LFXP15C-4FN256I

The LFXP15C-4FN256I is a non-volatile XP family FPGA offering 15,000 logic elements and approximately 0.332 Mbits of on-chip RAM in a 256-ball fpBGA (17 × 17 mm) package. Designed for industrial-grade systems, it combines instant-on non-volatile configuration, flexible I/O support and embedded block RAM to address a wide range of system-level designs where reconfigurability, compact integration and extended temperature operation are required.

Key Features

• Core Logic  15,000 logic elements (LUT-based architecture) providing programmable logic capacity for mid-range FPGA designs.
• Embedded Memory  Approximately 0.332 Mbits of on-chip RAM (total RAM bits: 331,776) with both block and distributed memory resources for data buffering and state storage.
• Non‑volatile, Instant‑on Architecture  ispXP non-volatile technology enables instant-on behavior with no external configuration memory required and rapid power-up in microseconds.
• Reconfiguration and In‑field Update  Supports TransFR™ reconfiguration for in-field logic updates and reconfigurable SRAM-based logic via system configuration and JTAG ports.
• Power Modes  Sleep mode capability that can reduce static current by up to 1000× for low-power standby operation.
• I/O Density and Package  188 user I/Os in a 256-ball fpBGA (256-FPBGA, 17 × 17 mm) surface-mount package for high pin-count designs in a compact footprint.
• Flexible I/O Standards  Programmable sysIO buffers support a wide range of interfaces, including LVCMOS (3.3/2.5/1.8/1.5/1.2 V), LVTTL, SSTL, HSTL, PCI, LVDS, Bus-LVDS, LVPECL and RSDS.
• Memory Interfaces and Clocking  Dedicated DDR memory support up to DDR333 (166 MHz) and up to four analog sysCLOCK PLLs per device for clock multiplication, division and phase shifting.
• System Diagnostics & Debug  IEEE 1149.1 boundary-scan support and ispTRACY internal logic analyzer capability for board-level test and on-chip debug.
• Industrial Grade  Specified for operation from −40 °C to 100 °C and RoHS compliant; supply voltage range 1.71 V to 3.465 V.

Typical Applications

• Industrial Control  Realize compact, reconfigurable control logic for PLCs, motor drives and factory automation with industrial temperature support and high I/O density.
• Communications & Networking  Implement protocol bridging, packet processing and DDR interface logic using the device’s flexible I/O standards and dedicated DDR memory support.
• Embedded Systems  Replace multi-component glue logic and integrate custom peripherals, leveraging instant-on non-volatile configuration for fast system startup.
• Test & Measurement  Use programmable I/O standards, on-chip memory and internal trace capabilities for data acquisition, signal conditioning and real-time analysis.

Unique Advantages

• Instant-on Non-volatile Operation: Provides immediate startup without external configuration memory, simplifying BOM and boot routines.
• In-field Reconfigurability: TransFR and JTAG-based reconfiguration enable updates and feature changes without hardware replacement.
• Flexible Interface Support: Wide-ranging sysIO buffer standards let a single device interface with diverse signaling families, reducing the need for level translators.
• Compact High‑I/O Package: 188 I/Os in a 256-FPBGA (17 × 17 mm) package balances pin count and board space for dense designs.
• Industrial Temperature Range: Specified −40 °C to 100 °C, enabling deployment in environments that require extended operating temperatures.
• Integrated System Features: Onboard oscillator, multiple PLLs, boundary-scan and internal logic analyzer support streamline system integration and debug.

Why Choose LFXP15C-4FN256I?

The LFXP15C-4FN256I positions itself as a flexible, non-volatile FPGA option for industrial and embedded system designs that need mid-range logic capacity, substantial on-chip memory and broad I/O flexibility in a compact fpBGA package. Its instant-on architecture and in-field reconfiguration capabilities reduce system complexity and enable rapid updates without external configuration storage.

Engineers designing control, communications or measurement systems can leverage the device’s DDR interface support, multiple PLLs and comprehensive I/O standard support to consolidate functionality, lower BOM count and accelerate time-to-market while operating across a wide temperature and voltage range.

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