LFXP15C-5FN256C

IC FPGA 188 I/O 256FBGA
Part Description

XP Field Programmable Gate Array (FPGA) IC 188 331776 15000 256-BGA

Quantity 297 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerLattice Semiconductor Corporation
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package256-FPBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-BGANumber of I/O188Voltage1.71 V - 3.465 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs1932Number of Logic Elements/Cells15000
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits331776

Overview of LFXP15C-5FN256C – XP Field Programmable Gate Array (FPGA) IC 188 331776 15000 256-BGA

The LFXP15C-5FN256C is a commercial-grade, non-volatile FPGA from the LatticeXP family, offering 15,000 logic elements and approximately 0.33 Mbits of embedded RAM. Designed for applications that require configurable logic, flexible I/O and on-chip memory, this device integrates instant-on non-volatile configuration and in-field reconfiguration capabilities.

This 256-ball fpBGA (17 × 17 mm) packaged device provides up to 188 general-purpose I/Os and a wide supply range (1.71 V to 3.465 V), making it suitable for a variety of commercial embedded and system-level designs.

Key Features

  • Logic Capacity — 15,000 logic elements for implementing mid-density digital designs and control functions.
  • Embedded Memory — 331,776 bits of on-chip RAM (approximately 0.33 Mbits) to support register files, FIFOs and data buffers.
  • I/O and Packaging — 188 I/Os in a 256-ball fpBGA (256-FPBGA, 17 × 17 mm) surface-mount package for dense board-level integration.
  • Non‑volatile, Instant-On Architecture — Family-level features include non-volatile configuration with instant-on behavior and no external configuration memory required.
  • In-Field Reconfiguration — Support for TransFR™ reconfiguration enables in-field logic updates while the system is operating (family capability).
  • Low-Power Modes — Family-level sleep mode can reduce static current consumption significantly (family capability documented in datasheet).
  • Flexible sysIO™ Buffer Support — Family I/O buffering supports multiple standards including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, LVDS, SSTL, HSTL, PCI, LVPECL and RSDS (per family datasheet).
  • Clocking — Up to four analog PLLs per device for clock multiplication, division and phase shifting (family capability).
  • Voltage and Temperature — Operates from 1.71 V to 3.465 V and rated for commercial operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Communications and Networking — Protocol bridging, packet processing control and interface adaptation using the device’s flexible I/O and on-chip memory.
  • Consumer and Embedded Systems — User interface control, peripheral aggregation and glue-logic where instant-on configuration and compact packaging matter.
  • Instrumentation and Test Equipment — Custom signal routing, timing control and data buffering leveraging on-chip RAM and PLL-based clocking.
  • Industrial Control (Commercial Systems) — Control logic and I/O concentration in commercial-grade automation and control equipment operating within 0 °C to 85 °C.

Unique Advantages

  • Non-volatile, instant-on operation: Eliminates the need for external configuration memory and enables immediate availability after power-up.
  • Mid-density integration: 15,000 logic elements and ~0.33 Mbits of embedded RAM reduce external component count for many mid-range designs.
  • Flexible I/O signaling: Programmable sysIO™ buffering supports a wide set of interface standards, simplifying multi-interface designs.
  • In-field update capability: TransFR™ reconfiguration (family feature) allows logic updates without removing the device from the system.
  • Scalable board integration: 256-FPBGA (17 × 17 mm) package with 188 I/Os balances density and routability for compact systems.
  • Commercial temperature and voltage range: Rated for 0 °C to 85 °C operation and 1.71 V to 3.465 V supplies for typical commercial embedded environments.

Why Choose LFXP15C-5FN256C?

The LFXP15C-5FN256C brings LatticeXP family capabilities—non-volatile configuration, flexible I/O, multiple PLLs and in-field reconfiguration—into a compact 256-ball fpBGA package with 15,000 logic elements and substantial on-chip RAM. Its combination of instant-on behavior, programmable I/O support and mid-range logic/memory resources makes it well suited for commercial embedded systems that require configurable logic and tight board-level integration.

Choose this device for designs that need a balance of integration, reconfiguration flexibility and a commercial-grade operating range, backed by documented family-level features in the LatticeXP datasheet.

Request a quote or submit a pricing and availability inquiry to get started with LFXP15C-5FN256C for your next design.

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