LFXP15C-4FN388I

The LFXP15C-4FN388I is a Lattice Semiconductor LatticeXP family Field Programmable Gate Array (FPGA) in a 388-ball BBGA package. It combines non-volatile, reconfigurable logic with embedded memory and a high I/O count to support system designs that demand flexible interfacing and in-field reconfiguration.

Targeted at industrial-grade applications, this device delivers 15,000 logic elements, approximately 0.332 Mbits of on-chip RAM, and up to 268 programmable I/Os, enabling dense, high-functionality designs in a compact surface-mount package.

Key Features

• Core Logic  15,000 logic elements provide a mid-range programmable fabric suitable for complex glue logic, protocol bridging, and control functions.
• Embedded Memory  Approximately 0.332 Mbits (331,776 bits) of on-chip RAM for embedded block and distributed memory needs.
• High I/O Count  268 user I/Os support a wide range of external interfaces and system connectivity in one device.
• Non‑volatile, Reconfigurable Architecture  LatticeXP family technology provides non-volatile instant-on behavior, in-field reconfiguration, and system-level configuration options.
• Flexible I/O Standards  Architectural support for a broad set of I/O standards (as implemented in the LatticeXP family) enables interfacing with multiple voltage and signaling families.
• Clocking  Up to four analog PLLs per device for clock multiply, divide and phase-shifting functions as provided by the LatticeXP family architecture.
• Power and Supply  Operates across a broad supply range from 1.71 V to 3.465 V, enabling compatibility with common system voltage rails.
• Package and Mounting  388-ball BGA (388-FPBGA, 23 × 23 mm) surface-mount package for high I/O density in a compact footprint.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Standards and Compliance  RoHS-compliant material set.

Typical Applications

• Industrial Control and Automation  Use the device’s industrial temperature rating and flexible I/O to implement motor control interfaces, sensor aggregation, and machine control logic.
• Memory Interface and Buffering  Employ embedded memory and dedicated DDR support in applications requiring local buffering and memory interfacing.
• High‑I/O Protocol Bridging  Leverage 268 I/Os and flexible I/O standards to implement protocol translation, peripheral aggregation, and custom interface bridges.
• In‑field Upgradable Systems  Non‑volatile instant-on and TransFR reconfiguration features support systems that require firmware updates or live logic changes without external configuration memory.

Unique Advantages

• Integrated Non‑Volatile Architecture: Enables instant-on operation and avoids the need for external configuration memory, simplifying BOM and board design.
• In‑field Reconfiguration: TransFR capability allows logic updates while the system is running, reducing maintenance downtime.
• High I/O Density in a Compact Package: 268 I/Os in a 23 × 23 mm 388‑ball FPBGA provide a dense interface solution for space-constrained designs.
• Wide Supply Voltage Support: 1.71 V to 3.465 V operation enables direct compatibility with a variety of system rails and I/O voltage domains.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployment in harsher operating environments.
• Vendor Ecosystem: Part of the LatticeXP family with documented PLL, memory and I/O capabilities for predictable integration.

Why Choose LFXP15C-4FN388I?

The LFXP15C-4FN388I positions itself as a flexible, industrial-grade FPGA option that balances logic capacity, embedded memory, and high I/O density in a compact surface-mount BBGA package. Its non-volatile LatticeXP architecture provides instant-on behavior and in-field reconfiguration options that reduce system complexity and support field updates without external configuration devices.

This device is well suited for engineers designing industrial control, memory interface, and high-I/O bridging solutions who require a reliable, RoHS-compliant FPGA with a broad supply range and an extended operating temperature window.

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