBGA (17 × 17 mm) package with 188 I/Os balances density and routability for compact systems.
- Commercial temperature and voltage range: Rated for 0 °C to 85 °C operation and 1.71 V to 3.465 V supplies for typical commercial embedded environments.
Why Choose LFXP15C-5FN256C?
The LFXP15C-5FN256C brings LatticeXP family capabilities—non-volatile configuration, flexible I/O, multiple PLLs and in-field reconfiguration—into a compact 256-ball fpBGA package with 15,000 logic elements and substantial on-chip RAM. Its combination of instant-on behavior, programmable I/O support and mid-range logic/memory resources makes it well suited for commercial embedded systems that require configurable logic and tight board-level integration.
Choose this device for designs that need a balance of integration, reconfiguration flexibility and a commercial-grade operating range, backed by documented family-level features in the LatticeXP datasheet.
Request a quote or submit a pricing and availability inquiry to get started with LFXP15C-5FN256C for your next design.